Patents by Inventor Boyi FU
Boyi FU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11964359Abstract: Implementations described herein generally relate to polishing articles and methods of manufacturing polishing articles used in polishing processes and cleaning processes. More particularly, implementations disclosed herein relate to composite polishing articles having graded properties. In one implementation, a polishing article is provided. The polishing article comprises one or more exposed first regions formed from a first material and having a first zeta potential and one or more second exposed regions formed from a second material and having a second zeta potential, wherein the first zeta potential is different from the second zeta potential.Type: GrantFiled: October 23, 2019Date of Patent: April 23, 2024Assignee: APPLIED MATERIALS, INC.Inventors: Ashwin Chockalingham, Mahendra C. Orilall, Mayu Yamamura, Boyi Fu, Rajeev Bajaj, Daniel Redfield
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Publication number: 20240123568Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and methods of manufacturing the same. According to one or more embodiments, a method for forming or otherwise preparing a polishing article by sequentially forming a plurality of polymer layers is provided and includes: (a) dispensing a plurality of droplets of a polymer precursor composition onto a surface of a previously formed at least partially cured polymer layer, where the polymer precursor composition contains a first precursor component containing an epoxide group and a photoinitiator component which generates a photoacid when exposed to UV light, (b) at least partially curing the plurality of droplets to form an at least partially cured polymer layer, and (c) repeating (a) and (b).Type: ApplicationFiled: June 21, 2023Publication date: April 18, 2024Inventors: Sivapackia GANAPATHIAPPAN, Boyi FU, Ashwin CHOCKALINGAM, Daniel REDFIELD, Rajeev BAJAJ, Mahendra C. ORILALL, Hou T. NG, Jason G. FUNG, Mayu YAMAMURA
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Publication number: 20240118538Abstract: An electronic device may have optical components that each have first and second transparent layers such as first and second glass layers. The glass layers may have outer surfaces that face away from each other and inner surfaces that face towards each other. A polymer layer is formed between the inner surfaces of the glass layers. Along the periphery of each optical component, a hermetic seal is formed to protect the polymer material of the polymer layer. The seal may include one or more metal layers that are coupled to the first and second glass layers. Alternatively or additionally, the seal may include an internal seal, such as a metal foil layer that extends between the first and second glass layers, within the optical component to reduce the width of the optical component.Type: ApplicationFiled: December 18, 2023Publication date: April 11, 2024Inventors: Wei Lin, Boyi Fu, Nathan K Gupta
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Publication number: 20240092065Abstract: An electronic device may have optical components that each have first and second transparent layers such as first and second glass layers. The glass layers may have outer surfaces that face away from each other and inner surfaces that face towards each other. A polymer layer is formed between the inner surfaces of the glass layers. Along the periphery of each optical component, a hermetic seal is formed to protect the polymer material of the polymer layer. The seal may include one or more metal layers that are coupled to the first and second glass layers. For example, glass prism rings may be coupled to the first and second glass layers and metal may be coupled to the prism rings. The one or more metal layers may then be bonded to the metal on the prism rings, such as through soldering.Type: ApplicationFiled: August 29, 2023Publication date: March 21, 2024Inventors: Wei Lin, Boyi Fu, Nathan K Gupta
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Publication number: 20240074665Abstract: An electronic device includes a housing defining an internal volume, a front opening, and a rear opening. The electronic device can include a display component disposed at the front opening and a rear cover disposed at the rear opening. A logic board can be disposed in the internal volume. The device can also include a thin film thermopile including a cold junction bonded to the logic board and a hot junction bonded to the rear cover.Type: ApplicationFiled: December 28, 2022Publication date: March 7, 2024Inventors: Daniel J. Hiemstra, Jeffrey W. Buchholz, Xiaofan Niu, James C. Clements, Wei Lin, Habib S. Karaki, Paul Mansky, Boyi Fu, Yanfeng Chen, Edmilson Besseler
