Patents by Inventor Botho Hirschfeld
Botho Hirschfeld has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9377423Abstract: Disclosed systems and methods for testing a device under test (DUT) with a probe system are selected to test a DUT at a temperature below the dew point of the ambient environment surrounding the probe system. Probe systems include a measurement chamber configured to isolate a cool, dry testing environment and a measurement chamber door configured to selectively isolate the internal volume of the measurement chamber. When a DUT, that is or is included on a substrate, is tested at a low temperature, systems and methods are selected to heat the substrate in a dry environment, at least partially isolated from the measurement chamber, to at least a temperature above the dew point and/or the frost point of the ambient environment.Type: GrantFiled: December 27, 2013Date of Patent: June 28, 2016Assignee: Cascade Microtech, Inc.Inventors: Botho Hirschfeld, Axel Becker
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Patent number: 9373533Abstract: Systems and methods for providing wafer access in a wafer processing system are disclosed herein. The methods may include docking a first wafer cassette on the wafer processing system and removing a selected wafer from the first wafer cassette with the wafer processing system. The methods further may include performing a process operation on the selected wafer with the wafer processing system and undocking the first wafer cassette from the wafer processing system while performing the process operation. The methods also may include docking a second wafer cassette (which may be the same as or different from the first wafer cassette) on the wafer processing system, inventorying the second wafer cassette with the wafer processing system, and/or subsequently placing the selected wafer in the second wafer cassette. The systems may include wafer processing systems that include a controller that is programmed to perform at least a portion of the methods.Type: GrantFiled: December 27, 2013Date of Patent: June 21, 2016Assignee: Cascade Microtech, Inc.Inventors: Frank Fehrmann, Botho Hirschfeld, Stojan Kanev
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Patent number: 9194885Abstract: The invention relates to a prober for checking and testing electronic semiconductor components and methods of using the same. The prober comprises at least two checking units, each of which is equipped with a chuck, probes, and a positioning unit, and each of which is assigned to a machine control system and a process control system. The prober further comprises a loading unit for automatically loading both testing units and an additional loader for manually loading at least one of the testing units, a user interface, and a module control system for controlling the process control systems and/or the machine control systems and the loading unit. The user interface can optionally be connected to at least one of the process control systems or the module control system by means of a switching device of the prober.Type: GrantFiled: September 2, 2011Date of Patent: November 24, 2015Assignee: Cascade Microtech, Inc.Inventors: Stojan Kanev, Botho Hirschfeld, Axel Becker, Ulf Hackius
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Patent number: 9110131Abstract: The invention generally relates to a method and device for contacting contact areas (22) with probe tips (18) in a tester. The contact areas (22), which are arranged on a substrate (6), and the probe tips (18) are positioned relative to each other and then brought in contact with each other by an advancing motion. In order to detect a secure contact for each of the probe tips (18), the contacting between the probe tips (18) and the contact areas (22) is observed from at least two observation directions (34), which include an observation angle ? in a range of 0 to 180°.Type: GrantFiled: April 13, 2010Date of Patent: August 18, 2015Assignee: Cascade Microtech, Inc.Inventors: Claus Dietrich, Stojan Kanev, Frank Fehrmann, Botho Hirschfeld
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Patent number: 8922229Abstract: A method is disclosed for the measurement of a power device in a prober, which serves the examination and testing of such components. In the process, a power device is held by a chuck, and at least one electric probe is held by a probe holder, and optionally, the power device or the probe is positioned each relative to the other using a positioning device with an electrical drive, and contacts the power device. At the same time, an electrical connection remains between the probe to a signal unit with which a power signal is sent out or received, is blocked and only unblocked when it is determined that the contact between probe 26 and contact area is established.Type: GrantFiled: June 16, 2010Date of Patent: December 30, 2014Assignee: Cascade Microtech, Inc.Inventors: Botho Hirschfeld, Stojan Kanev
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Publication number: 20140186145Abstract: Systems and methods for providing wafer access in a wafer processing system are disclosed herein. The methods may include docking a first wafer cassette on the wafer processing system and removing a selected wafer from the first wafer cassette with the wafer processing system. The methods further may include performing a process operation on the selected wafer with the wafer processing system and undocking the first wafer cassette from the wafer processing system while performing the process operation. The methods also may include docking a second wafer cassette (which may be the same as or different from the first wafer cassette) on the wafer processing system, inventorying the second wafer cassette with the wafer processing system, and/or subsequently placing the selected wafer in the second wafer cassette. The systems may include wafer processing systems that include a controller that is programmed to perform at least a portion of the methods.Type: ApplicationFiled: December 27, 2013Publication date: July 3, 2014Applicant: Cascade Microtech, Inc.Inventors: Frank Fehrmann, Botho Hirschfeld, Stojan Kanev
