Abstract: There is provided a substrate processing apparatus, including: a substrate holder configured to hold a substrate with a surface of the substrate on which a concavo-convex pattern is formed oriented upward; a liquid supply unit configured to supply a processing liquid to the substrate held by the substrate holder to form a liquid film at least in a concave portion of the concavo-convex pattern; a heating unit configured to irradiate the substrate held by the substrate holder or the liquid film with a laser beam for heating the liquid film; and a heating controller configured to control the heating unit, wherein the heating controller controls the heating unit to expose the entire concave portion in a depth direction from the processing liquid by irradiating the laser beam onto the substrate or the liquid film from the heating unit.

Abstract: There is provided a substrate processing apparatus, including: a substrate holder configured to hold a substrate with a surface of the substrate on which a concavo-convex pattern is formed oriented upward; a liquid supply unit configured to supply a processing liquid to the substrate held by the substrate holder to form a liquid film at least in a concave portion of the concavo-convex pattern; a heating unit configured to irradiate the substrate held by the substrate holder or the liquid film with a laser beam for heating the liquid film; and a heating controller configured to control the heating unit, wherein the heating controller controls the heating unit to expose the entire concave portion in a depth direction from the processing liquid by irradiating the laser beam onto the substrate or the liquid film from the heating unit.

Abstract: A substrate processing apparatus includes a substrate holder configured to hold a substrate on which an irregularity pattern is formed; a liquid supply unit configured to supply a processing liquid onto the substrate from above to thereby form a liquid film which covers a recess of the irregularity pattern; a heating unit comprising a heater and a heating position mover configured to move a heating position heated by the heater; and a heating controller. While overlapping the heating position with a boundary portion when viewed from a vertical direction, the boundary portion being provided between an exposed portion where the recess is entirely exposed and a covered portion where the recess is entirely filled with the processing liquid in a depth direction thereof, the heating controller moves the heating position in a moving direction of the boundary portion as a direction in which the exposed portion is enlarged.