Abstract: In a first aspect, a module is provided that is adapted to process a wafer. The module includes a processing portion having one or more features such as (1) a rotatable wafer support for rotating an input wafer from a first orientation wherein the wafer is in line with a load port to a second orientation wherein the wafer is in line with an unload port; (2) a catcher adapted to contact and travel passively with a wafer as it is unloaded from the processing portion; (3) an enclosed output portion adapted to create a laminar air flow from one side thereof to the other; (4) an output portion having a plurality of wafer receivers; (5) submerged fluid nozzles; and/or (6) drying gas flow deflectors, etc. Other aspects include methods of wafer processing.

Abstract: A method of removing edge material from a workpiece includes the steps of supplying an etch solution to create an etchant bead at an opening of an edge removal device, contacting the etchant bead with an edge region of the workpiece, and rotating the workpiece to remove the edge material from the workpiece. In one aspect, the step of supplying the etch solution includes the step of maintaining the etchant bead at the opening of the edge removal device. In another aspect, the edge removal device includes a cavity having the opening and the step of contacting the etchant bead includes inserting the edge region of the workpiece into the cavity.

Abstract: A robotic gripper is provided. The robotic gripper has a rail, a rotary actuator, and at least one slide component moveably mounted on the rail and operatively coupled to the rotary actuator. A first gripping finger is mounted to the at least one slide component so as to move therewith, and a second gripping finger is positioned so that an object may be selectively gripped and ungripped by the first and the second gripping fingers. In a first aspect a magnet is coupled to the rotary actuator and a magnet is coupled to the at least one slide component so that rotation of the rotary actuator selectively causes attraction or repulsion of the magnet coupled to the at least one slide component, thus causing the gripping fingers selectively to assume open and closed positions. In a further aspect, the rotary actuator comprises a rotatable arm.

Abstract: The invention provides a gripper assembly comprising a mounting base having a first magnet coupled thereto and having a moveable gripper coupled to the mounting base. The moveable gripper has a second magnet coupled thereto and comprises an end effector adapted to contact a wafer. The first and second magnets are adapted so that the magnetic force therebetween biases the end effector away from the mounting base. An inventive method of gripping a substrate comprises coupling a moveable gripper to a mounting base and magnetically biasing the moveable gripper in a closed position.

Abstract: A gripper assembly is provided which supports a substrate in a vertical orientation. The gripper assembly's end effectors contact only the edge of the substrate. In a first aspect the end effectors each comprise a first pair of opposed surfaces and an second pair of opposed surfaces, all of which simultaneously contact the substrate, holding the substrate in a clamp-type manner. In a second aspect the end effectors each comprise a lower pair of opposed surfaces which simultaneously contact the substrate, and an upper pair of opposed surfaces, larger than the thickness of the substrate, which limit the substrate from horizontal tilting. In the second aspect the end effectors can close at a first elevation where they do not contact the substrate, and can then elevate to gently contact and support the substrate in a pocket-like manner.

Abstract: A gripper assembly is provided which supports a substrate in a vertical orientation. The gripper assembly's end effectors contact only the edge of the substrate. In a first aspect the end effectors each comprise a first pair of opposed surfaces and an second pair of opposed surfaces, all of which simultaneously contact the substrate, holding the substrate in a clamp-type manner. In a second aspect the end effectors each comprise a lower pair of opposed surfaces which simultaneously contact the substrate, and an upper pair of opposed surfaces, larger than the thickness of the substrate, which limit the substrate from horizontal tilting. In the second aspect the end effectors can close at a first elevation where they do not contact the substrate, and can then elevate to gently contact and support the substrate in a pocket-like manner.

Abstract: A gripper assembly is provided. The gripper assembly comprises a pair of moving assemblies. In an exemplary embodiment, the moving assemblies comprise a pair of grippers coupled to a pair of gripper fingers that have end effectors adapted to contact a wafer. A magnet is placed in each of the moving assemblies so that the attractive force between the magnets moves a portion of the moving assemblies toward each other.