Abstract: A test fixture for a high pin count surface mounted IC device has a test head assembly connected to an adapter having electrically conductive elements that couple the output of the IC device to test points on the test head assembly. The test points are coupled to conductive pads on the test head assembly via conductive runs. The test head assembly conductive pads mate with conductive pad formed in the electrically conductive elements of the adapter. The conductive elements engage leads on the IC device providing conductive paths between the IC leads an the test points on the test head assembly. The test fixture is secured to the IC device by friction forces between the periphery of the IC device and the inner surface of the adapter. The test fixture or the adapter is usable as a low profile chip carrier by inverting the fixture or adapter and as a circuit board interconnect.

Abstract: A test fixture for a high pin count surface mounted IC device has a test head assembly connected to an adapter having electrically conductive elements that couple the output of the IC device to test points on the test head assembly. The test points are coupled to conductive pads on the test head assembly via conductive runs. The test head assembly conductive pads mate with conductive pad formed in the electrically conductive elements of the adapter. The conductive elements engage leads on the IC device providing conductive paths between the IC leads an the test points on the test head assembly. The test fixture is secured to the IC device by friction forces between the periphery of the IC device and the inner surface of the adapter. The test fixture or the adapter is usable as a low profile chip carrier by inverting the fixture or adapter and as a circuit board interconnect.

Abstract: A high density probe for probing an integrated circuit package in situ on a circuit board has a probe body with a skirt that has alignment surfaces for mating with the package to provide an initial alignment. An alignment plate is elastically mounted within the probe housing internal of the skirt. The alignment plate has serrations between pin holes, the pin holes corresponding to probe pins elastically mounted on the probe housing in a pattern matching the leads of the integrated circuit package. When the probe is pressed down over the integrated circuit package the alignment surfaces within the skirt align the probe to the package, and the serrations mesh with the leads to align the probe pins with the leads, the probe pins extending through the pin holes and maintaining positive contact due to the elastic mounting of the pins.

Abstract: A probe includes a flexible sheet of dielectric material having an opening therein sized and shaped to receive an electronic component mounted on a support member at a major surface thereof, a contact pad exposed at a first main face of the sheet and adjacent the opening therein, and a conductor connecting the contact pad to a terminal of the probe. The probe is positioned with its first main face in confronting relationship with the major surface of the support member and with the opening in the sheet in registration with the electronic component, and pressure is applied to the flexible sheet to bring the contact pad into contact with the test point.

Abstract: A probe for testing a circuit board having a plurality of test points distributed in a predetermined pattern over a main surface of the board comprises a locating member having a plurality of passages therein, the passages being distributed in a pattern corresponding substantially to the predetermined pattern. Probe elements extend in the passages respectively, the probe elements being movable independently of one another in the respective passages. Flexible conductors are connected to the probe elements. When the locating member is in confronting relationship with the main surface of the circuit board and the passages are in register with the test points and pressure is applied to the probe elements, the probe elements are brought into pressure contact with the test points.

Abstract: A probe assembly for use in testing an integrated circuit embodied in an integrated circuit chip in wafer form, comprises a stiff support member formed with an aperture, and a membrane. Both the support member and the membrane comprise dielectric material and portions of conductive material supported by the dielectric material in electrically-insulated relationship. The portions of conductive material of the membrane constitute inner contact elements distributed over a main face of the membrane in a pattern that corresponds to the pattern in which contact areas are distributed over the contact face of the chip under test, outer contact elements distributed about a peripheral region of the membrane in a second pattern, and transmission lines extending from the inner contact elements to the outer contact elements respectively.

Abstract: A post-deflection accelerating and scan expansion lens system (10) is disclosed which may be used in a cathde ray tube (12). The lens system comprises an accelerating and scan expansion lens (70) of the quadrupole type including a pair of coaxial cylindrical electrodes (72, 74) and first and second compensating lenses (66, 78) on opposite ends thereof to provide a bright image of the desired size in sharp focus and great detail on a fluorescent screen in such tube. The first compensating lens (66) is supported adjacent the input of the accelerating and scan expansion lens to provide a linear magnification of the amount of electron beam deflection produced by the vertical and horizontal deflection plates (46, 48 and 50, 52).

Abstract: A cathode ray tube comprises two electron lens means in combination to crossover the electron beam at a second crossover between the two electron lens means with one of the two lens means having a variable voltage applied thereto to dynamically control the location of the beam crossover in order to focus the beam onto a display screen at any location away from the screen center.

Abstract: An electron beam deflection structure for a high frequency cathode-ray tube incorporates a meanderline slow wave circuit that is supported directly by the same glass rods used to support other portions of the CRT's beam forming and deflection system. To accomplish this, elongate loops that serially interconnect a plurality of deflection plate segments are bent away from the plane of the segments (and the beam axis) and joined by integral support strips to the rods. The elimination of a separate support structure for the deflectors greatly reduces manufacturing costs.

Abstract: A cathode ray tube includes first and second electrostatic quadrupole lens between the electron gun and the vertical deflection plates to properly focus the electron beam before it enters the vertical deflection plates. A third electrostatic quadrupole lens is located between the vertical deflection plates and the horizontal deflection plates to enhance the angle of deflection as well as to properly focus the electron beam as it moves from the vertical deflection plates into the horizontal deflection plates. A meshless scan expansion lens follows the horizontal deflection plates and is formed of aligned tubular members having interdigitated sections thereby forming a fourth quadrupole lens which accelerates the electron beam and expands it prior to being impinged onto the fluorescent screen.

Abstract: A cathode ray tube includes first and second electrostatic quadrupole lens between the electron gun and the vertical deflection plates to properly focus the electron beam before it enters the vertical deflection plates. A third electrostatic quadrupole lens is located between the vertical deflection plates and the horizontal deflection plates to enhance the angle of deflection as well as to properly focus the electron beam as it moves from the vertical deflection plates into the horizontal deflection plates. A meshless scan expansion lens follows the horizontal deflection plates and is formed of aligned tubular members having interdigitated sections thereby forming a fourth quadrupole lens which accelerates the electron beam and expands it prior to being impinged onto the fluorescent screen.

Abstract: A system for inputting data into a display device by touch-sensitive contact areas disposed adjacent the display device and including state of the art electronic recognition circuitry associated with the contact areas for synchronously converting the data to discrete elements of information. Specifically, the transparent contact pads are overlayed over a display with each pad coupled with a multiplexer followed by a synchronous quadrature filter function performed by yet another multiplexer in such a manner that data displayed may be altered.

Abstract: An electron beam forming structure includes an anode having first and second sections spaced from each other with the first section being closest to the cathode and having a beam-admitting aperture and being connected to a positive potential and the second section having a beam-limiting aperture and being connected to ground relative to the first section. The first section will repel positive ions created in an area adjacent the beam-limiting aperture and deflect them away from the source of the electron beam so they can be collected at the second section.