Abstract: A method for monitoring the source symmetry of a photolithography system is provided. The method includes providing a first reticle; and providing a second reticle. The method also includes forming first bottom overlay alignment marks on a first wafer using the first reticle; and forming first top overlay alignment marks on the first bottom overlay alignment marks using the second reticle. Further, the method includes forming second bottom overlay alignment marks on a second wafer using the first reticle; and forming second top overlay alignment marks on the second bottom overlay alignment marks using the second reticle. Further, the method also include measuring a first overlay shift; measuring a second overlay shift; and obtaining an overlay shift caused by the source asymmetry based on the first overlay shift and the second overlay shift.

Abstract: A method and an apparatus for monitoring an electron beam condition of an SEM are provided. The SEM includes an electron gun and an electromagnetic lens system. The method includes acquiring quality parameters of an input electron beam, wherein the input electron beam is provided by the electron gun to the electromagnetic lens system, acquiring a current set of operation parameters of the electromagnetic lens system, calculating quality parameters of an output electron beam of the electromagnetic lens system, based on the quality parameters of the input electron beam and one or more operation parameters of the current set of operation parameters, and determining, based on the quality parameters of the output electron beam, whether calibration of the SEM is required.

Abstract: A laser annealing device for compensating wafer heat maps and its method are disclosed. A laser annealing device comprises a pump laser source array including of a plurality of pump laser sources for irradiating a tunable mask, each pump laser source emitting pump laser, an annealing laser source for emitting annealing laser and irradiating the tunable mask, and a tunable mask for transmitting at least part of the annealing laser after being irradiated by the pump laser.

Abstract: Methods for detecting an electron beam of a SEM and for detecting fine patterns are provided. Line patterns having a length in a first direction can be formed on a detection sample. A power spectral density (PSD) curve of a standardized model, formed under a same exposure process of the detection sample, can be obtained. An edge contour of each line pattern of the detection sample can be obtained by the SEM and can be sampled at a sampling frequency to obtain a variation range at a sampling point on the edge contour in a second direction that is perpendicular to the first direction. A PSD curve of the detection sample can be obtained according to the variation range and can be compared with the PSD curve of the standardized model to determine whether an electron beam of the SEM has a high quality in the second direction.

Abstract: Methods for detecting an electron beam of a SEM and for detecting fine patterns are provided. Line patterns having a length in a first direction can be formed on a detection sample. A power spectral density (PSD) curve of a standardized model, formed under a same exposure process of the detection sample, can be obtained. An edge contour of each line pattern of the detection sample can be obtained by the SEM and can be sampled at a sampling frequency to obtain a variation range at a sampling point on the edge contour in a second direction that is perpendicular to the first direction. A PSD curve of the detection sample can be obtained according to the variation range and can be compared with the PSD curve of the standardized model to determine whether an electron beam of the SEM has a high quality in the second direction.

Abstract: A method and an apparatus for monitoring an electron beam condition of an SEM are provided. The SEM includes an electron gun and an electromagnetic lens system. The method includes acquiring quality parameters of an input electron beam, wherein the input electron beam is provided by the electron gun to the electromagnetic lens system, acquiring a current set of operation parameters of the electromagnetic lens system, calculating quality parameters of an output electron beam of the electromagnetic lens system, based on the quality parameters of the input electron beam and one or more operation parameters of the current set of operation parameters, and determining, based on the quality parameters of the output electron beam, whether calibration of the SEM is required.

Abstract: A standard wafer is provided including a substrate; a first layer of semiconductor material formed on the substrate; a bar formed over the first layer of semiconductor material with an interlayer interposed therebetween; and a first sidewall spacer and a second sidewall spacer formed on the opposite sides of the bar respectively, in which the bar and the first layer of semiconductor material are formed of a same semiconductor material, and the interlayer interposed between the first layer of semiconductor material and the bar is formed of a first oxide, and the first sidewall spacer and the second sidewall spacer are formed of a second oxide. A corresponding fabrication method of the standard wafer is also provided.