Patents by Inventor Bowen Cheng
Bowen Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20150233703Abstract: Spatially modulated light emanating from an object moving along a flow path is used to determine various object characteristics including object length along the flow direction. Light emanating from at least one object moving along in a flow path along a flow direction of a spatial filter is sensed. The intensity of the sensed light is time modulated according to features of the spatial filter. A time varying electrical signal is generated which includes a plurality of pulses in response to the sensed light. Pulse widths of at least some of the pulses are measured at a fraction of a local extremum of the pulses. The length of the object along the flow direction is determined based on the measured pulse widths.Type: ApplicationFiled: February 14, 2014Publication date: August 20, 2015Applicant: Palo Alto Research Center IncorporatedInventors: Joerg Martini, Marshall W. Bern, Noble M. Johnson, Peter Kiesel, Doron Kletter, Bowen Cheng, Michael I. Recht
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Patent number: 8908161Abstract: Approaches for substantially removing bulk aluminum nitride (AlN) from one or more layers epitaxially grown on the bulk AlN are discussed. The bulk AlN is exposed to an etchant during an etching process. During the etching process, the thickness of the bulk AlN can be measured and used to control etching.Type: GrantFiled: August 25, 2011Date of Patent: December 9, 2014Assignee: Palo Alto Research Center IncorporatedInventors: Brent S. Krusor, Christopher L. Chua, Thomas Wunderer, Noble M. Johnson, Bowen Cheng
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Publication number: 20140265848Abstract: An ionic wind engine unit for cooling semiconductor circuit assemblies includes a curved micro-spring and an associated electrode that are maintained apart at an appropriate gap distance such that, when subjected to a sufficiently high voltage potential (i.e., as determined by Peek's Law), current crowding at the spring's tip portion creates an electrical field that sufficiently ionizes neutral molecules in a portion of the air-filled region surrounding the tip portion to generate a micro-plasma event. In one engine type the electrode is a metal pad, and in a second engine type the electrode is a second micro-spring. Ionic wind cooling is generated, for example, between an IC die and a base substrate in a flip-chip arrangement, by controlling multiple engines disposed on the facing surfaces to produce an air current in the air gap region separating the IC device and base substrate.Type: ApplicationFiled: March 13, 2013Publication date: September 18, 2014Applicant: Palo Alto Research Center IncorporatedInventors: Bowen Cheng, Dirk DeBruyker, Eugene M. Chow
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Publication number: 20140231745Abstract: A light emitting device includes a p-side heterostructure having a short period superlattice (SPSL) formed of alternating layers of AlxhighGa1-xhighN doped with a p-type dopant and AlxlowGa1-xlowN doped with the p-type dopant, where xlow?xhigh?0.9. Each layer of the SPSL has a thickness of less than or equal to about six bi-layers of AlGaN.Type: ApplicationFiled: September 14, 2012Publication date: August 21, 2014Applicant: PALO ALTO RESEARCH CENTER INCORPORATEDInventors: John E. Northrup, Bowen Cheng, Christopher L. Chua, Thomas Wunderer, Noble M. Johnson, Zhihong Yang
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Patent number: 8736049Abstract: Micro-plasma is generated at the tip of a micro-spring by applying a positive voltage to the spring's anchor portion and a negative voltage to an electrode maintained a fixed gap distance from the spring's tip portion. By generating a sufficiently large voltage potential (i.e., as determined by Peek's Law), current crowding at the tip portion of the micro-spring creates an electrical field that sufficiently ionizes neutral molecules in a portion of the air-filled region surrounding the tip portion to generate a micro-plasma event. Ionic wind air currents are generated by producing multiple micro-plasma events using micro-springs disposed in a pattern to produce a pressure differential that causes air movement over the micro-springs. Ionic wind cooling is produced by generating such ionic wind air currents, for example, in the gap region between an IC die and a base substrate disposed in a flip-chip arrangement.Type: GrantFiled: March 13, 2013Date of Patent: May 27, 2014Assignee: Palo Alto Research Center IncorporatedInventors: Bowen Cheng, Dirk DeBruyker, Eugene M. Chow
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Patent number: 8652878Abstract: A method includes providing a pad chip having contact pads, providing a spring chip having micro-springs, applying a chemical activator to one of either the pad chip or the spring chip, applying an adhesive responsive to the chemical activator on the other of the pad chip or the spring chip, aligning the pad chip to the spring chip such that the micro-springs will contact the contact pads, and pressing the pad chip and the spring chip together such that the chemical activator at least partially cures the adhesive.Type: GrantFiled: March 13, 2013Date of Patent: February 18, 2014Assignee: Palo Alto Research Center IncorporatedInventors: Christopher L. Chua, Bowen Cheng, Eugene M. Chow, Dirk De Bruyker
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Patent number: 8405198Abstract: A package has a pad chip having contact pads, a spring chip having micro-springs in contact with the contact pads to form interconnects, the area in which the micro-springs contact the contact pads forming an interconnect area, a chemical activator in the interconnect area, and an adhesive responsive to the chemical activator in the interconnect area. A package has a pad chip having contact pads, a spring chip having micro-springs in contact with the contact pads to form interconnects, a chemical activator on one of either the pad chip or the spring chip, and an adhesive responsive to the chemical activator on the other of either the pad chip or the spring chip.Type: GrantFiled: May 22, 2009Date of Patent: March 26, 2013Assignee: Palo Alto Research Center IncorporatedInventors: Christopher L. Chua, Bowen Cheng, Eugene M. Chow, Dirk De Bruyker
