Patents by Inventor Bor-Jou WEI

Bor-Jou WEI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and structure for dissipating heat away from a resistor having neighboring devices and interconnects
    Patent number: 8848374
    Abstract: A semiconductor structure for dissipating heat away from a resistor having neighboring devices and interconnects. The semiconductor structure includes a semiconductor substrate, a resistor disposed above the semiconductor substrate, and a thermal protection structure disposed above the resistor. The thermal protection structure has a plurality of heat dissipating elements, the heat dissipating elements having one end disposed in thermal conductive contact with the thermal protection structure and the other end in thermal conductive contact with the semiconductor substrate. The thermal protection structure receives the heat generated from the resistor and the heat dissipating elements dissipates the heat to the semiconductor substrate.
    Type: Grant
    Filed: June 30, 2010
    Date of Patent: September 30, 2014
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Jian-Hong Lin, Chin Chuan Peng, Tzu-Li Lee, Bi-Ling Lin, Bor-Jou Wei, Chien Shih Tsai
  • Metal Capping Layer for Interconnect Applications
    Publication number: 20140264872
    Abstract: An integrated circuit structure includes a semiconductor substrate and a dielectric layer over the semiconductor substrate. The integrated circuit structure further includes a conductive wiring in the dielectric layer. The integrated circuit structure also includes a first metallic capping layer over the conductive wiring and a second metallic capping layer over the first metallic capping layer. The second metallic capping layer has a width substantially the same as a width of the first metallic capping layer.
    Type: Application
    Filed: June 11, 2013
    Publication date: September 18, 2014
    Inventors: Yu-Hung Lin, Bor-Jou Wei, Chun-Chang Chen, Yao Hsiang Liang, Yu-Min Chang, Shih-Chi Lin
  • METHOD AND STRUCTURE FOR DISSIPATING HEAT AWAY FROM A RESISTOR HAVING NEIGHBORING DEVICES AND INTERCONNECTS
    Publication number: 20120002375
    Abstract: A semiconductor structure for dissipating heat away from a resistor having neighboring devices and interconnects. The semiconductor structure includes a semiconductor substrate, a resistor disposed above the semiconductor substrate, and a thermal protection structure disposed above the resistor. The thermal protection structure has a plurality of heat dissipating elements, the heat dissipating elements having one end disposed in thermal conductive contact with the thermal protection structure and the other end in thermal conductive contact with the semiconductor substrate. The thermal protection structure receives the heat generated from the resistor and the heat dissipating elements dissipates the heat to the semiconductor substrate.
    Type: Application
    Filed: June 30, 2010
    Publication date: January 5, 2012
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Jian-Hong LIN, Chin Chuan PENG, Tzu-Li LEE, Bi-Ling LIN, Bor-Jou WEI, Chien Shih TSAI