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Patent number: 11843025Abstract: An apparatus for positioning micro-devices on a substrate includes one or more supports to hold a donor substrate and a destination substrate, an adhesive dispenser to deliver adhesive on micro-devices on the donor substrate, a transfer device including a transfer surface to transfer the micro-devices from the donor substrate to the destination substrate, and a controller. The controller is configured to operate the adhesive dispenser to selectively dispense the adhesive onto selected micro-devices on the donor substrate based on a desired spacing of the selected micro-devices on the destination substrate. The controller is configured to operate the transfer device such that the transfer surface engages the adhesive on the donor substrate to cause the selected micro-devices to adhere to the transfer surface and the transfer surface then transfers the selected micro-devices from the donor substrate to the destination substrate.Type: GrantFiled: February 11, 2022Date of Patent: December 12, 2023Assignee: Applied Materials, Inc.Inventors: Mingwei Zhu, Sivapackia Ganapathiappan, Boyi Fu, Hou T. Ng, Nag B. Patibandla
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Publication number: 20230382085Abstract: An electronic device may have optical components that each have first and second transparent layers such as first and second glass layers. The glass layers may have outer surfaces that face away from each other and inner surfaces that face towards each other. A polymer layer is formed between the inner surfaces of the glass layers. Along the periphery of each optical component, a hermetic seal is formed to protect the polymer material of the polymer layer. The seal may have a moisture barrier layer that is attached to the first and second glass layers. The moisture barrier layer may be supported by an elastomeric buffer member. The moisture barrier layer may be formed from metal film or a polymer layer or other substrate that is coated with a moisture-impermeable coating. The moisture-impermeable coating may be formed from one or more thin-film metal layers and/or one more thin-film dielectric layers.Type: ApplicationFiled: August 9, 2023Publication date: November 30, 2023Inventors: Zachary M Beiley, Brent J Bollman, Derrick T Carpenter, Benjamin P Cherniawski, Boyi Fu, Nathan K Gupta, Wei Lin, Graham C Nelson, Isik I Nugay Ozel, Zhipeng Pan, Alexander D Schlaupitz, Kristina M Serratto, Ying-Da Wang, Da Yu, Tyler A Marshall
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Patent number: 11826876Abstract: In one implementation, a method of forming a porous polishing pad is provided. The method comprises depositing a plurality of composite layers with a 3D printer to reach a target thickness. Depositing the plurality of composite layers comprises dispensing one or more droplets of a curable resin precursor composition onto a support. Depositing the plurality of composite layers further comprises dispensing one or more droplets of a porosity-forming composition onto the support, wherein at least one component of the porosity-forming composition is removable to form the pores in the porous polishing pad.Type: GrantFiled: April 4, 2019Date of Patent: November 28, 2023Assignee: Applied Materials, Inc.Inventors: Sivapackia Ganapathiappan, Boyi Fu, Ashwin Chockalingam, Ankit Vora, Daniel Redfield, Rajeev Bajaj, Nag B. Patibandla, Hou T. Ng, Sudhakar Madhusoodhanan
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Publication number: 20230330805Abstract: Implementations disclosed herein generally relate to polishing articles and methods for manufacturing polishing articles used in polishing processes. More specifically, implementations disclosed herein relate to porous polishing pads produced by processes that yield improved polishing pad properties and performance, including tunable performance. Additive manufacturing processes, such as three-dimensional printing processes provides the ability to make porous polishing pads with unique properties and attributes.Type: ApplicationFiled: April 24, 2023Publication date: October 19, 2023Applicant: Applied Materials, Inc.Inventors: Sivapackia GANAPATHIAPPAN, Nag B. PATIBANDLA, Rajeev BAJAJ, Daniel REDFIELD, Fred C. REDEKER, Mahendra C. ORILALL, Boyi FU, Mayu YAMAMURA, Ashwin CHOCKALINGAM
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Patent number: 11772229Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, addition polymer precursor compounds, catalysts, and curing agents.Type: GrantFiled: March 11, 2019Date of Patent: October 3, 2023Assignee: Applied Materials, Inc.Inventors: Sivapackia Ganapathiappan, Boyi Fu, Ashwin Chockalingam, Daniel Redfield, Rajeev Bajaj, Mahendra C. Orilall, Hou T. Ng, Jason G. Fung, Mayu Yamamura
