Abstract: At least one method, apparatus and system disclosed herein involves performing a wafer to wafer feedback control of process performed on a semiconductor substrate. A first process on a first semiconductor wafer of a run of semiconductor wafers is performed using a processing tool. A first gas analysis of a gas in the processing tool is performed upon performing the first process. Determining a process feedback adjustment based upon a result of the first gas analysis. Data relating to the process feedback adjustment is provided. Performing a second process on a second semiconductor wafer based on the data relating to the process feedback adjustment.

Abstract: Semiconductor device fabrication systems and methods are provided. In an example, a semiconductor device fabrication system includes a semiconductor fabrication tool. Further, the semiconductor device fabrication system includes wireless sensors associated with the semiconductor fabrication tool. The wireless sensors measure process parameters of the fabrication tool and transmit wireless signals. The semiconductor device fabrication system also includes a sensor controller configured to identify the wireless sensors associated with the semiconductor fabrication tool and to receive the wireless signals from the wireless sensors. The semiconductor device fabrication system further includes a tool controller including a receiver for receiving data from the sensor controller. The tool controller is configured to sequentially assign system variable identifiers (SVID) to the data from the sensor controller, and to contextualize the data in data packets.

Abstract: Systems for and methods of detecting faults in semiconductor wafers are provided. One method includes, for instance: monitoring, with at least one sensor, a recipe for manufacturing a semiconductor wafer; tracking, with a fault detection system, a set of steps for the recipe; determining a start of a step; sensing a set of data related to at least one parameter of the step; generating, by an imaging system, an image of the set of data; displaying, on a display, the image of the set of data; calculating, by the fault detection system, a pixel area ratio from the image of the set of data; determining if a fault exists in the wafer based upon the pixel area ratio; and displaying, on the display, an indication of the fault during real-time and at an end of the step.

Abstract: Semiconductor device fabrication systems and methods are provided. In an example, a semiconductor device fabrication system includes a semiconductor fabrication tool. Further, the semiconductor device fabrication system includes wireless sensors associated with the semiconductor fabrication tool. The wireless sensors measure process parameters of the fabrication tool and transmit wireless signals. The semiconductor device fabrication system also includes a sensor controller configured to identify the wireless sensors associated with the semiconductor fabrication tool and to receive the wireless signals from the wireless sensors. The semiconductor device fabrication system further includes a tool controller including a receiver for receiving data from the sensor controller. The tool controller is configured to sequentially assign system variable identifiers (SVID) to the data from the sensor controller, and to contextualize the data in data packets.

Abstract: Systems for and methods of detecting faults in semiconductor wafers are provided. One method includes, for instance: monitoring, with at least one sensor, a recipe for manufacturing a semiconductor wafer; tracking, with a fault detection system, a set of steps for the recipe; determining a start of a step; sensing a set of data related to at least one parameter of the step; generating, by an imaging system, an image of the set of data; displaying, on a display, the image of the set of data; calculating, by the fault detection system, a pixel area ratio from the image of the set of data; determining if a fault exists in the wafer based upon the pixel area ratio; and displaying, on the display, an indication of the fault during real-time and at an end of the step.

Abstract: We disclose a tactile sensing instrumented wafer, which may comprise a substrate; and at least one tactile sensor array disposed on a top surface of the substrate. The at least one tactile sensor array may comprise carbon nanotubes or a piezoelectric transducer. In further embodiments, the instrumented wafer may further comprise a power supply; a memory; a communications interface; and a controller. An instrumented wafer in accordance with embodiments herein may detect both downforce and lateral forces impinging on the wafer, and may be used in a semiconductor device manufacturing system.

Abstract: An apparatus and method for the improved combined edge bead removal and backside wash of spin coated semiconductor wafers is disclosed. This is preferably accomplished by providing a nozzle having a plurality of outlets adapted for the ejection of a cleaning fluid onto the backside of a semiconductor wafer. This cleaning fluid can be EEP or a similar EBR type of solvent. This dual outlet nozzle can be mounted to a stationary EBR arm, and preferably comprises two outlets located on a beveled top surface that are separated at a predetermined angle. The angle of this beveled top surface with respect to a horizontal plane of the processed wafer is preferably about 45 degrees, while the angle of each nozzle outlet with respect to a primary axis of the stationary EBR arm is also preferably about 45 degrees. Other angles are also possible in order to maximize solvent jet efficiency.

Abstract: An apparatus and method for the improved combined edge bead removal and backside wash of spin coated semiconductor wafers is disclosed. This is preferably accomplished by providing a nozzle having a plurality of outlets adapted for the ejection of a cleaning fluid onto the backside of a semiconductor wafer. This cleaning fluid can be EEP or a similar EBR type of solvent. This dual outlet nozzle can be mounted to a stationary EBR arm, and preferably comprises two outlets located on a beveled top surface that are separated at a predetermined angle. The angle of this beveled top surface with respect to a horizontal plane of the processed wafer is preferably about 45 degrees, while the angle of each nozzle outlet with respect to a primary axis of the stationary EBR arm is also preferably about 45 degrees. Other angles are also possible in order to maximize solvent jet efficiency.