Abstract: A bipolar electrostatic chuck system having a bipolar electrostatic chuck for securely holding a wafer on the surface of the bipolar electrostatic chuck. The bipolar electrostatic chuck system includes a negative-offset power supply for providing a positive potential level and a negative potential level. The positive potential level is positively biased relative to a common reference voltage level by a first magnitude while the negative potential level is negatively biased relative to the same common reference voltage level by a second magnitude, which is larger than the first magnitude. Further, the bipolar electrostatic chuck includes a positive pole, which is coupled to the negative-offset power supply for biasing the positive pole at the positive potential level when the negative-offset power supply is turned on.

Abstract: An electrostatic chuck system having an electrostatic chuck for securely holding a wafer on a surface of the electrostatic chuck. The electrostatic chuck system comprises a wafer bias sensor coupled to a first portion of the electrostatic chuck for sensing an alternating current signal at the first portion. The wafer bias sensor outputs, responsive to the alternating current signal, a direct current voltage level representative of a direct current bias level of the wafer. The electrostatic chuck system further comprises a variable electrostatic chuck power supply coupled to the wafer bias sensor. The variable electrostatic chuck power supply provides a first potential level to the first portion of the electrostatic chuck.