Patents by Inventor Bo Sung Shin

Bo Sung Shin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240126139
    Abstract: An aperture module is provided. The aperture module includes a plurality of blades configured to interlock with each other to form a through-hole, a rotator on which the plurality of blades are disposed, a first base on which the rotator is disposed, a second base connected to the first base, and a driving unit disposed on the second base and configured to provide a driving force to move the rotator in a direction that intersects an optical axis direction. The first base is configured to move in an optical axis direction with respect to the second base.
    Type: Application
    Filed: April 4, 2023
    Publication date: April 18, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jun Sup SHIN, Chuel Jin PARK, Bo Sung SEO
  • Patent number: 7255085
    Abstract: A timing cover for an engine includes a plurality of dome-shaped embossed portions formed at positions of the timing cover that are most susceptible to vibration, based on an analysis of vibration modes of the timing cover.
    Type: Grant
    Filed: December 20, 2005
    Date of Patent: August 14, 2007
    Assignee: Hyundai Motor Company
    Inventor: Bo Sung Shin
  • Patent number: 6627030
    Abstract: Disclosed herein is a variable lamination manufacturing process and apparatus. The method comprises the step of coating strip-shaped material with an adhesive while the strip-shaped material is fed. Thereafter, the strip-shaped material being fed is cut into material pieces of a variable width, variable inclinations and a variable length in accordance with the three-dimensional computer aided design data of a three-dimensional product using a linear heat source. The cut material pieces are stacked on a moving table to be positioned in the corresponding positions of the three-dimensional product. Finally, the stacked cut material pieces are pushed to bond one piece to anther.
    Type: Grant
    Filed: March 12, 2001
    Date of Patent: September 30, 2003
    Assignee: Korea Advanced Institute of Science and Technology
    Inventors: Dong-Yol Yang, Dong-Gyu Ahn, Bo-Sung Shin, Sang-Ho Lee
  • Patent number: 6505089
    Abstract: To enhance accuracy of the size and the shape of manufactures, and to shorten the time of operation, there is provided a method for manufacturing a 3D model comprising steps of designing the 3D model and collecting shape data of the 3D model slicing the 3D model into several layers in height, dividing each of the layers into several sublayers so that a sublayer is formed by depositing a material at once, depositing a material in accordance with shape data in relation to a sublayer divided from one layer of the 3D model, and deciding whether the one layer of the 3D model has been completed. The method is conducted using computer-aided design and computer aided manufacturing system including a variable deposition manufacturing apparatus.
    Type: Grant
    Filed: March 14, 2000
    Date of Patent: January 7, 2003
    Assignee: Korea Advanced Institute Science and Technology
    Inventors: Dong Yol Yang, Bo Sung Shin, Jun Ho Jeong
  • Publication number: 20010040003
    Abstract: Disclosed herein is a variable lamination manufacturing process and apparatus. The method comprises the step of coating strip-shaped material with an adhesive while the strip-shaped material is fed. Thereafter, the strip-shaped material being fed is cut into material pieces of a variable width, variable inclinations and a variable length in accordance with the three-dimensional computer aided design data of a three-dimensional product using a linear heat source. The cut material pieces are stacked on a moving table to be positioned in the corresponding positions of the three-dimensional product. Finally, the stacked cut material pieces are pushed to bond one piece to anther.
    Type: Application
    Filed: March 12, 2001
    Publication date: November 15, 2001
    Inventors: Dong-Yol Yang, Dong-Gyu Ahn, Bo-Sung Shin, Sang-Ho Lee