Abstract: Portable devices and methods for determining the presence of a target analyte using a portable device are provided. The portable device is preferably hand-held. A sample is injected to the portable device. A microfluidic separation is performed within the portable device and at least one separated component detected by a detection module within the portable device, in embodiments of the invention. A target analyte is identified, based on the separated component, and the presence of the target analyte is indicated on an output interface of the portable device, in accordance with embodiments of the invention.

Abstract: The present embodiment describes a laminar-mixing embodiment that utilizes simple, three-dimensional injection. Also described is the use of the embodiment in combination with wide and shallow sections of channel to affect rapid mixing in microanalytical systems. The shallow channel sections are constructed using all planar micromachining techniques, including those based on isotropic etching. The planar construction enables design using minimum dispersion concepts that, in turn, enable simultaneous mixing and injection into subsequent chromatography channels.

Abstract: The present invention provides methods for selectively stripping tantalum-containing films from oxide surfaces using an etching composition including a fluoride ion source and an acidic oxidant. The etching composition exhibits a high degree of selectivity between tantalum-containing films and oxide films, such that the underlying oxide surface or film layer acts as a stop layer, thereby protecting the underlying substrate from the etching composition. Furthermore, the etching composition is effective at substantially at ambient temperature, thereby avoiding the potential safety concerns that may arise when chemicals are heated in manufacturing situations. Finally, in certain preferred embodiments, the etching composition may further comprise a non-acidic oxidant. In these embodiments of the invention the etching composition is useful to reclaim wafers having at least a portion of the wafer substrate exposed, eg., wafers bearing film stacks comprising TEOS.