Patents by Inventor Boumy Sayavong

Boumy Sayavong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6925238
    Abstract: A method for testing an optical chip, while the optical chip is still on a wafer, utilizing an optical probe, includes the steps of creating an access point on the wafer adjacent the optical chip. The optical chip having a waveguide having an axis. A portion of the waveguide is removed to form the access point such that light exiting the planar optical waveguide is directed in a direction substantially different from the axis of the waveguide. An optical probe is placed along a propagation path of the exiting light to optically couple the optical probe and optical chip.
    Type: Grant
    Filed: December 6, 2002
    Date of Patent: August 2, 2005
    Assignee: Enablence Holdings LLC
    Inventors: Kevin Kidoo Lee, Christian Hoepfner, Desmond Rodney Lim, Wang-Yuhl Oh, Boumy Sayavong
  • Publication number: 20040013378
    Abstract: A method for testing an optical chip, while the optical chip is still on a wafer, utilizing an optical probe, includes the steps of creating an access point on the wafer adjacent the optical chip. The optical chip having a waveguide having an axis. A portion of the waveguide is removed to form the access point such that light exiting the planar optical waveguide is directed in a direction substantially different from the axis of the waveguide. An optical probe is placed along a propagation path of the exiting light to optically couple the optical probe and optical chip.
    Type: Application
    Filed: December 6, 2002
    Publication date: January 22, 2004
    Inventors: Kevin Kidoo Lee, Christian Hoepfner, Desmond Rodney Lim, Wang-Yuhl Oh, Boumy Sayavong