Abstract: The present invention relates to a conjugate in which a polypeptide capable of forming a dimer is fused to the C-terminus of the heavy chain or light chain of an antibody or fragment thereof, a composition for increasing antigen-binding avidity of an antibody in proportion to the density of a target antigen, and a method for increasing antigen-binding avidity using the same. The present invention also relates to the treatment or diagnosis of diseases using the conjugate.

Abstract: A semiconductor package includes a mold substrate, at least one first semiconductor chip in the mold substrate and including chip pads, wiring bonding pads formed at a first surface of the mold substrate and connected to the chip pads by bonding wires, and a redistribution wiring layer covering the first surface of the mold substrate and including redistribution wirings connected to the wiring bonding wirings.

Abstract: Discussed is a light emitting display device which enables a common layer having high hole conductivity among common layers in respective stacks to include a material having a high orientation factor value so as to prevent generation of leakage current between subpixels and ensure high efficiency and a long lifespan.

Abstract: The present invention provides a system for autonomously conveying and loading a shell into a fixed gun, the system including an autonomous conveyance device configured to autonomously travel and move according to an autonomous driving program from a shell storage location to a fixed gun fixed to a gun mount that is a destination, an automatic loading device configured to hold a testing shell and automatically load the testing shell into a cartridge chamber of the fixed gun, and a shell lifting device mounted on an upper surface of the autonomous conveyance device and a lower surface of the automatic loading device and configured to move the automatic loading device upward or downward. According to the present invention, a process of conveying and loading the shell into the testing fixed gun may be autonomously performed in an unmanned manner.

Abstract: The present invention relates to a method for manufacturing a solar cell panel by means of an autoclave, the method comprising the steps of: (a) positioning at least one solar cell module on a mold having a release material layer; (b) laminating a prepreg on the mold by a predetermined thickness so as to cover the solar cell module; (c) covering a laminated structure of the solar cell module and prepreg with a bagging film and encapsulating the inner space of the bagging film from the outside; and (d) making the inner space of the bagging film into a vacuum state, and then inputting the mold into a chamber of an autoclave and pressing and hardening the prepreg by applying heat and pressure, wherein, in step (b), a mounting space for forming a solar cell panel is provided on the mold, and the prepreg is laminated while the solar cell module is insertedly positioned in a fixing groove formed on a mounting surface of the mounting space.

Abstract: Discussed is a light emitting display device which enables a common layer having high hole conductivity among common layers in respective stacks to include a material having a high orientation factor value so as to prevent generation of leakage current between subpixels and ensure high efficiency and a long lifespan.

Abstract: A display device includes: a first pixel, a second pixel, and a third pixel from which lights of different colors are respectively emitted; in the first pixel, a first light conversion layer overlapping a first color filter; in the second pixel, a second light conversion layer overlapping a second color filter; and in the third pixel, a third light conversion layer overlapping a third color filter. The first light conversion layer, the second light conversion layer, and the third light conversion layer respectively include a quantum dot, and an amount of the quantum dot included in the first light conversion layer is larger than each of amounts of the quantum dot respectively included in the second light conversion layer and the third light conversion layer.

Abstract: A semiconductor package includes a mold substrate, at least one first semiconductor chip in the mold substrate and including chip pads, wiring bonding pads formed at a first surface of the mold substrate and connected to the chip pads by bonding wires, and a redistribution wiring layer covering the first surface of the mold substrate and including redistribution wirings connected to the wiring bonding wirings.

Abstract: A display device includes: a first pixel, a second pixel, and a third pixel from which lights of different colors are respectively emitted; in the first pixel, a first light conversion layer overlapping a first color filter; in the second pixel, a second light conversion layer overlapping a second color filter; and in the third pixel, a third light conversion layer overlapping a third color filter. The first light conversion layer, the second light conversion layer, and the third light conversion layer respectively include a quantum dot, and an amount of the quantum dot included in the first light conversion layer is larger than each of amounts of the quantum dot respectively included in the second light conversion layer and the third light conversion layer.

Abstract: A semiconductor package includes a mold substrate, at least one first semiconductor chip in the mold substrate and including chip pads, wiring bonding pads formed at a first surface of the mold substrate and connected to the chip pads by bonding wires, and a redistribution wiring layer covering the first surface of the mold substrate and including redistribution wirings connected to the wiring bonding wirings.

