Patents by Inventor Boqi ZHAN

Boqi ZHAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240222567
    Abstract: A micro light-emitting assembly, a micro light-emitting diode and a display device are provided, the micro light-emitting assembly at least includes: a support structure and a semiconductor layer sequence. The support structure at least includes a bridge arm structure constituted by overlapping multiple dielectric layers with different stress directions, and materials of adjacent dielectric layers are different. The bridge arm is fixed with the semiconductor layer sequence, the multiple dielectric layers with different stress directions are cross stacked to constitute the bridge arm structure, so that stress generated inside of the bridge arm can be offset, and a problem that the bridge arm structure is easy to break is solved.
    Type: Application
    Filed: March 12, 2024
    Publication date: July 4, 2024
    Inventors: Chia-en LEE, Zheng WU, TE-LING HSIA, Boqi ZHAN, Xueping YE
  • Publication number: 20220005794
    Abstract: A micro light-emitting assembly includes a base and at least one micro light-emitting device. The base contains a transitional substrate, a supporting layer disposed on the transitional substrate, and at least one supporting pillar having a bottom portion connected to the supporting layer and a top portion opposite to the bottom portion. The micro light-emitting device is supportively connected to the top portion of the supporting pillar. The micro light-emitting device has a recess-forming surface and a recess extending inwardly from the recess-forming surface to receive the top portion of the supporting pillar. A micro light-emitting device manufactured from the micro light-emitting assembly, and a method for mass transfer of micro light-emitting devices are also disclosed.
    Type: Application
    Filed: September 23, 2021
    Publication date: January 6, 2022
    Inventors: Zheng WU, Boqi ZHAN, Chia-En LEE, Chen-Ke HSU