Patents by Inventor Boyce G. Kimmel

Boyce G. Kimmel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Ethnyl terminated polyimide composites
    Patent number: 4100138
    Abstract: A new class of copolymers obtained via the copolymerization of diethynylbenzene with an ethynyl-substituted polyimide oligomer has been used to prepare composite materials exhibiting zero void content. The copolymers are thermosetting in character and are particularly useful for the fabrication of composite structures such as glass fiber reinforced laminates and molding compounds and graphite fiber reinforced laminates and molding compounds.
    Type: Grant
    Filed: May 12, 1975
    Date of Patent: July 11, 1978
    Assignee: Hughes Aircraft Company
    Inventors: Norman Bilow, Boyce G. Kimmel
  • Low temperature curing resin system
    Patent number: 3989673
    Abstract: A new system of epoxy resins and curing agents is disclosed which may be cured at low temperatures to yield polymeric materials capable of providing excellent binders for filled systems. The new combination exhibits a useful pot life, and cures at low temperatures to form a tough, dimensionally stable polymer.
    Type: Grant
    Filed: December 30, 1974
    Date of Patent: November 2, 1976
    Assignee: Hughes Aircraft Company
    Inventors: Robert K. Jenkins, Boyce G. Kimmel, Gary Luster