Patents by Inventor Bora OH

Bora OH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11950499
    Abstract: A light-emitting device includes a first electrode, a second electrode facing the first electrode, an interlayer disposed between the first electrode and the second electrode and including an emission layer, a first capping layer, and a second capping layer. A refractive index of the first capping layer is greater than a refractive index of the second capping layer, and the first capping layer and the second capping layer are each an organic layer. An electronic apparatus including the light-emitting device is also provided.
    Type: Grant
    Filed: April 26, 2021
    Date of Patent: April 2, 2024
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Bora Lee, Hyomin Ko, Ilsoo Oh
  • Patent number: 10123379
    Abstract: The present invention generally relates to a substrate support for use in a processing chamber. The substrate support has a rectangular body. The rectangular body has a first quadrant, a second quadrant, a third quadrant and a fourth quadrant. A first heating element is disposed in the first quadrant and extending from a center area of the rectangular body. The first heating element has a first segment having a first length and extending from the center area, a second segment having a second length, the second segment extending from the first segment and coupled thereto, a third segment having a third length extending from the second segment and coupled thereto, and a fourth segment having a fourth length coupled to and extending from the third segment to the center area. A second heating element is enclosed by the first heating element and the center area.
    Type: Grant
    Filed: April 25, 2017
    Date of Patent: November 6, 2018
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Robin L. Tiner, Soo Young Choi, Beom Soo Park, Shinichi Kurita, Bora Oh, Gaku Furuta
  • Publication number: 20170231033
    Abstract: The present invention generally relates to a substrate support for use in a processing chamber. The substrate support has a rectangular body. The rectangular body has a first quadrant, a second quadrant, a third quadrant and a fourth quadrant. A first heating element is disposed in the first quadrant and extending from a center area of the rectangular body. The first heating element has a first segment having a first length and extending from the center area, a second segment having a second length, the second segment extending from the first segment and coupled thereto, a third segment having a third length extending from the second segment and coupled thereto, and a fourth segment having a fourth length coupled to and extending from the third segment to the center area. A second heating element is enclosed by the first heating element and the center area.
    Type: Application
    Filed: April 25, 2017
    Publication date: August 10, 2017
    Inventors: Robin L. TINER, Soo Young CHOI, Beom Soo PARK, Shinichi KURITA, Bora OH, Gaku FURUTA
  • Patent number: 9677177
    Abstract: The present invention generally relates to a substrate support for use in a processing chamber. The substrate support is divided into quadrants with each quadrant capable of heating independent of the other quadrants. The independent heating permits the substrate support to provide different heating to either different substrate simultaneously disposed on the substrate support or to different areas of a common substrate. Thus, the substrate heating may be tailored to ensure desired processing of the substrate or substrates occurs.
    Type: Grant
    Filed: October 2, 2014
    Date of Patent: June 13, 2017
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Robin L. Tiner, Soo Young Choi, Beom Soo Park, Shinichi Kurita, Bora Oh, Gaku Furuta
  • Publication number: 20150114948
    Abstract: The present invention generally relates to a substrate support for use in a processing chamber. The substrate support is divided into quadrants with each quadrant capable of heating independent of the other quadrants. The independent heating permits the substrate support to provide different heating to either different substrate simultaneously disposed on the substrate support or to different areas of a common substrate. Thus, the substrate heating may be tailored to ensure desired processing of the substrate or substrates occurs.
    Type: Application
    Filed: October 2, 2014
    Publication date: April 30, 2015
    Inventors: Robin L. TINER, Soo Young CHOI, Beom Soo PARK, Shinichi KURITA, Bora OH, Gaku FURUTA