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Patent number: 8399296Abstract: A method of assembling a package includes aligning a pad chip with a spring chip to form at least one interconnect in an interconnect area, adhering the pad chip to the spring chip so that there is a gap between the pad chip and the spring chip, dispensing underfill material into the gap to seal the interconnect area from an environment external to the package, and curing the underfill material to form a solid mold.Type: GrantFiled: October 9, 2011Date of Patent: March 19, 2013Assignee: Palo Alto Research Center IncorporatedInventors: Christopher L. Chua, Bowen Cheng, Eugene M. Chow, Dirk De Bruyker
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Publication number: 20130052758Abstract: Approaches for substantially removing bulk aluminum nitride (AlN) from one or more layers epitaxially grown on the bulk AlN are discussed. The bulk AlN is exposed to an etchant during an etching process. During the etching process, the thickness of the bulk AlN can be measured and used to control etching.Type: ApplicationFiled: August 25, 2011Publication date: February 28, 2013Applicant: PALO ALTO RESEARCH CENTER INCORPORATEDInventors: Brent S. Krusor, Christopher L. Chua, Thomas Wunderer, Noble M. Johnson, Bowen Cheng
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Publication number: 20120088330Abstract: A method of assembling a package includes aligning a pad chip with a spring chip to form at least one interconnect in an interconnect area, adhering the pad chip to the spring chip so that there is a gap between the pad chip and the spring chip, dispensing underfill material into the gap to seal the interconnect area from an environment external to the package, and curing the underfill material to form a solid mold.Type: ApplicationFiled: October 9, 2011Publication date: April 12, 2012Applicant: PALO ALTO RESEARCH CENTER INCORPORATEDInventors: Christopher L. Chua, Bowen Cheng, Eugene M. Chow, Dirk De Bruyker
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Patent number: 8039938Abstract: A package includes a pad chip having contact pads, a spring chip having micro-springs in contact with the contact pads to form interconnects, the area in which the micro-springs contact the contact pads forming an interconnect area, an assembly material between the pad chip and the spring chip arranged to form a gap between the pad chip and the spring chip, and an underfill material in a portion of the gap to form a mold from the pad chip and the spring chip. A package includes a pad chip having contact pads, a spring chip having micro-springs in contact with the contact pads to form interconnects, the area in which the micro-springs contact the contact pads forming an interconnect area, an assembly material between the pad chip and the spring chip arranged to form a gap between the pad chip and the spring chip, an underfill material in the gap to form a mold from the pad chip and the spring chip, and at least one wall between the underfill material and the interconnect area.Type: GrantFiled: May 22, 2009Date of Patent: October 18, 2011Assignee: Palo Alto Research Center IncorporatedInventors: Christopher L. Chua, Bowen Cheng, Eugene M. Chow, Dirk De Bruyker
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Publication number: 20100295164Abstract: A package includes a pad chip having contact pads, a spring chip having micro-springs in contact with the contact pads to form interconnects, the area in which the micro-springs contact the contact pads forming an interconnect area, an assembly material between the pad chip and the spring chip arranged to form a gap between the pad chip and the spring chip, and an underfill material in a portion of the gap to form a mold from the pad chip and the spring chip. A package includes a pad chip having contact pads, a spring chip having micro-springs in contact with the contact pads to form interconnects, the area in which the micro-springs contact the contact pads forming an interconnect area, an assembly material between the pad chip and the spring chip arranged to form a gap between the pad chip and the spring chip, an underfill material in the gap to form a mold from the pad chip and the spring chip, and at least one wall between the underfill material and the interconnect area.Type: ApplicationFiled: May 22, 2009Publication date: November 25, 2010Applicant: Palo Alto Research Center IncorporatedInventors: Christopher L. Chua, Bowen Cheng, Eugene M. Chow, Dirk De Bruyker
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Publication number: 20100295165Abstract: A package has a pad chip having contact pads, a spring chip having micro-springs in contact with the contact pads to form interconnects, the area in which the micro-springs contact the contact pads forming an interconnect area, a chemical activator in the interconnect area, and an adhesive responsive to the chemical activator in the interconnect area. A package has a pad chip having contact pads, a spring chip having micro-springs in contact with the contact pads to form interconnects, a chemical activator on one of either the pad chip or the spring chip, and an adhesive responsive to the chemical activator on the other of either the pad chip or the spring chip.Type: ApplicationFiled: May 22, 2009Publication date: November 25, 2010Applicant: Palo Alto Research Center IncorporatedInventors: Christopher L. Chua, Bowen Cheng, Eugene M. Chow, Dirk De Bruyker