Patents by Inventor Bora Shin

Bora Shin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11118015
    Abstract: The laminate for manufacturing a flexible substrate according to the present invention is formed by using a polyimide having a high absorbance to a UV laser in an organic sacrificial layer for delaminating a flexible substrate from a carrier substrate. Therefore, it is possible that the laser energy density required in the delaminating process using laser irradiation is reduced and the amount of as generated by the delaminating process is remarkably reduced so that the efficiency of the process, the permeability of the flexible substrate is improved and the reliability of the device is improved.
    Type: Grant
    Filed: January 19, 2018
    Date of Patent: September 14, 2021
    Assignee: LG CHEM, LTD.
    Inventors: Hye Won Jeong, Cheolmin Yun, Kyungjun Kim, Bora Shin
  • Publication number: 20210198426
    Abstract: According to the present invention, damage such as film tearing during a rolling process can be reduced by using, as a substrate for a flexible display, a polyimide film having the thickness of 5-10 ?m, modulus of 3-8 GPa, the absolute value of out-of-plane retardation (Rth) of 200-600 nm, and a strain, at a tensile force of 100 MPa, of 10% or less. In addition, since the polyimide film has low residual stress with respect to inorganic substrates, the occurrence of defects during a TFT process is reduced. As a result, processing reliability for a flexible display can be improved. In addition, the saturated static electricity half-life of the polyimide film is controlled to be 250 seconds or more so as to minimize the voltage loss ratio of saturated static electricity and reduce the current drop during a TFT operation, and, as a result, enables a display having improved luminosity to be provided.
    Type: Application
    Filed: October 15, 2019
    Publication date: July 1, 2021
    Applicant: LG CHEM, LTD.
    Inventors: Cheolmin YUN, Bora SHIN, Danbi CHOI
  • Patent number: 10899886
    Abstract: The present invention provides a polyimide film which, by having a fluorine structure adopted into a rigid polyamide chain structure, exhibits not only superb heat resistance but also enhanced optical properties. Additionally, the polyimide according to the present invention, by having the particular structure, exhibits excellent transparency, heat-resistance, mechanical strength and flexibility, and thus can be utilized in a variety of functions such as an element substrate, display cover substrate, optical film, integrated circuit (IC) package, adhesive film, multi-layered flexible printed circuit (FPC), tape, touch panel, and protective film for optical disks.
    Type: Grant
    Filed: August 11, 2017
    Date of Patent: January 26, 2021
    Assignee: LG CHEM, LTD.
    Inventors: Cheolmin Yun, Bora Shin, Kyungjun Kim, Jun Sik Suh
  • Patent number: 10882957
    Abstract: A method for producing a device substrate by obtaining a laminate comprising a carrier substrate with a first polyimide film disposed on at least one surface of the carrier substrate, a second polyimide film disposed on the first polyimide film, applying a physical stimulus to the second polyimide film without causing chemical changes in the first polyimide film such that the adhesive strength of the first polyimide to the second polyimide film decreases and separating the second polyimide film from the first polyimide film formed on the carrier substrate to obtain the device.
    Type: Grant
    Filed: July 27, 2018
    Date of Patent: January 5, 2021
    Assignee: LG CHEM, LTD.
    Inventors: Hye Won Jeong, Kyungjun Kim, Kyoung Hoon Kim, Chan Hyo Park, BoRa Shin, Seung Yup Lee, HangAh Park, JinHo Lee, MiRa Im
  • Patent number: 10647883
    Abstract: The present invention relates to a polyimide-based solution that can be used to produce an isotropic transparent polyimide-based film with high heat resistance and excellent mechanical properties as well as high transmittance. A coating of the polyimide-based solution on a substrate has a haze of 1% or less after storage at a temperature of 30° C. and a humidity of 70% for 30 minutes.
    Type: Grant
    Filed: October 31, 2018
    Date of Patent: May 12, 2020
    Assignee: LG CHEM. LTD.
