Patents by Inventor Borui Xia

Borui Xia has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12112890
    Abstract: Magnet assemblies comprising a housing with a top plate each comprising aligned openings are described. The housing has a bottom ring and an annular wall with a plurality of openings formed in the bottom ring. The top plate is on the housing and has a plurality of openings aligned with the plurality of openings in the bottom ring of the housing. The magnet assembly may also include a non-conducting base plate and/or a conductive cover plate. Methods for using the magnet assembly and magnetic field tuning are also described.
    Type: Grant
    Filed: September 17, 2021
    Date of Patent: October 8, 2024
    Assignee: Applied Materials, Inc.
    Inventors: Borui Xia, Anthony Chih-Tung Chan, Shiyu Yue, Wei Lei, Aravind Miyar Kamath, Mukund Sundararajan, Rongjun Wang, Adolph Miller Allen
  • Publication number: 20240153790
    Abstract: Processing chambers including at least one gas reservoir connected to and in fluid communication with the lid through a fast-switching valve and a gas reservoir line are described. Processing methods, for example, etching methods, using the processing chambers are also described.
    Type: Application
    Filed: November 7, 2023
    Publication date: May 9, 2024
    Applicant: Applied Materials, Inc.
    Inventors: Borui Xia, Chih-Hsun Hsu, Xiaoxiong Yuan, Le Zhang, David T. Or, Jiang Lu
  • Publication number: 20230088552
    Abstract: Magnet assemblies comprising a housing with a top plate each comprising aligned openings are described. The housing has a bottom ring and an annular wall with a plurality of openings formed in the bottom ring. The top plate is on the housing and has a plurality of openings aligned with the plurality of openings in the bottom ring of the housing. The magnet assembly may also include a non-conducting base plate and/or a conductive cover plate. Methods for using the magnet assembly and magnetic field tuning are also described.
    Type: Application
    Filed: September 17, 2021
    Publication date: March 23, 2023
    Applicant: Applied Materials, Inc.
    Inventors: Borui Xia, Anthony Chih-Tung Chan, Shiyu Yue, Wei Lei, Aravind Miyar Kamath, Mukund Sundararajan, Rongjun Wang, Adolph Miller Allen
  • Patent number: D1052548
    Type: Grant
    Filed: June 26, 2023
    Date of Patent: November 26, 2024
    Assignee: Applied Materials, Inc.
    Inventors: Devi Raghavee Veerappan, Xiaoxiong Yuan, Peiyu Zhang, Borui Xia, Chih-Hsun Hsu