Patents by Inventor Bor Shiun Shih

Bor Shiun Shih has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Leadframe of quad flat non-leaded package
    Patent number: 6424024
    Abstract: A quad flat non-leaded package leadframe for supporting a die in a semiconductor package. The leadframe includes a plurality of packaging unit. Each packaging unit has a plurality of leads around a central region. Each pair of neighboring packaging unit is connected by a dam bar. The connected regions between the dam bar and the leads of each neighboring packaging unit have a thickness smaller than the other regions.
    Type: Grant
    Filed: January 23, 2001
    Date of Patent: July 23, 2002
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Bor Shiun Shih, Yueh-Ying Tsai