Abstract: Various aspects include methods for managing memory subsystems on a computing device. Various aspect methods may include determining a period of time to force a memory subsystem on the computing device into a low power mode, inhibiting memory access requests to the memory subsystem during the determined period of time, forcing the memory subsystem into the low power mode for the determined period of time, and executing the memory access requests to the memory subsystem inhibited during the determined period of time in response to expiration of the determined period of time.

Abstract: Micro-idle power in a subsystem of a portable computing device may be actively managed based on client voting. Each client vote may include a client activity status indication and a client latency tolerance indication. Votes are aggregated to provide an aggregate client latency tolerance, which may be used to obtain a set of micro-idle time values. Micro-idle timers in the subsystem may be set to associated micro-idle time values. The micro-idle timers determine whether one or more of the micro-idle time values have elapsed. A power management policy associated with each micro-idle time value determined to have elapsed may be applied to a portion of the subsystem.

Abstract: Micro-idle power in a subsystem of a portable computing device may be actively managed based on client voting. Each client vote may include a client activity status indication and a client latency tolerance indication. Votes are aggregated to provide an aggregate client latency tolerance, which may be used to obtain a set of micro-idle time values. Micro-idle timers in the subsystem may be set to associated micro-idle time values. The micro-idle timers determine whether one or more of the micro-idle time values have elapsed. A power management policy associated with each micro-idle time value determined to have elapsed may be applied to a portion of the subsystem.

Abstract: Various aspects include methods for managing memory subsystems on a computing device. Various aspect methods may include determining a period of time to force a memory subsystem on the computing device into a low power mode, inhibiting memory access requests to the memory subsystem during the determined period of time, forcing the memory subsystem into the low power mode for the determined period of time, and executing the memory access requests to the memory subsystem inhibited during the determined period of time in response to expiration of the determined period of time.

Abstract: Various aspects include methods for managing memory subsystems on a computing device. Various aspect methods may include determining a period of time to force a memory subsystem on the computing device into a low power mode, inhibiting memory access requests to the memory subsystem during the determined period of time, forcing the memory subsystem into the low power mode for the determined period of time, and executing the memory access requests to the memory subsystem inhibited during the determined period of time in response to expiration of the determined period of time.

Abstract: Various aspects include methods for managing memory subsystems on a computing device. Various aspect methods may include determining a period of time to force a memory subsystem on the computing device into a low power mode, inhibiting memory access requests to the memory subsystem during the determined period of time, forcing the memory subsystem into the low power mode for the determined period of time, and executing the memory access requests to the memory subsystem inhibited during the determined period of time in response to expiration of the determined period of time.

Abstract: A method and an apparatus are provided. The apparatus is a hardware module that controls a power mode of a plurality of modules. The apparatus receives an indication of a desired operational frequency. Based on the received indication, the apparatus determines to switch from a first power mode associated with a first set of modules to a second power mode corresponding to the desired operational frequency and associated with a second set of modules. The apparatus enables modules in the second set of modules that are unassociated with the first power mode, stops traffic through the plurality of modules upon expiration of a time period after enabling the modules in the second set of modules that are unassociated with the first power mode, routes traffic through the second set of modules, and disables modules in the first set of modules that are unassociated with the second power mode.

Abstract: An on-chip sensor measures dynamic power supply noise, such as voltage droop, on a semiconductor chip. In-situ logic is employed, which is sensitive to noise present on the power supply of functional logic of the chip. Exemplary functional logic includes a microprocessor, adder, and/or other functional logic of the chip. The in-situ logic performs some operation, and the amount of time required for performing that operation (i.e., the operational delay) is sensitive to noise present on the power supply. Thus, by evaluating the operational delay of the in-situ logic, the amount of noise present on the power supply can be measured.

Abstract: An on-chip sensor measures dynamic power supply noise, such as voltage droop, on a semiconductor chip. In-situ logic is employed, which is sensitive to noise present on the power supply of functional logic of the chip. Exemplary functional logic includes a microprocessor, adder, and/or other functional logic of the chip. The in-situ logic performs some operation, and the amount of time required for performing that operation (i.e., the operational delay) is sensitive to noise present on the power supply. Thus, by evaluating the operational delay of the in-situ logic, the amount of noise present on the power supply can be measured.

Abstract: A block power switch may be embedded with electrostatic discharge (ESD) protection circuitry. A transistor portion of the block power switch may he allocated to act as part of ESD protection circuitry and may be combined with an RC clamp to provide ESD protection. Adaptive body biasing (ABB) may be applied to the block power switch to reduce on-chip area and decrease leakage current of the block power switch.

Abstract: An on-chip sensor measures dynamic power supply noise, such as voltage droop, on a semiconductor chip. In-situ logic is employed, which is sensitive to noise present on the power supply of functional logic of the chip. Exemplary functional logic includes a microprocessor, adder, and/or other functional logic of the chip. The in-situ logic performs some operation, and the amount of time required for performing that operation (i.e., the operational delay) is sensitive to noise present on the power supply. Thus, by evaluating the operational delay of the in-situ logic, the amount of noise present on the power supply can be measured.

Abstract: A device is disclosed that includes a first pin to supply power to a first power domain of an integrated circuit, a second pin to supply power to a second power domain of the integrated circuit, a switching regulator and a controller. The switching regulator is coupled to the first pin to provide a first regulated power supply to the first power domain and is coupled to the second pin to provide a second regulated power supply to the second power domain. The controller is coupled to the first pin and to the second pin to selectively reduce current flow to at least the second pin during a low power event.

Abstract: A device is disclosed that includes a first pin to supply power to a first power domain of an integrated circuit, a second pin to supply power to a second power domain of the integrated circuit, a switching regulator and a controller. The switching regulator is coupled to the first pin to provide a first regulated power supply to the first power domain and is coupled to the second pin to provide a second regulated power supply to the second power domain. The controller is coupled to the first pin and to the second pin to selectively reduce current flow to at least the second pin during a low power event.

Abstract: In one particular embodiment, an integrated circuit includes a package and a substrate electrically and physically coupled to the package. The package includes a first pin, a second pin, and metallization coupling the first pin to the second pin. The substrate is coupled to the package via the first pin and the second pin. The substrate includes a plurality of power domains and a power control unit. The second pin of the package is coupled to a particular power domain of the plurality of power domains. The power control unit includes logic and a switch, where the switch includes a first terminal coupled to a voltage supply terminal, a control terminal coupled to the logic, and a second terminal coupled to the first pin of the package. The logic selectively activates the switch to distribute power to the particular power domain via the metallization of the package.