Patents by Inventor Boyd Slade

Boyd Slade has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070085678
    Abstract: The disclosure is directed to a sensor device including processing circuitry, at least one sensor coupled to the processing circuitry, a serial data interface coupled to the processing circuitry and memory responsive to the processing circuitry. The memory includes a static unique identification number. The serial data interface provides access to retrieve the static unique identification number and sensed data measured with the at least one sensor from the memory.
    Type: Application
    Filed: November 6, 2006
    Publication date: April 19, 2007
    Inventors: Ryan Joy, Michael Primm, Ronald Graczyk, David Smith, Boyd Slade
  • Publication number: 20050016451
    Abstract: A microdeposition apparatus and method according to the invention includes an interchangeable microdeposition head for depositing fluid manufacturing material on a substrate to form microstructures. The apparatus includes at least one of a plurality of microdeposition heads mounted on a head support and held above a substrate, which is mounted on a stage in controlled alignment with the microdeposition head. The control system coordinates the relative movement of the stage and microdeposition head while the fluid manufacturing material is discharged from the microdeposition head. A mounting bracket and computer system enable various microdeposition heads to be interchangeably used with the microdeposition apparatus.
    Type: Application
    Filed: May 31, 2002
    Publication date: January 27, 2005
    Inventors: Charles Edwards, David Albertalli, James Middleton, Boyd Slade
  • Patent number: 5602721
    Abstract: An expandable system such as a computer system includes a plurality of stacked functional modules with each module engaging an abutting module in a physically locked relationship. Electric power for the modular system is provided to all modules through power lines within each module housing for EMI shielding with abutting modules having mating electric power connectors.
    Type: Grant
    Filed: December 22, 1995
    Date of Patent: February 11, 1997
    Assignee: Tandem Computers
    Inventors: Boyd Slade, Walter R. Carver, Brad D. Caramagno, Henry S. Coleman