Patents by Inventor Boon Teik Tee

Boon Teik Tee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device packaging assembly, lead frame strip and unit lead frame with trenches or grooves for guiding liquefied molding material
    Patent number: 10957633
    Abstract: A unit lead frame includes a periphery structure, a die paddle inside of the periphery structure, a plurality of leads extending between the periphery structure and the die paddle, and trenches or grooves extending from an outer surface of the periphery structure and configured to guide liquefied molding material onto the periphery structure along sidewalls of the trenches or grooves.
    Type: Grant
    Filed: July 9, 2019
    Date of Patent: March 23, 2021
    Assignee: Infineon Technologies AG
    Inventors: Boon Teik Tee, Tiam Sen Ong
  • Semiconductor Device Packaging Assembly, Lead Frame Strip and Unit Lead Frame with Trenches or Grooves for Guiding Liquefied Molding Material
    Publication number: 20190333842
    Abstract: A unit lead frame includes a periphery structure, a die paddle inside of the periphery structure, a plurality of leads extending between the periphery structure and the die paddle, and trenches or grooves extending from an outer surface of the periphery structure and configured to guide liquefied molding material onto the periphery structure along sidewalls of the trenches or grooves.
    Type: Application
    Filed: July 9, 2019
    Publication date: October 31, 2019
    Inventors: Boon Teik Tee, Tiam Sen Ong
  • Semiconductor device packaging assembly, lead frame strip and unit lead frame with molding compound channels
    Patent number: 10438870
    Abstract: A semiconductor device packaging assembly includes a lead frame strip having a plurality of unit lead frames. Each of the unit lead frames includes a periphery structure connected to adjacent ones of the unit lead frames, a die paddle inside of the periphery structure, a plurality of leads extending between the periphery structure and the die paddle, and a molding compound channel in the periphery structure configured to guide liquefied molding material onto the periphery structure.
    Type: Grant
    Filed: April 20, 2017
    Date of Patent: October 8, 2019
    Assignee: Infineon Technologies AG
    Inventors: Boon Teik Tee, Tiam Sen Ong
  • Semiconductor Device Packaging Assembly, Lead Frame Strip and Unit Lead Frame with Molding Compound Channels
    Publication number: 20170221802
    Abstract: A semiconductor device packaging assembly includes a lead frame strip having a plurality of unit lead frames. Each of the unit lead frames includes a periphery structure connected to adjacent ones of the unit lead frames, a die paddle inside of the periphery structure, a plurality of leads extending between the periphery structure and the die paddle, and a molding compound channel in the periphery structure configured to guide liquefied molding material onto the periphery structure.
    Type: Application
    Filed: April 20, 2017
    Publication date: August 3, 2017
    Inventors: Boon Teik Tee, Tiam Sen Ong
  • Lead frame strip with molding compound channels
    Patent number: 9659843
    Abstract: A lead frame strip has a plurality of unit lead frames. Each of the unit lead frames has a periphery structure connecting adjacent ones of the unit lead frames, a die paddle inside of the periphery structure, a plurality of leads connected to the periphery structure and extending towards the die paddle, and a molding compound channel in the periphery structure configured to guide liquefied molding material. The lead frame strip is processed by attaching a semiconductor die to each of the die paddles, electrically connecting each of the semiconductor dies to the leads, and forming a liquefied molding compound on each of the unit lead frames. The liquefied molding compound is formed such that the liquefied molding compound encapsulates the semiconductor dies and flows into the molding compound channels thereby forming molding extensions that extend onto the periphery structures.
    Type: Grant
    Filed: November 5, 2014
    Date of Patent: May 23, 2017
    Assignee: Infineon Technologies AG
    Inventors: Boon Teik Tee, Tiam Sen Ong
  • LEAD FRAME STRIP WITH MOLDING COMPOUND CHANNELS
    Publication number: 20160126163
    Abstract: A lead frame strip has a plurality of unit lead frames. Each of the unit lead frames has a periphery structure connecting adjacent ones of the unit lead frames, a die paddle inside of the periphery structure, a plurality of leads connected to the periphery structure and extending towards the die paddle, and a molding compound channel in the periphery structure configured to guide liquefied molding material. The lead frame strip is processed by attaching a semiconductor die to each of the die paddles, electrically connecting each of the semiconductor dies to the leads, and forming a liquefied molding compound on each of the unit lead frames. The liquefied molding compound is formed such that the liquefied molding compound encapsulates the semiconductor dies and flows into the molding compound channels thereby forming molding extensions that extend onto the periphery structures.
    Type: Application
    Filed: November 5, 2014
    Publication date: May 5, 2016
    Inventors: Boon Teik Tee, Tiam Sen Ong