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Publication number: 20140185649Abstract: Disclosed systems and methods for testing a device under test (DUT) with a probe system are selected to test a DUT at a temperature below the dew point of the ambient environment surrounding the probe system. Probe systems include a measurement chamber configured to isolate a cool, dry testing environment and a measurement chamber door configured to selectively isolate the internal volume of the measurement chamber. When a DUT, that is or is included on a substrate, is tested at a low temperature, systems and methods are selected to heat the substrate in a dry environment, at least partially isolated from the measurement chamber, to at least a temperature above the dew point and/or the frost point of the ambient environment.Type: ApplicationFiled: December 27, 2013Publication date: July 3, 2014Applicant: Cascade Microtech, Inc.Inventors: Botho Hirschfeld, Axel Becker
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Publication number: 20140145743Abstract: The invention relates to a prober for checking and testing electronic semiconductor components and methods of using the same. The prober comprises at least two checking units, each of which is equipped with a chuck, probes, and a positioning unit, and each of which is assigned to a machine control system and a process control system. The prober further comprises a loading unit for automatically loading both testing units and an additional loader for manually loading at least one of the testing units, a user interface, and a module control system for controlling the process control systems and/or the machine control systems and the loading unit. The user interface can optionally be connected to at least one of the process control systems or the module control system by means of a switching device of the prober.Type: ApplicationFiled: September 2, 2011Publication date: May 29, 2014Applicant: Cascade Micotech, Inc.Inventors: Stojan Kanev, Botho Hirschfeld, Axel Becker, Ulf Hackius
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Publication number: 20130027070Abstract: The invention generally relates to a method and device for contacting contact areas (22) with probe tips (18) in a tester. The contact areas (22), which are arranged on a substrate (6), and the probe tips (18) are positioned relative to each other and then brought in contact with each other by an advancing motion. In order to detect a secure contact for each of the probe tips (18), the contacting between the probe tips (18) and the contact areas (22) is observed from at least two observation directions (34), which include an observation angle ? in a range of 0 to 180°.Type: ApplicationFiled: April 13, 2010Publication date: January 31, 2013Applicant: CASCADE MICROTECH INCInventors: Claus Dietrich, Stojan Kanev, Frank Fehrmann, Botho Hirschfeld
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Patent number: 8344744Abstract: An arrangement is provided for testing DUTs with a chuck that has a support surface for supporting of a DUT as well as for supplying the support surface with a defined potential, or for connecting the DUT. The arrangement further includes a positioning device for positioning the chuck as well as an electromagnetic shielding housing enclosing at least the chuck. Inside the housing and adjacent to the chuck, a signal preamplifier is arranged whose signal port facing the chuck is electrically connected with the support surface, wherein the signal preamplifier is moveable together with the chuck by the positioning device in a way that it holds its position constant relative to the chuck during positioning. The signal preamplifier is connected to a measurement unit outside of the housing via a measurement cable.Type: GrantFiled: June 18, 2010Date of Patent: January 1, 2013Assignee: Cascade Microtech, Inc.Inventors: Axel Schmidt, Botho Hirschfeld, Stojan Kanev, Andrej Rumiantsev, Michael Teich
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Publication number: 20120146676Abstract: A method is disclosed for the measurement of a power device in a prober, which serves the examination and testing of such components. In the process, a power device is held by a chuck, and at least one electric probe is held by a probe holder, and optionally, the power device or the probe is positioned each relative to the other using a positioning device with an electrical drive, and contacts the power device. At the same time, an electrical connection remains between the probe to a signal unit with which a power signal is sent out or received, is blocked and only unblocked when it is determined that the contact between probe 26 and contact area is established.Type: ApplicationFiled: June 16, 2010Publication date: June 14, 2012Applicant: CASCADE MICROTECH, INCInventors: Botho Hirschfeld, Stojan Kanev
