Abstract: A semiconductor structure and a method for forming the semiconductor structure are provided. The semiconductor structure includes: a substrate including a first surface and a second surface, which includes a plurality of active areas arranged along a first direction and in parallel along a second direction; a plurality of first recesses arranged in the substrate; a word line gate structure disposed in a first recess, which includes a first side wall and a second side wall, wherein the second side wall is adjacent to an active area; a first isolation structure disposed in the first recess and disposed between the word line gate structure and an active area; a plurality of capacitor structures disposed on the first surface and electrically coupled with an active area; and a plurality of bit lines disposed on the second surface, which are arranged along the first direction and parallel to the second direction.

Abstract: This application provides a pre-connector and a communications device. The pre-connector includes a connector component and an outdoor component. The connector component includes a ferrule base and a ferrule that is slidable relative to the ferrule base. The ferrule base is configured to fasten the optical cable, and the ferrule is connected to an optical fiber that is of the optical cable and that is inserted into the ferrule base. In this way, the optical fiber can be connected to the communications device by using the ferrule. The outdoor component includes: a spindle that is sleeved on the ferrule base and that is fastened to the ferrule base; and a handle sleeve sleeved on the spindle. The outdoor component is used as a connecting piece to be detachably fastened and connected to the communications device, so as to provide a locking force used when the communications device is connected.

Abstract: This application provides a pre-connector and a communications device. The pre-connector includes a connector component and an outdoor component. The connector component includes a ferrule base and a ferrule that is slidable relative to the ferrule base. The ferrule base is configured to fasten the optical cable, and the ferrule is connected to an optical fiber that is of the optical cable and that is inserted into the ferrule base. In this way, the optical fiber can be connected to the communications device by using the ferrule. The outdoor component includes: a spindle that is sleeved on the ferrule base and that is fastened to the ferrule base; and a handle sleeve sleeved on the spindle. The outdoor component is used as a connecting piece to be detachably fastened and connected to the communications device, so as to provide a locking force used when the communications device is connected.

Abstract: Embodiments of this application provide a closure, including a housing and an adapter element. The adapter element includes a tube and a first connection part and a second connection part that communicate with each other inside, the first connection part is located inside the housing, the second connection part is located outside the housing, one end of the tube is located in the first connection part, and the other end of the tube is located in the second connection part. The first connection part is configured to connect to a first connector disposed in the housing, and the second connection part is configured to connect to a second connector outside the housing. In addition, the housing, the first connection part, and the second connection part are of an integral structure as a whole.

Abstract: A semiconductor structure and a method for forming the semiconductor structure are provided. The semiconductor structure includes: a substrate including a first surface and a second surface, which includes a plurality of active areas arranged along a first direction and in parallel along a second direction; a plurality of first recesses arranged in the substrate; a word line gate structure disposed in a first recess, which includes a first side wall and a second side wall, wherein the second side wall is adjacent to an active area; a first isolation structure disposed in the first recess and disposed between the word line gate structure and an active area; a plurality of capacitor structures disposed on the first surface and electrically coupled with an active area; and a plurality of bit lines disposed on the second surface, which are arranged along the first direction and parallel to the second direction.

Abstract: A semiconductor structure and a forming method therefor. The forming method comprises: providing a first substrate, which has opposite first and second faces, and comprises several discrete active regions arranged in a first direction and parallel to a second direction that is perpendicular to the first direction, wherein the first face exposes an isolation layer disposed between adjacent active regions; forming in the first substrate several first recesses, which extend from the first face to the second face, are arranged in the second direction, and penetrates the active regions in the first direction, and have a bottom with a distance less than the thickness of the isolation layer from the first face; forming word line gate structures within the first recesses; thinning the first substrate from the second face; and forming on the second face bit lines, wherein one active region and one bit line are electrically interconnected.

Abstract: This application provides a pre-connector and a communications device. The pre-connector includes a connector component and an outdoor component. The connector component includes a ferrule base and a ferrule that is slidable relative to the ferrule base. The ferrule base is configured to fasten the optical cable, and the ferrule is connected to an optical fiber that is of the optical cable and that is inserted into the ferrule base. In this way, the optical fiber can be connected to the communications device by using the ferrule. The outdoor component includes: a spindle that is sleeved on the ferrule base and that is fastened to the ferrule base; and a handle sleeve sleeved on the spindle. The outdoor component is used as a connecting piece to be detachably fastened and connected to the communications device, so as to provide a locking force used when the communications device is connected.

Abstract: An optical fiber sub-assembly includes: a handle, a rear retainer, an optical cable, a field mountable connector (FMC) assembly, a spindle, and a protection hood fixedly connected to the spindle. An end of the optical cable is connected to the FMC assembly, the optical cable protrudes from a first end of the FMC assembly. The FMC assembly includes a ferrule provided at a second end of the FMC assembly. The spindle is sleeved outside the first end of the FMC assembly, and the protection hood is sleeved outside the second end of the FMC assembly. An end of the spindle that is away from the protection hood is connected to the rear retainer and is used to fasten the optical cable. The handle is sleeved outside the protection hood and the spindle.

