Patents by Inventor Boon Sen CHAN

Boon Sen CHAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240095899
    Abstract: The present disclosure includes edge defect detection via image analytics. A method includes identifying an image of an edge of a susceptor pocket formed by a susceptor of a substrate processing system. The method further includes predicting, based on the image, whether property values of the edge of the susceptor meet threshold values. The method further includes, responsive to the property values of the edge meeting threshold values, causing performance of a corrective action associated with the susceptor.
    Type: Application
    Filed: September 21, 2022
    Publication date: March 21, 2024
    Inventors: Yash Chhabra, Abyaya Dhar, Joseph Liu, Yi Nung Wu, Boon Sen Chan, Sidda Reddy Kurakula, Chandrasekhar Roy
  • Publication number: 20240087135
    Abstract: A method includes identifying an image of a substrate processing equipment part that forms a plurality of holes. The method further includes determining, by a processing device based on the image, a corresponding neighboring angular distance of each of the plurality of holes and a corresponding area of each of the plurality of holes. The method further includes identifying, by the processing device, a first subset of the plurality of holes that are at least partially clogged based on at least one of the corresponding neighboring angular distance or the corresponding area of each of the plurality of holes. A corrective action associated with the substrate processing equipment part is to be performed based on the first subset of the plurality of holes that are at least partially clogged.
    Type: Application
    Filed: September 9, 2022
    Publication date: March 14, 2024
    Inventors: Yash Chhabra, Abyaya Dhar, Boon Sen Chan, Yenwei Hung, Sidda Reddy Kurakula, Chandrasekhar Roy, Chih Chuan Wang
  • Patent number: 11898245
    Abstract: Methods and apparatus for a baking chamber for processing a chamber component are provided herein. In some embodiments, a baking chamber includes: an enclosure defining a first chamber, wherein the first chamber comprises: a first chamber body having a first floor and first sidewalls that couple the first floor to a first lid of the first chamber body to define a first interior volume; a first support disposed in the first interior volume; a first gas line disposed in the first interior volume proximate the first lid; a first showerhead disposed between the first gas line and the first support; a first exhaust coupled to the first floor; and a first heater disposed in the first interior volume between the first support and the first floor; and wherein the enclosure includes a door configured to facilitate transferring the chamber component into and out of the enclosure.
    Type: Grant
    Filed: February 26, 2021
    Date of Patent: February 13, 2024
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Chien-Min Liao, Chi-Feng Liu, Yi Nung Wu, Hsiu Yang, Yixing Lin, Boon Sen Chan, Siamak Salimian
  • Publication number: 20220275505
    Abstract: Methods and apparatus for a baking chamber for processing a chamber component are provided herein. In some embodiments, a baking chamber includes: an enclosure defining a first chamber, wherein the first chamber comprises: a first chamber body having a first floor and first sidewalls that couple the first floor to a first lid of the first chamber body to define a first interior volume; a first support disposed in the first interior volume; a first gas line disposed in the first interior volume proximate the first lid; a first showerhead disposed between the first gas line and the first support; a first exhaust coupled to the first floor; and a first heater disposed in the first interior volume between the first support and the first floor; and wherein the enclosure includes a door configured to facilitate transferring the chamber component into and out of the enclosure.
    Type: Application
    Filed: February 26, 2021
    Publication date: September 1, 2022
    Inventors: Chien-Min LIAO, Chi-Feng LIU, Yi Nung WU, Hsiu YANG, Yixing LIN, Boon Sen CHAN, Siamak SALIMIAN