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Publication number: 20230294239Abstract: Methods and formulations for manufacturing polishing articles used in polishing processes are provided. In one implementation, a UV curable resin precursor composition is provided. The UV curable resin precursor comprises a precursor formulation. The precursor formulation comprises a first resin precursor component that comprises a semi-crystalline radiation curable oligomeric material, wherein the semi-crystalline radiation curable oligomeric material is selected from a semi-crystalline aliphatic polyester urethane acrylate, a semi-crystalline aliphatic polycarbonate urethane acrylate, a semi-crystalline aliphatic polyether urethane acrylate, or combinations thereof. The precursor formulation further comprises a second resin precursor component that comprises a monofunctional or multifunctional acrylate monomer.Type: ApplicationFiled: May 25, 2023Publication date: September 21, 2023Inventors: Sivapackia GANAPATHIAPPAN, Ankit VORA, Boyi FU, Venkat HARIHARAN, Mayu YAMAMURA, Mario CORNEJO, Igor ABRAMSON, Mo YANG, Daniel REDFIELD, Rajeev BAJAJ, Nag B. PATIBANDLA
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Patent number: 11745302Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, addition polymer precursor compounds, catalysts, and curing agents.Type: GrantFiled: March 22, 2021Date of Patent: September 5, 2023Assignee: APPLIED MATERIALS, INC.Inventors: Sivapackia Ganapathiappan, Boyi Fu, Ashwin Chockalingam, Daniel Redfield, Rajeev Bajaj, Mahendra C. Orilall, Hou T. Ng, Jason G. Fung, Mayu Yamamura
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Patent number: 11724362Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.Type: GrantFiled: December 8, 2020Date of Patent: August 15, 2023Assignee: APPLIED MATERIALS, INC.Inventors: Rajeev Bajaj, Daniel Redfield, Mahendra C. Orilall, Boyi Fu, Aniruddh Jagdish Khanna, Jason G. Fung, Ashwin Chockalingam, Mayu Yamamura, Veera Raghava Reddy Kakireddy, Gregory E. Menk, Nag B. Patibandla
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Patent number: 11685014Abstract: Methods and formulations for manufacturing polishing articles used in polishing processes are provided. In one implementation, a UV curable resin precursor composition is provided. The UV curable resin precursor comprises a precursor formulation. The precursor formulation comprises a first resin precursor component that comprises a semi-crystalline radiation curable oligomeric material, wherein the semi-crystalline radiation curable oligomeric material is selected from a semi-crystalline aliphatic polyester urethane acrylate, a semi-crystalline aliphatic polycarbonate urethane acrylate, a semi-crystalline aliphatic polyether urethane acrylate, or combinations thereof. The precursor formulation further comprises a second resin precursor component that comprises a monofunctional or multifunctional acrylate monomer.Type: GrantFiled: August 2, 2019Date of Patent: June 27, 2023Assignee: Applied Materials, Inc.Inventors: Sivapackia Ganapathiappan, Ankit Vora, Boyi Fu, Venkat Hariharan, Mayu Yamamura, Mario Cornejo, Igor Abramson, Mo Yang, Daniel Redfield, Rajeev Bajaj, Nag B. Patibandla
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Patent number: 11644617Abstract: A system may include one or more electronic devices. Fiber bundles may be provided to convey light. A fiber bundle may have a bend along its length. Fibers for the fiber bundle may be formed from polymer cores coated with polymer claddings. The fibers may have end faces coated with antireflection coatings. The antireflection coatings may be formed from amorphous fluoropolymer deposited from solution. The fluoropolymer may be applied to the end faces of the fibers by dipping, spraying, or by dispensing with a needle dispenser or other dispensing tool. An optical component such as a light-emitting device for a communications system, an illumination system, or a sensor system may provide infrared light that is guided through the fiber bundle.Type: GrantFiled: August 20, 2021Date of Patent: May 9, 2023Assignee: Apple Inc.Inventors: Shenglin Ye, Wei Lin, Prabhakar Gulgunje, Shubhaditya Majumdar, Boyi Fu, Sudirukkuge T. Jinasundera, Nathan K. Gupta
