Abstract: Embodiments of the present disclosure are directed toward a pickhead for solder ball placement on an integrated circuit (IC) package, and associated systems and techniques. The pickhead may include a body having a bottom surface that defines a bottom plane of the pickhead. The pickhead may further include a plurality of cavities in the bottom surface to hold respective solder balls to be placed on the IC package. Individual cavities of the plurality of cavities may be recessed from the bottom surface by different recess amounts to provide different extensions of the solder balls with respect to the bottom plane. Other embodiments may be described and/or claimed.