Abstract: An organic light-emitting device includes: an anode, a hole transport layer over the anode, an electron blocking layer over the hole transport layer, an organic emitting layer contacting the electron blocking layer, an electron transport layer contacting the organic emitting layer, a cathode over the electron transport layer, and a trapping layer between the hole transport layer and the electron blocking layer, wherein a LUMO energy level of the trapping layer: differs from a HOMO energy level of the electron blocking layer within a range of 1 eV, or is equal to the HOMO energy level of the electron blocking layer.

Abstract: An electronic device is provided. The electronic device includes a processor, and a memory configured to store a messenger application, wherein the processor is configured to output the messenger application on the display and output a list of chat rooms joined based on a first user account on the display, and wherein the list of the plurality of chat rooms comprises a first chat room, in which the electronic device participates, and a second chat room in which another electronic device participates.

Abstract: A semiconductor package includes a mold substrate, at least one first semiconductor chip in the mold substrate and including chip pads, wiring bonding pads formed at a first surface of the mold substrate and connected to the chip pads by bonding wires, and a redistribution wiring layer covering the first surface of the mold substrate and including redistribution wirings connected to the wiring bonding wirings.

Abstract: An organic light-emitting device includes: an anode, a hole transport layer over the anode, an electron blocking layer over the hole transport layer, an organic emitting layer contacting the electron blocking layer, an electron transport layer contacting the organic emitting layer, a cathode over the electron transport layer, and a trapping layer between the hole transport layer and the electron blocking layer, wherein a LUMO energy level of the trapping layer: differs from a HOMO energy level of the electron blocking layer within a range of 1 eV, or is equal to the HOMO energy level of the electron blocking layer.

Abstract: Various examples relating to a device and a method for providing a message service are provided. A message service method, according to one example, comprises the steps of: receiving, from a transmission terminal, a cancelation request for canceling a transmission message transmitted to at least one reception terminal; determining whether the transmission message for each of the at least one reception terminal can be cancelled; and transmitting a transmission message cancelation command signal to a reception terminal for which the transmission message can be cancelled among the at least one reception terminal, wherein the at least one reception terminal is capable of including a plurality of terminals associated with the same user account. Various examples can be implemented in addition to the one example.

Abstract: An electronic device is provided. The electronic device includes a processor, and a memory configured to store a messenger application, wherein the processor is configured to output the messenger application on the display and output a list of chat rooms joined based on a first user account on the display, and wherein the list of the plurality of chat rooms comprises a first chat room, in which the electronic device participates, and a second chat room in which another electronic device participates.

Abstract: An optical connector for directly transferring data is disclosed. The optical connector includes a first input device connected to a first data source and to which a first input signal is applied, a first light emitting device connected to the first input device and generating a first optical signal corresponding to the first input signal, a first light receiving device positioned close to the first light emitting device in such a configuration that the first optical signal directly reaches the first light receiving device from the first light emitting device, the first light receiving device generating a first output signal corresponding to the first optical signal, and a first output device connected to the first light receiving device and to a second data source to which the first output signal is transferred. Large-sized data may be transferred at high speed and high reliability without light transfer units.

Abstract: A semiconductor package includes a first semiconductor chip mounted to a substrate, a first encapsulant covering the first semiconductor chip and have first to fourth sidewall surfaces, and a chip stack mounted to the substrate and disposed on the first encapsulant. The chip stack includes a plurality of second semiconductor chips. A second encapsulant covers the chip stack. The second encapsulant may cover the first sidewall surface of the first encapsulant and expose the third sidewall surface of the first encapsulant.

Abstract: An optical connector for directly transferring data is disclosed. The optical connector includes a first input device connected to a first data source and to which a first input signal is applied, a first light emitting device connected to the first input device and generating a first optical signal corresponding to the first input signal, a first light receiving device positioned close to the first light emitting device in such a configuration that the first optical signal directly reaches the first light receiving device from the first light emitting device, the first light receiving device generating a first output signal corresponding to the first optical signal, and a first output device connected to the first light receiving device and to a second data source to which the first output signal is transferred. Large-sized data may be transferred at high speed and high reliability without light transfer units.

Abstract: A semiconductor package includes a first semiconductor chip mounted to a substrate, a first encapsulant covering the first semiconductor chip and have first to fourth sidewall surfaces, and a chip stack mounted to the substrate and disposed on the first encapsulant. The chip stack includes a plurality of second semiconductor chips. A second encapsulant covers the chip stack. The second encapsulant may cover the first sidewall surface of the first encapsulant and expose the third sidewall surface of the first encapsulant.