Abstract: An electronic circuit may include at least two capacitors arranged in parallel; at least two resistors arranged in series; a positive supply voltage connected to the resistors; a negative supply voltage connected to the resistors, the resistors producing a reference signal; a source circuit producing a source signal and connected to the positive supply voltage and negative supply voltage; and a receiving circuit connected to the positive supply voltage and negative supply voltage, and receiving the source signal and reference signal.

Abstract: A transmitter including a digital-to-analog converter (DAC) to generate an analog output corresponding to a transmitted signal. The transmitter further includes an analog-to-digital converter (ADC) coupled to the DAC. The ADC measures the analog output of the DAC to identify a set of digital samples. The ADC identifies, from the set of digital samples, a set of valid samples, wherein each valid sample has a voltage within a voltage range. The ADC extracts one or more signal properties from the set of valid samples.

Abstract: A transmitter including a digital-to-analog converter (DAC) to generate an analog output corresponding to a transmitted signal. The transmitter further includes an analog-to-digital converter (ADC) coupled to the DAC. The ADC measures the analog output of the DAC to identify a set of digital samples. The ADC identifies, from the set of digital samples, a set of valid samples, wherein each valid sample has a voltage within a voltage range. The ADC extracts one or more signal properties from the set of valid samples.

Abstract: Apparatuses and associated methods are described that provide networking connections that reduce cross-talk and other interference in communications systems. The network connection includes a printed circuit board (PCB) that defines a first end, a second end, and a grounding region on a surface of the PCB proximate the first end. The network connection includes network connectors proximate the first end, soldering pad pairs proximate the second end, and electrical traces therebetween. At least a first soldering pad pair is offset from a second soldering pad pair with respect to an edge of the PCB at the second end, such that, in an operational configuration in which at least the first soldering pad pair and the second soldering pad pair receive a differential signal cable, each differential signal cable is supported by the PCB in a corresponding offset configuration thereby reducing cross-talk between the differential signal cables.

Abstract: An optimized ground (GND) network connection is provided between a Quad Small Form-factor Pluggable (QSFP) connector and a printed circuit board (PCB). The optimized GND network creates a “GND Island” around the signal pads by adding GND cage around the signal pads (at the empty corridor and in front of QSFP pads) and GND TH (ground through hole) vias from both sides of signal pads (at the empty corridor and in front of QSFP pads).

Abstract: An optimized ground (GND) network connection is provided between a Quad Small Form-factor Pluggable (QSFP) connector and a printed circuit board (PCB). The optimized GND network creates a “GND Island” around the signal pads by adding GND cage around the signal pads (at the empty corridor and in front of QSFP pads) and GND TH (ground through hole) vias from both sides of signal pads (at the empty corridor and in front of QSFP pads).