Patents by Inventor Bowen Cheng

Bowen Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20150233703
    Abstract: Spatially modulated light emanating from an object moving along a flow path is used to determine various object characteristics including object length along the flow direction. Light emanating from at least one object moving along in a flow path along a flow direction of a spatial filter is sensed. The intensity of the sensed light is time modulated according to features of the spatial filter. A time varying electrical signal is generated which includes a plurality of pulses in response to the sensed light. Pulse widths of at least some of the pulses are measured at a fraction of a local extremum of the pulses. The length of the object along the flow direction is determined based on the measured pulse widths.
    Type: Application
    Filed: February 14, 2014
    Publication date: August 20, 2015
    Applicant: Palo Alto Research Center Incorporated
    Inventors: Joerg Martini, Marshall W. Bern, Noble M. Johnson, Peter Kiesel, Doron Kletter, Bowen Cheng, Michael I. Recht
  • Patent number: 8908161
    Abstract: Approaches for substantially removing bulk aluminum nitride (AlN) from one or more layers epitaxially grown on the bulk AlN are discussed. The bulk AlN is exposed to an etchant during an etching process. During the etching process, the thickness of the bulk AlN can be measured and used to control etching.
    Type: Grant
    Filed: August 25, 2011
    Date of Patent: December 9, 2014
    Assignee: Palo Alto Research Center Incorporated
    Inventors: Brent S. Krusor, Christopher L. Chua, Thomas Wunderer, Noble M. Johnson, Bowen Cheng
  • Publication number: 20140265848
    Abstract: An ionic wind engine unit for cooling semiconductor circuit assemblies includes a curved micro-spring and an associated electrode that are maintained apart at an appropriate gap distance such that, when subjected to a sufficiently high voltage potential (i.e., as determined by Peek's Law), current crowding at the spring's tip portion creates an electrical field that sufficiently ionizes neutral molecules in a portion of the air-filled region surrounding the tip portion to generate a micro-plasma event. In one engine type the electrode is a metal pad, and in a second engine type the electrode is a second micro-spring. Ionic wind cooling is generated, for example, between an IC die and a base substrate in a flip-chip arrangement, by controlling multiple engines disposed on the facing surfaces to produce an air current in the air gap region separating the IC device and base substrate.
    Type: Application
    Filed: March 13, 2013
    Publication date: September 18, 2014
    Applicant: Palo Alto Research Center Incorporated
    Inventors: Bowen Cheng, Dirk DeBruyker, Eugene M. Chow
  • Publication number: 20140231745
    Abstract: A light emitting device includes a p-side heterostructure having a short period superlattice (SPSL) formed of alternating layers of AlxhighGa1-xhighN doped with a p-type dopant and AlxlowGa1-xlowN doped with the p-type dopant, where xlow?xhigh?0.9. Each layer of the SPSL has a thickness of less than or equal to about six bi-layers of AlGaN.
    Type: Application
    Filed: September 14, 2012
    Publication date: August 21, 2014
    Applicant: PALO ALTO RESEARCH CENTER INCORPORATED
    Inventors: John E. Northrup, Bowen Cheng, Christopher L. Chua, Thomas Wunderer, Noble M. Johnson, Zhihong Yang
  • Patent number: 8736049
    Abstract: Micro-plasma is generated at the tip of a micro-spring by applying a positive voltage to the spring's anchor portion and a negative voltage to an electrode maintained a fixed gap distance from the spring's tip portion. By generating a sufficiently large voltage potential (i.e., as determined by Peek's Law), current crowding at the tip portion of the micro-spring creates an electrical field that sufficiently ionizes neutral molecules in a portion of the air-filled region surrounding the tip portion to generate a micro-plasma event. Ionic wind air currents are generated by producing multiple micro-plasma events using micro-springs disposed in a pattern to produce a pressure differential that causes air movement over the micro-springs. Ionic wind cooling is produced by generating such ionic wind air currents, for example, in the gap region between an IC die and a base substrate disposed in a flip-chip arrangement.
    Type: Grant
    Filed: March 13, 2013
    Date of Patent: May 27, 2014
    Assignee: Palo Alto Research Center Incorporated
    Inventors: Bowen Cheng, Dirk DeBruyker, Eugene M. Chow
  • Patent number: 8652878
    Abstract: A method includes providing a pad chip having contact pads, providing a spring chip having micro-springs, applying a chemical activator to one of either the pad chip or the spring chip, applying an adhesive responsive to the chemical activator on the other of the pad chip or the spring chip, aligning the pad chip to the spring chip such that the micro-springs will contact the contact pads, and pressing the pad chip and the spring chip together such that the chemical activator at least partially cures the adhesive.
    Type: Grant
    Filed: March 13, 2013
    Date of Patent: February 18, 2014
    Assignee: Palo Alto Research Center Incorporated
    Inventors: Christopher L. Chua, Bowen Cheng, Eugene M. Chow, Dirk De Bruyker
  • Patent number: 8405198
    Abstract: A package has a pad chip having contact pads, a spring chip having micro-springs in contact with the contact pads to form interconnects, the area in which the micro-springs contact the contact pads forming an interconnect area, a chemical activator in the interconnect area, and an adhesive responsive to the chemical activator in the interconnect area. A package has a pad chip having contact pads, a spring chip having micro-springs in contact with the contact pads to form interconnects, a chemical activator on one of either the pad chip or the spring chip, and an adhesive responsive to the chemical activator on the other of either the pad chip or the spring chip.
