Patents by Inventor Boyd Coomer

Boyd Coomer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Dielectric with fluorescent material
    Publication number: 20050123860
    Abstract: The invention provides fluorescent material in dielectric material. This allows detection of whether an imprinting tool has properly formed features in the dielectric material, and allows detection of when some dielectric material has stuck to the imprinting tool.
    Type: Application
    Filed: December 3, 2003
    Publication date: June 9, 2005
    Inventors: Paul Koning, Boyd Coomer, Robert Edgeworth
  • Multi-layer integrated circuit package
    Publication number: 20050009353
    Abstract: Adhesive material is applied to a surface of a metallic core layer. The adhesive material is removed from a conductive region of the metallic core layer. A metallic contact is provided over the conductive region of the metallic core layer. The metallic core layer is laminated to an imprinted buildup layer, the buildup layer having a dielectric region and a conductive region, wherein a nonconductive region of the metallic core layer is bonded to the dielectric region of the buildup layer and the conductive region of the metallic core layer is bonded to the conductive region of the imprinted-buildup layer.
    Type: Application
    Filed: August 11, 2004
    Publication date: January 13, 2005
    Inventors: Boyd Coomer, Michael Walk