Patents by Inventor Boon Soo Lim

Boon Soo Lim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220020705
    Abstract: A semiconductor wafer thinned by a stealth lasing process, and semiconductor dies formed therefrom. After formation of an integrated circuit layer on a semiconductor wafer, the wafer may be thinned by focusing a laser at discrete points in the wafer substrate beneath the surface of the wafer. Upon completion of stealth lasing in one or more planar layers in the substrate, a portion of the substrate may be removed, leaving the wafer thinned to a desired final thickness.
    Type: Application
    Filed: July 20, 2020
    Publication date: January 20, 2022
    Applicant: Western Digital Technologies, Inc.
    Inventors: Chee Keong Loh, Foo You Chow, Ridzuan Hanapi, Boon Soo Lim