Patents by Inventor Boung Kyun KIM

Boung Kyun KIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of manufacturing semiconductor light emitting device
    Patent number: 8859314
    Abstract: There is provided a method of manufacturing a semiconductor light emitting device, the method including: sequentially growing a first conductivity type semiconductor layer, an active layer, and a second conductivity type semiconductor layer on a semiconductor growth substrate to form a light emitting part; forming a support part on the second conductivity type semiconductor layer to be coupled to the light emitting part; separating the semiconductor growth substrate from the light emitting part; and applying an etching gas to the semiconductor growth substrate to remove a residue of the first conductivity type semiconductor layer from a surface of the semiconductor growth substrate.
    Type: Grant
    Filed: June 14, 2012
    Date of Patent: October 14, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jong Sun Maeng, Ki Ho Park, Bum Joon Kim, Hyun Seok Ryu, Jung Hyun Lee, Boung Kyun Kim, Ki Sung Kim, Suk Ho Yoon
  • METHOD OF MANUFACTURING SEMICONDUCTOR LIGHT EMITTING DEVICE
    Publication number: 20120322188
    Abstract: There is provided a method of manufacturing a semiconductor light emitting device, the method including: sequentially growing a first conductivity type semiconductor layer, an active layer, and a second conductivity type semiconductor layer on a semiconductor growth substrate to form a light emitting part; forming a support part on the second conductivity type semiconductor layer to be coupled to the light emitting part; separating the semiconductor growth substrate from the light emitting part; and applying an etching gas to the semiconductor growth substrate to remove a residue of the first conductivity type semiconductor layer from a surface of the semiconductor growth substrate.
    Type: Application
    Filed: June 14, 2012
    Publication date: December 20, 2012
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jong Sun MAENG, Ki Ho PARK, Bum Joon KIM, Hyun Seok RYU, Jung Hyun LEE, Boung Kyun KIM, Ki Sung KIM, Suk Ho YOON