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Publication number: 20230122927Abstract: The present disclosure relates to a small object detection method and apparatus, a readable storage medium, and an electronic device. The method includes: inputting a to-be-detected image to a pre-trained small object detection model; and separately encoding and decoding information of the to-be-detected image in the small object detection model using a desubpixel convolution operation and a subpixel convolution operation running in pair: and extracting features in the to-be-detected image through the small object detection model, and outputting an object's category and location in the to-be-detected image. The present disclosure aims at solving the technical problem in the prior art that traditional FPNs fail to consider the correlation between the downsampling in the backbone network and the upsampling in the neck network during feature fusion, which leads to redundant operations and information loss.Type: ApplicationFiled: August 29, 2022Publication date: April 20, 2023Inventors: Xiaolin Qin, Xin Lan, Yongxiang GU, Boyi Fu, Yuncong Peng, Dong Huang
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Publication number: 20230052048Abstract: Embodiments described herein relate to integrated abrasive (IA) polishing pads, and methods of manufacturing IA polishing pads using, at least in part, surface functionalized abrasive particles in an additive manufacturing process, such as a 3D inkjet printing process. In one embodiment, a method of forming a polishing article includes dispensing a first plurality of droplets of a first precursor, curing the first plurality of droplets to form a first layer comprising a portion of a sub-polishing element, dispensing a second plurality of droplets of the first precursor and a second precursor onto the first layer, and curing the second plurality of droplets to form a second layer comprising portions of the sub-polishing element and portions of a plurality of polishing elements. Here, the second precursor includes functionalized abrasive particles having a polymerizable group chemically bonded to surfaces thereof.Type: ApplicationFiled: September 16, 2022Publication date: February 16, 2023Inventors: Ashavani KUMAR, Ashwin CHOCKALINGAM, Sivapackia GANAPATHIAPPAN, Rajeev BAJAJ, Boyi FU, Daniel REDFIELD, Nag B. PATIBANDLA, Mario Dagio CORNEJO, Amritanshu SINHA, Yan ZHAO, Ranga Rao ARNEPALLI, Fred C. REDEKER
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Publication number: 20220402091Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material, and structural properties, and new methods of manufacturing the same. In one or more embodiments, polishing pads with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Some embodiments may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, addition polymer precursor compounds, catalysts, and curing agents. For example, advanced polishing pads may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one polymer precursor composition followed by at least one curing step, where each layer may represent at least one polymer composition, and/or regions of different compositions.Type: ApplicationFiled: June 7, 2022Publication date: December 22, 2022Inventors: Sivapackia GANAPATHIAPPAN, Boyi FU, Ashwin CHOCKALINGAM, Daniel REDFIELD, Rajeev BAJAJ, Mahendra C. ORILALL, Hou T. NG, Jason G. FUNG, Mayu YAMAMURA
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Patent number: 11471999Abstract: Embodiments described herein relate to integrated abrasive (IA) polishing pads, and methods of manufacturing IA polishing pads using, at least in part, surface functionalized abrasive particles in an additive manufacturing process, such as a 3D inkjet printing process. In one embodiment, a method of forming a polishing article includes dispensing a first plurality of droplets of a first precursor, curing the first plurality of droplets to form a first layer comprising a portion of a sub-polishing element, dispensing a second plurality of droplets of the first precursor and a second precursor onto the first layer, and curing the second plurality of droplets to form a second layer comprising portions of the sub-polishing element and portions of a plurality of polishing elements. Here, the second precursor includes functionalized abrasive particles having a polymerizable group chemically bonded to surfaces thereof.Type: GrantFiled: July 23, 2018Date of Patent: October 18, 2022Assignee: APPLIED MATERIALS, INC.Inventors: Ashavani Kumar, Ashwin Chockalingam, Sivapackia Ganapathiappan, Rajeev Bajaj, Boyi Fu, Daniel Redfield, Nag B. Patibandla, Mario Dagio Cornejo, Amritanshu Sinha, Yan Zhao, Ranga Rao Arnepalli, Fred C. Redeker
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Patent number: 11446788Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.Type: GrantFiled: August 15, 2019Date of Patent: September 20, 2022Assignee: APPLIED MATERIALS, INC.Inventors: Rajeev Bajaj, Daniel Redfield, Mahendra C. Orilall, Boyi Fu, Ashwin Chockalingam, Ashavani Kumar, Fred C. Redeker, Nag B. Patibandla