Patents by Inventor Bo Y. Lee

Bo Y. Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Liquid phase diffusion bonding using high diffusivity element as insert material
    Patent number: 5221039
    Abstract: A liquid phase diffusion bonding method using an insert material such as B,C,Si and Hf having a high diffusivity and a melting point higher than that of the base metal is disclosed. During the bonding, the insert material is not melted, but the insert material and the base metal are reacted with each other in such a manner that the diffusion bonding can be carried out under a non-oxidizing atmosphere at a temperature lower than the melting point of the insert material.
    Type: Grant
    Filed: May 3, 1991
    Date of Patent: June 22, 1993
    Assignee: Korean Institute of Machinery and Metals
    Inventors: Jae P. Jung, Bo Y. Lee, Choon S. Kang