    Inventors: Cheolmin Yun, BoRa Shin, Hye Won Jeong, Kyungjun Kim, HangAh Park
  • Publication number: 20200095376
    Abstract: The present invention relates to the production of a polyimide precursor, whereby, by using an amide-based organic solvent having a positive-number partition coefficient (Log P) and a density of at most 1 g/cm3, an interaction between the organic solvent and polyamic acid, which is a polyimide precursor, may be mitigated, thereby enabling the decrease of the viscosity of a polyimide precursor solution, and thus enabling a polyimide precursor solution having high solid content and low viscosity to be obtained.
    Type: Application
    Filed: June 27, 2018
    Publication date: March 26, 2020
    Applicant: LG CHEM, LTD.
    Inventors: Cheolmin YUN, Jinyoung PARK, Bora SHIN, Kyungjun KIM
  • Publication number: 20200062906
    Abstract: The laminate for manufacturing a flexible substrate according to the present invention is formed by using a polyimide having a high absorbance to a UV laser in an organic sacrificial layer for delaminating a flexible substrate from a carrier substrate. Therefore, it is possible that the laser energy density required in the delaminating process using laser irradiation is reduced and the amount of as generated by the delaminating process is remarkably reduced so that the efficiency of the process, the permeability of the flexible substrate is improved and the reliability of the device is improved.
    Type: Application
    Filed: January 19, 2018
    Publication date: February 27, 2020
    Applicant: LG CHEM, LTD.
    Inventors: Hye Won JEONG, Cheolmin YUN, Kyungjun KIM, Bora SHIN
  • Patent number: 10544266
    Abstract: Disclosed is a polyimide precursor composition for the production of a flexible board of a photoelectronic device. The polyimide precursor composition includes a polyimide precursor derived from a diamine or acid dianhydride including a structure of Formula 1: wherein R1 to R8, m1, m2, and m3 are as defined in the specification. Also disclosed is a polyimide film produced from the polyimide precursor composition. The polyimide film is obtained by applying the precursor composition to a substrate and curing the composition. The polyimide film has high transparency and good heat resistance. In addition, the polyimide film exhibits good dimensional stability because the substrate does not undergo an increase in stress even during high-temperature heat treatment.
    Type: Grant
    Filed: March 7, 2016
    Date of Patent: January 28, 2020
    Assignee: LG CHEM, LTD.
    Inventors: Cheolmin Yun, Hye Won Jeong, BoRa Shin, Kyungjun Kim
  • Publication number: 20190391118
    Abstract: An analysis method is provided, wherein a measurement sample containing a diamine and an acid dianhydride can be obtained without a separate methyl derivatization process. The analysis method includes pretreating a polyimide film including the polyimide which is a poorly soluble polymer with DMAc after hydrolysis, and determining an amount of monomers contained in the polyimide film.
    Type: Application
    Filed: September 28, 2018
    Publication date: December 26, 2019
    Applicant: LG Chem, Ltd.
    Inventors: Su Youn Han, Byoung Hyoun Kim, Dong Hyun Kim, Soo Ah Nam, Bora Shin
  • Patent number: 10414869
    Abstract: The present invention relates to a laminate and a device fabricated using the laminate. The laminate includes a debonding layer including a polyimide resin between a carrier substrate and a flexible substrate. The adhesive strength of the debonding layer to the flexible substrate is changed by a physical stimulus. According to the present invention, the flexible substrate can be easily separated from the carrier substrate without the need for further processing such as laser or light irradiation. Therefore, the use of the laminate facilitates the fabrication of the device having the flexible substrate. The device may be, for example, a flexible display device. In addition, the device can be prevented from deterioration of reliability and occurrence of defects caused by laser or light irradiation. This ensures improved characteristics and high reliability of the device.
    Type: Grant
    Filed: April 8, 2014
    Date of Patent: September 17, 2019
    Assignee: LG CHEM, LTD.
    Inventors: Hye Won Jeong, Kyungjun Kim, Kyoung Hoon Kim, Chan Hyo Park, BoRa Shin, Seung Yup Lee, HangAh Park, JinHo Lee, MiRa Im
  • Publication number: 20190062590
    Abstract: The present invention relates to a polyimide-based solution that can be used to produce an isotropic transparent polyimide-based film with high heat resistance and excellent mechanical properties as well as high transmittance. A coating of the polyimide-based solution on a substrate has a haze of 1% or less after storage at a temperature of 30° C. and a humidity of 70% for 30 minutes.