Abstract: This application provides a pre-connector and a communications device. The pre-connector includes a connector component and an outdoor component. The connector component includes a ferrule base and a ferrule that is slidable relative to the ferrule base. The ferrule base is configured to fasten the optical cable, and the ferrule is connected to an optical fiber that is of the optical cable and that is inserted into the ferrule base. In this way, the optical fiber can be connected to the communications device by using the ferrule. The outdoor component includes: a spindle that is sleeved on the ferrule base and that is fastened to the ferrule base; and a handle sleeve sleeved on the spindle. The outdoor component is used as a connecting piece to be detachably fastened and connected to the communications device, so as to provide a locking force used when the communications device is connected.

Abstract: Provided is a dynamic control method that turns off a primary-side switching transistor when an output voltage exceeds an upper limit, and control the switching of a secondary-side synchronous rectification transistor with a fixed cycle and a fixed duty cycle. During the time that the synchronous rectification transistor is turned on, the energy of a load capacitor at the output end is extracted to the primary side, which causes the output voltage to drop rapidly and the overshoot voltage to decrease greatly.

Abstract: An optical fiber sub-assembly includes: a handle, a rear retainer, an optical cable, a field mountable connector (FMC) assembly, a spindle, and a protection hood fixedly connected to the spindle. An end of the optical cable is connected to the FMC assembly, the optical cable protrudes from a first end of the FMC assembly. The FMC assembly includes a ferrule provided at a second end of the FMC assembly. The spindle is sleeved outside the first end of the FMC assembly, and the protection hood is sleeved outside the second end of the FMC assembly. An end of the spindle that is away from the protection hood is connected to the rear retainer and is used to fasten the optical cable. The handle is sleeved outside the protection hood and the spindle.

Abstract: Embodiments provide a splice closure and a method for installing an optical cable. The splice closure includes a closure body, a cable accommodating tray, a nut component, an abutting member, and an elastic member. The abutting member is located between an optical cable and the nut component, and the elastic member is located between the optical cable and an installation tube. When the nut component is screwed to an externally threaded section of the installation tube by using threads of an internally threaded section, the abutting member abuts the elastic member, so that the elastic member elastically deforms under an abutting effect of the abutting member, so as to cause an inner circumferential wall of the elastic member that elastically deforms to abut the optical cable, and an outer circumferential wall of the elastic member that elastically deforms to abut an inner circumferential wall of the installation tube.

Abstract: Provided is a dynamic control method that turns off a primary-side switching transistor when an output voltage exceeds an upper limit, and control the switching of a secondary-side synchronous rectification transistor with a fixed cycle and a fixed duty cycle. During the time that the synchronous rectification transistor is turned on, the energy of a load capacitor at the output end is extracted to the primary side, which causes the output voltage to drop rapidly and the overshoot voltage to decrease greatly.

Abstract: Embodiments provide a splice closure and a method for installing an optical cable. The splice closure includes a closure body, a cable accommodating tray, a nut component, an abutting member, and an elastic member. The abutting member is located between an optical cable and the nut component, and the elastic member is located between the optical cable and an installation tube. When the nut component is screwed to an externally threaded section of the installation tube by using threads of an internally threaded section, the abutting member abuts the elastic member, so that the elastic member elastically deforms under an abutting effect of the abutting member, so as to cause an inner circumferential wall of the elastic member that elastically deforms to abut the optical cable, and an outer circumferential wall of the elastic member that elastically deforms to abut an inner circumferential wall of the installation tube.

Abstract: A capacitor and a method of fabricating thereof are provided. A structure of low pressure tetraethyl orthosilicate—low pressure silicon nitride—low pressure tetraethyl orthosilicate is used in the capacitor to replace the oxide-nitride-oxide structure of the existing capacitor; the capacitor has a relatively high unit capacitance value. Furthermore, the structure of low pressure tetraethyl orthosilicate—low pressure silicon nitride—low pressure tetraethyl orthosilicate is fabricaited by low pressure chemical vapor deposition method at relatively low temperature; thus the heat produced in the whole process is relatively low, which is insufficient to make the semiconductor device shift or make the gate metal layer or the metallized silicon layer peel off. Accordingly, the capacitor and the method of fabricating the capacitor of the present invention can be well applied in the process of the 0.5 ?m PIP capacitor or below 0.5 ?m.

Abstract: A capacitor and a method of fabricating thereof are provided. A structure of low pressure tetraethyl orthosilicate-low pressure silicon nitride-low pressure tetraethyl orthosilicate is used in the capacitor to replace the oxide-nitride-oxide structure of the existing capacitor; the capacitor has a relatively high unit capacitance value. Furthermore, the structure of low pressure tetraethyl orthosilicate—low pressure silicon nitride—low pressure tetraethyl orthosilicate is fabricaited by low pressure chemical vapor deposition method at relatively low temperature; thus the heat produced in the whole process is relatively low, which is insufficient to make the semiconductor device shift or make the gate metal layer or the metallized silicon layer peel off. Accordingly, the capacitor and the method of fabricating the capacitor of the present invention can be well applied in the process of the 0.5 ?m PIP capacitor or below 0.5 ?m.