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Publication number: 20110227602Abstract: An arrangement is provided for testing DUTs with a chuck that has a support surface for supporting of a DUT as well as for supplying the support surface with a defined potential, or for connecting the DUT. The arrangement further includes a positioning device for positioning the chuck as well as an electromagnetic shielding housing enclosing at least the chuck. Inside the housing and adjacent to the chuck, a signal preamplifier is arranged whose signal port facing the chuck is electrically connected with the support surface, wherein the signal preamplifier is moveable together with the chuck by the positioning device in a way that it holds its position constant relative to the chuck during positioning. The signal preamplifier is connected to a measurement unit outside of the housing via a measurement cable.Type: ApplicationFiled: June 18, 2010Publication date: September 22, 2011Applicant: CASCADE MICROTECH DRESDEN GMBHInventors: Axel SCHMIDT, Botho HIRSCHFELD, Stojan KANEV, Andrej RUMIANTSEV, Michael TEICH
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Patent number: 7282930Abstract: A device for testing thin elements, such as wafers or individual substrates, while at the same time offering a facility for inspecting the reverse side of the thin elements is provided in which any deflection of the substrate as a consequence of high contact power of the probe card is avoided and which is also suitable for substrate diameters of 200 mm and above. The device includes a stable plate with a central opening positioned on the basic construction, a frame which can be moved and/or turned on the plate in an x/y direction and, if required, in a theta direction, a highly-rigid substrate support which can be mounted in the frame, and substrates which can be mounted on the substrate support, wherein the mounting is effected through a vacuum, using mechanical elements (clamping ring, clamping foil or other suitable clamping elements), gel pack pads, or adhesive etc.Type: GrantFiled: December 21, 2005Date of Patent: October 16, 2007Assignee: Suss Microtec Test Systems GmbHInventors: Uwe Beier, Dietmar Runge, Stefan Kreissig, Steffen Grauer, Matthias Rottka, Botho Hirschfeld, Joerg Kiesewetter
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Publication number: 20070139067Abstract: A device for testing thin elements, such as wafers or individual substrates, while at the same time offering a facility for inspecting the reverse side of the thin elements is provided in which any deflection of the substrate as a consequence of high contact power of the probe card is avoided and which is also suitable for substrate diameters of 200 mm and above. The device includes a stable plate with a central opening positioned on the basic construction, a frame which can be moved and/or turned on the plate in an x/y direction and, if required, in a theta direction, a highly-rigid substrate support which can be mounted in the frame, and substrates which can be mounted on the substrate support, wherein the mounting is effected through a vacuum, using mechanical elements (clamping ring, clamping foil or other suitable clamping elements), gel pack pads, or adhesive etc.Type: ApplicationFiled: December 21, 2005Publication date: June 21, 2007Applicant: SUSS MicroTec Test Systems GmbHInventors: Uwe Beier, Dietmar Runge, Stefan Kreissig, Steffen Grauer, Matthias Rottka, Botho Hirschfeld, Joerg Kiesewetter
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Patent number: 6688156Abstract: The invention relates to a tester for pressure sensors in the wafer compound or isolated pressure sensors having a recess for the pressure sensors as well as means for electrical contacting of the electrical connections of at least one of the pressure sensors. The invention is intended to make it possible to test pressure sensors still in a wafer compound for their function. According to the invention, a pressure head is provided which has an interior space open on one side, the open face of which is capable of being mounted on the pressure sensor in such a way that the interior space is tightly sealed by the latter. In this way a static or dynamic pressure of specified amount and duration can be exerted on the sensor element at least so that the sensor element is moved out of its resting position. At the same time, the electrical connections of the selected pressure sensor are connected with an electrical evaluation unit.Type: GrantFiled: January 4, 2001Date of Patent: February 10, 2004Assignee: Karl Suss Dresden GmbHInventors: Claus Dietrich, Botho Hirschfeld, Dietmar Runge, Michael Teich, Stefan Schneidewind
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Publication number: 20020152794Abstract: The invention relates to a tester for pressure sensors (1) in the wafer compound or isolated pressure sensors having a recess for the pressure sensors as well as means for electrical contacting (7) of the electrical connections of at least one of the pressure sensors. The invention is intended to make it possible to test pressure sensors still in a wafer compound for their function. According to the invention, a pressure head (9) is provided which has an interior space (10) open on one side, the open face (11) of which is capable of being mounted on the pressure sensor (1) in such a way that the interior space (10) is tightly sealed by the latter. In this way a static or dynamic pressure of specified amount and duration can be exerted on the sensor element (4) at least so that the sensor element (4) is moved out of its resting position. At the same time, the electrical connections (7) of the selected pressure sensor (1) are connected with an electrical evaluation unit (21).Type: ApplicationFiled: January 4, 2001Publication date: October 24, 2002Inventors: Claus Dietrich, Botho Hirschfeld, Dietmar Runge, Michael Teich, Stefan Schneidewind