    Type: Application
    Filed: October 31, 2018
    Publication date: February 28, 2019
    Applicant: LG CHEM, LTD.
    Inventors: Cheolmin YUN, BoRa SHIN, Hye Won JEONG, Kyungjun KIM, HangAh PARK
  • Publication number: 20190048141
    Abstract: The present invention provides a polyimide film which, by having a fluorine structure adopted into a rigid polyamide chain structure, exhibits not only superb heat resistance but also enhanced optical properties. Additionally, the polyimide according to the present invention, by having the particular structure, exhibits excellent transparency, heat-resistance, mechanical strength and flexibility, and thus can be utilized in a variety of functions such as an element substrate, display cover substrate, optical film, integrated circuit (IC) package, adhesive film, multi-layered flexible printed circuit (FPC), tape, touch panel, and protective film for optical disks.
    Type: Application
    Filed: August 11, 2017
    Publication date: February 14, 2019
    Applicant: LG CHEM, LTD.
    Inventors: Cheolmin YUN, Bora SHIN, Kyungjun KIM, Jun Sik SUH
  • Patent number: 10144847
    Abstract: The present invention relates to a polyimide-based solution that can be used to produce an isotropic transparent polyimide-based film with high heat resistance and excellent mechanical properties as well as high transmittance. A coating of the polyimide-based solution on a substrate has a haze of 1% or less after storage at a temperature of 30° C. and a humidity of 70% for 30 minutes.
    Type: Grant
    Filed: June 1, 2015
    Date of Patent: December 4, 2018
    Assignee: LG CHEM, LTD.
    Inventors: Cheolmin Yun, BoRa Shin, Hye Won Jeong, Kyungjun Kim, HangAh Park
  • Publication number: 20180334541
    Abstract: A method for producing a device substrate by obtaining a laminate comprising a carrier substrate, a first polyimide film comprising a first polyimide resin disposed on at least one surface of the carrier substrate, a second polyimide film disposed on the first polyimide film opposite to the surface of the first polyimide film formed on a surface of the carrier substrate; applying a physical stimulus to the second polyimide film without causing chemical changes in the first polyimide film such that the cross-sections of the second polyimide film are exposed and cross-sectional surfaces of the first polyimide film are not exposed and no physical stimulus is applied to the surface of the carrier substrate, wherein the adhesive strength of the first polyimide to the second polyimide film decreases when the second polyimide film in the laminate is cut to expose cross-sectional surfaces of the second polyimide film; and separating the second polyimide film from the first polyimide film formed on the carrier substra
    Type: Application
    Filed: July 27, 2018
    Publication date: November 22, 2018
    Applicant: LG CHEM, LTD.
    Inventors: Hye Won JEONG, Kyungjun KIM, Kyoung Hoon KIM, Chan Hyo PARK, BoRa SHIN, Seung Yup LEE, HangAh PARK, JinHo LEE, MiRa IM
  • Patent number: 10035883
    Abstract: The present invention relates to a laminate and a device fabricated using the laminate. The laminate includes a first polyimide resin layer between a carrier substrate and a second polyimide resin layer, wherein the first polyimide resin layer has a coefficient of thermal expansion (CTE) equal to or lower than the CTE of the second polyimide-based resin layer at a temperature of 100 to 200° C., and the adhesive strength of the first resin layer to the second resin layer decreases when a physical stimulus causing no chemical changes in the first resin layer is applied to the laminate. According to the present invention, the flexible substrate can be easily separated from the carrier substrate without the need for further processing such as laser or light irradiation. Therefore, the use of the laminate facilitates the fabrication of the device having the flexible substrate. The device may be, for example, a flexible display device.
    Type: Grant
    Filed: April 8, 2014
    Date of Patent: July 31, 2018
    Assignee: LG CHEM, LTD.