    Type: Grant
    Filed: May 22, 2009
    Date of Patent: March 26, 2013
    Assignee: Palo Alto Research Center Incorporated
    Inventors: Christopher L. Chua, Bowen Cheng, Eugene M. Chow, Dirk De Bruyker
  • Patent number: 8399296
    Abstract: A method of assembling a package includes aligning a pad chip with a spring chip to form at least one interconnect in an interconnect area, adhering the pad chip to the spring chip so that there is a gap between the pad chip and the spring chip, dispensing underfill material into the gap to seal the interconnect area from an environment external to the package, and curing the underfill material to form a solid mold.
    Type: Grant
    Filed: October 9, 2011
    Date of Patent: March 19, 2013
    Assignee: Palo Alto Research Center Incorporated
    Inventors: Christopher L. Chua, Bowen Cheng, Eugene M. Chow, Dirk De Bruyker
  • Publication number: 20130052758
    Abstract: Approaches for substantially removing bulk aluminum nitride (AlN) from one or more layers epitaxially grown on the bulk AlN are discussed. The bulk AlN is exposed to an etchant during an etching process. During the etching process, the thickness of the bulk AlN can be measured and used to control etching.
    Type: Application
    Filed: August 25, 2011
    Publication date: February 28, 2013
    Applicant: PALO ALTO RESEARCH CENTER INCORPORATED
    Inventors: Brent S. Krusor, Christopher L. Chua, Thomas Wunderer, Noble M. Johnson, Bowen Cheng
  • Publication number: 20120088330
    Abstract: A method of assembling a package includes aligning a pad chip with a spring chip to form at least one interconnect in an interconnect area, adhering the pad chip to the spring chip so that there is a gap between the pad chip and the spring chip, dispensing underfill material into the gap to seal the interconnect area from an environment external to the package, and curing the underfill material to form a solid mold.
    Type: Application
    Filed: October 9, 2011
    Publication date: April 12, 2012
    Applicant: PALO ALTO RESEARCH CENTER INCORPORATED
    Inventors: Christopher L. Chua, Bowen Cheng, Eugene M. Chow, Dirk De Bruyker
  • Patent number: 8039938
    Abstract: A package includes a pad chip having contact pads, a spring chip having micro-springs in contact with the contact pads to form interconnects, the area in which the micro-springs contact the contact pads forming an interconnect area, an assembly material between the pad chip and the spring chip arranged to form a gap between the pad chip and the spring chip, and an underfill material in a portion of the gap to form a mold from the pad chip and the spring chip. A package includes a pad chip having contact pads, a spring chip having micro-springs in contact with the contact pads to form interconnects, the area in which the micro-springs contact the contact pads forming an interconnect area, an assembly material between the pad chip and the spring chip arranged to form a gap between the pad chip and the spring chip, an underfill material in the gap to form a mold from the pad chip and the spring chip, and at least one wall between the underfill material and the interconnect area.
    Type: Grant
    Filed: May 22, 2009
    Date of Patent: October 18, 2011
    Assignee: Palo Alto Research Center Incorporated
    Inventors: Christopher L. Chua, Bowen Cheng, Eugene M. Chow, Dirk De Bruyker
  • Publication number: 20100295164
    Abstract: A package includes a pad chip having contact pads, a spring chip having micro-springs in contact with the contact pads to form interconnects, the area in which the micro-springs contact the contact pads forming an interconnect area, an assembly material between the pad chip and the spring chip arranged to form a gap between the pad chip and the spring chip, and an underfill material in a portion of the gap to form a mold from the pad chip and the spring chip. A package includes a pad chip having contact pads, a spring chip having micro-springs in contact with the contact pads to form interconnects, the area in which the micro-springs contact the contact pads forming an interconnect area, an assembly material between the pad chip and the spring chip arranged to form a gap between the pad chip and the spring chip, an underfill material in the gap to form a mold from the pad chip and the spring chip, and at least one wall between the underfill material and the interconnect area.
    Type: Application
    Filed: May 22, 2009
    Publication date: November 25, 2010
    Applicant: Palo Alto Research Center Incorporated
    Inventors: Christopher L. Chua, Bowen Cheng, Eugene M. Chow, Dirk De Bruyker
  • Publication number: 20100295165
    Abstract: A package has a pad chip having contact pads, a spring chip having micro-springs in contact with the contact pads to form interconnects, the area in which the micro-springs contact the contact pads forming an interconnect area, a chemical activator in the interconnect area, and an adhesive responsive to the chemical activator in the interconnect area. A package has a pad chip having contact pads, a spring chip having micro-springs in contact with the contact pads to form interconnects, a chemical activator on one of either the pad chip or the spring chip, and an adhesive responsive to the chemical activator on the other of either the pad chip or the spring chip.
    Type: Application
    Filed: May 22, 2009
    Publication date: November 25, 2010
    Applicant: Palo Alto Research Center Incorporated
    Inventors: Christopher L. Chua, Bowen Cheng, Eugene M. Chow, Dirk De Bruyker