Patents by Inventor Boyle C. CHENG

Boyle C. CHENG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240416125
    Abstract: Disclosed herein is a method for delivery stimulation to targeted deep brain structures by supplementing existing method using external electrodes with transnasal electrodes, disposed, for example, in the olfactory cleft and within the hyenoid sinus, or, more broadly, in the nasal cavity and/or in the sinuses, including, but not limited to, the frontal, ethmoidal, sphenoid sinus, etc. The method allows stimulation and/or sensing in deep brain regions which can be inaccessible from the scalp or for which existing methods are ineffective in targeting. The method can also be used for power delivery to implants that might be placed inside the brain or on its surface.
    Type: Application
    Filed: June 13, 2024
    Publication date: December 19, 2024
    Applicant: CARNEGIE MELLON UNIVERSITY
    Inventors: Mats Forssell, Yuxin Guo, Yuhyun Lee, Vishal Jain, Chaitanya Goswami, Ariel Feldman, Neil Ashim Mehta, Boyle C. Cheng, Pulkit Grover
  • Publication number: 20230037593
    Abstract: A poroelastic biomaterial including a polyaryletherketone (PAEK) matrix polymer and a plurality of tortuous channels extending from one surface to another surface of the biomaterial is disclosed. Advantageously, the poroelastic biomaterial can have a porosity from about 5% to about 40% and high mechanical properties. The poroelastic biomaterials can be fabricated into orthopedic implant devices and can be used as a tissue scaffolds.
    Type: Application
    Filed: July 26, 2022
    Publication date: February 9, 2023
    Inventors: Tim HSU, Minren LIN, Saadyah AVERICK, Boyle C. CHENG