    Inventors: Hye Won Jeong, Kyungjun Kim, Kyoung Hoon Kim, Chan Hyo Park, BoRa Shin, Seung Yup Lee, HangAh Park, JinHo Lee, MiRa Im
  • Publication number: 20170096530
    Abstract: Disclosed is a polyimide precursor composition for the production of a flexible board of a photoelectronic device. The polyimide precursor composition includes a polyimide precursor derived from a diamine or acid dianhydride including a structure of Formula 1: wherein R1 to R8, m1, m2, and m3 are as defined in the specification. Also disclosed is a polyimide film produced from the polyimide precursor composition. The polyimide film is obtained by applying the precursor composition to a substrate and curing the composition. The polyimide film has high transparency and good heat resistance. In addition, the polyimide film exhibits good dimensional stability because the substrate does not undergo an increase in stress even during high-temperature heat treatment.
    Type: Application
    Filed: March 7, 2016
    Publication date: April 6, 2017
    Applicant: LG CHEM, LTD.
    Inventors: Cheolmin YUN, Hye Won JEONG, BoRa SHIN, Kyungjun KIM
  • Patent number: 9611358
    Abstract: The present invention relates to a laminate and a device fabricated using the laminate. The laminate includes a debonding layer including a polyimide resin having a similarity score not greater than 0.5, as calculated by Equation 1 defined in the detailed description, between a carrier substrate and a flexible substrate. According to the present invention, the flexible substrate can be easily separated from the carrier substrate without the need for further processing such as laser or light irradiation. Therefore, the use of the laminate facilitates the fabrication of the device having the flexible substrate. The device may be, for example, a flexible display device. In addition, the device can be prevented from deterioration of reliability and occurrence of defects caused by laser or light irradiation. This ensures improved characteristics and high reliability of the device.
    Type: Grant
    Filed: April 8, 2014
    Date of Patent: April 4, 2017
    Assignee: LG CHEM, LTD.
    Inventors: Hye Won Jeong, Kyungjun Kim, Kyoung Hoon Kim, Chan Hyo Park, BoRa Shin, Seung Yup Lee, HangAh Park, JinHo Lee, MiRa Im
  • Publication number: 20160251545
    Abstract: The present invention relates to a polyimide-based solution that can be used to produce an isotropic transparent polyimide-based film with high heat resistance and excellent mechanical properties as well as high transmittance. A coating of the polyimide-based solution on a substrate has a haze of 1% or less after storage at a temperature of 30° C. and a humidity of 70% for 30 minutes.
    Type: Application
    Filed: June 1, 2015
    Publication date: September 1, 2016
    Applicant: LG CHEM, LTD.
    Inventors: Cheolmin YUN, BoRa SHIN, Hye Won JEONG, Kyungjun KIM, HangAh PARK
  • Patent number: 9278488
    Abstract: The present invention relates to a polyamic acid polymer composite and a method for producing the same, and more specifically, a polyamic acid polymer composite, which can be applied to display substrate production due to its high transparency and low thermal expansion of glass-level, and a method for producing same. The polyamic acid polymer composite comprises 50 to 99 wt % of a polyamic acid polymer having a repeating unit of Chemical Formula 1; and 1 to 50 wt % of a silica-based particle: wherein, R1 to R3, m and n have the same meanings as defined in the specification.
    Type: Grant
    Filed: July 3, 2013
    Date of Patent: March 8, 2016
    Assignee: LG CHEM, LTD.
    Inventors: HangAh Park, BoRa Shin, Cheolmin Yun, Kyungjun Kim, JinHo Lee, Jung Ho Jo
  • Publication number: 20150239210
    Abstract: The present invention relates to a laminate and a device fabricated using the laminate. The laminate includes a debonding layer including a polyimide resin between a carrier substrate and a flexible substrate. The adhesive strength of the debonding layer to the flexible substrate is changed by a physical stimulus. According to the present invention, the flexible substrate can be easily separated from the carrier substrate without the need for further processing such as laser or light irradiation. Therefore, the use of the laminate facilitates the fabrication of the device having the flexible substrate. The device may be, for example, a flexible display device. In addition, the device can be prevented from deterioration of reliability and occurrence of defects caused by laser or light irradiation. This ensures improved characteristics and high reliability of the device.
    Type: Application
    Filed: April 8, 2014
    Publication date: August 27, 2015
    Applicant: LG CHEM, LTD.
    Inventors: Hye Won Jeong, Kyungjun Kim, Kyoung Hoon Kim, Chan Hyo Park, BoRa Shin, Seung Yup Lee, HangAh Park, JinHo Lee, MiRa Im