Abstract: Embodiments of the present disclosure generally relate to semiconductor processing equipment. In one or more embodiments, a flow adapter for mounting to a processing chamber includes a first flange, a second flange, and a conduit extending at least partially between the first flange and the second flange. The conduit includes an outer face, an inner flow opening, and one or more angled flow openings extending between the outer face and the inner flow opening. The one or more angled flow openings are oriented at an oblique angle relative to the inner flow opening.

Abstract: Embodiments of the present invention generally relate to fluid circuit for the use in a pre-cleaning chamber. In one embodiment, a fluid circuit for a substrate support assembly includes a substrate support. The substrate support includes an inner zone and an outer zone. The inner zone includes one or more inner channels and the outer zone includes one or more outer channels. The fluid circuit further includes, a first cooling channel fluidly coupled to the inner zone and a second cooling channel fluidly coupled to the outer zone. The fluid circuit further includes, a heater and one or more valves operable to switch between a first state and a second state. In the first state, the one or more valves fluidly couple the first cooling channel to the heater. In the second state, the one or more valves fluidly couple the second cooling channel to the heater.

Abstract: Magnet assemblies comprising a housing with a top plate each comprising aligned openings are described. The housing has a bottom ring and an annular wall with a plurality of openings formed in the bottom ring. The top plate is on the housing and has a plurality of openings aligned with the plurality of openings in the bottom ring of the housing. The magnet assembly may also include a non-conducting base plate and/or a conductive cover plate. Methods for using the magnet assembly and magnetic field tuning are also described.

Abstract: Processing chambers including at least one gas reservoir connected to and in fluid communication with the lid through a fast-switching valve and a gas reservoir line are described. Processing methods, for example, etching methods, using the processing chambers are also described.

Abstract: Magnet assemblies comprising a housing with a top plate each comprising aligned openings are described. The housing has a bottom ring and an annular wall with a plurality of openings formed in the bottom ring. The top plate is on the housing and has a plurality of openings aligned with the plurality of openings in the bottom ring of the housing. The magnet assembly may also include a non-conducting base plate and/or a conductive cover plate. Methods for using the magnet assembly and magnetic field tuning are also described.