Patents by Inventor Bo-Yu Liu

Bo-Yu Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11966241
    Abstract: A circuit includes a voltage divider circuit configured to generate a feedback voltage according to an output voltage, an operational amplifier configured to output a driving signal according to the feedback voltage and a reference voltage and a pass gate circuit including multiple current paths. The current paths are controlled by the driving signal and connected in parallel between the voltage divider circuit and a power reference node.
    Type: Grant
    Filed: February 11, 2022
    Date of Patent: April 23, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Huan-Neng Chen, Yen-Lin Liu, Chia-Wei Hsu, Jo-Yu Wu, Chang-Fen Hu, Shao-Yu Li, Bo-Ting Chen
  • Publication number: 20240128231
    Abstract: Semiconductor devices and methods of manufacturing the semiconductor devices are presented. In embodiments the methods of manufacturing include depositing a first bonding layer on a first substrate, wherein the first substrate comprises a semiconductor substrate and a metallization layer. The first bonding layer and the semiconductor substrate are patterned to form first openings. A second substrate is bonded to the first substrate. After the bonding the second substrate, the second substrate is patterned to form second openings, at least one of the second openings exposing at least one of the first openings. After the patterning the second substrate, a third substrate is bonded to the second substrate, and after the bonding the third substrate, the third substrate is patterned to form third openings, at least one of the third openings exposing at least one of the second openings.
    Type: Application
    Filed: January 4, 2023
    Publication date: April 18, 2024
    Inventors: Fu Wei Liu, Pei-Wei Lee, Yun-Chung Wu, Bo-Yu Chiu, Szu-Hsien Lee, Mirng-Ji Lii
  • Publication number: 20110143264
    Abstract: A structure of fuel cell electrode comprises a diffusion layer having a surface, a conductive particle layer formed on the surface of the diffusion layer and a catalyst layer. The conductive particle layer has a plurality of conductive particles and a concavo-convex surface being composed of the conductive particles. The catalyst layer is formed on the concavo-convex surface of the conductive particle layer.
    Type: Application
    Filed: July 1, 2010
    Publication date: June 16, 2011
    Inventors: Ming-San LEE, Bo-Yu LIU, Long-Jeng CHEN
  • Publication number: 20100255408
    Abstract: A fuel cell structure mainly comprises a frame and a membrane electrode assembly. The frame has an inside wall, and the membrane electrode assembly comprises a first electrode, a second electrode, and an electrolyte membrane disposed between the first electrode and the second electrode. The electrolyte membrane having an electrode joint portion and an adhesive portion. The first electrode and the second electrode are laid on two opposite sides of the electrode joint portion separately. The adhesive portion is attached onto the inside wall.
    Type: Application
    Filed: November 25, 2009
    Publication date: October 7, 2010
    Inventors: Ming-San LEE, Long-Jeng Chen, Wei-Ting Shiu, Bo-Yu Liu, Yu-Wei Huang, Wei-Cheng Chan, You-Min Su
  • Publication number: 20100248084
    Abstract: A flexible current collecting fiber bunch comprises a plurality of current collecting fiber conductors and at least one electrical wire. There is an interval between each two adjacent current collecting fiber conductors. The electrical wire used to cascades the current collecting fiber conductors. The flexible current collecting fiber bunch may replace the graphite or metal bipolar commonly plate used in the fuel cell at lowers the pressure needed for a good contact and adds flexibility in the stack design.
    Type: Application
    Filed: November 25, 2009
    Publication date: September 30, 2010
    Inventors: Ming-San Lee, Long-Jeng Chen, Wei-Ting Shiu, Bo-Yu Liu