Patents by Inventor Brad Drew

Brad Drew has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods of fabricating robust integrated heat spreader designs and structures formed thereby
    Patent number: 8174113
    Abstract: Methods and associated structures of forming an indium containing solder material directly on an active region of a copper IHS is enabled. A copper indium containing solder intermetallic is formed on the active region of the IHS. The solder intermetallic improves the solder-TIM integration process for microelectronic packaging applications.
    Type: Grant
    Filed: September 17, 2008
    Date of Patent: May 8, 2012
    Assignee: Intel Corporation
    Inventors: Abhishek Gupta, Mike Boyd, Carl Deppisch, Jinlin Wang, Daewoong Suh, Brad Drew
  • Methods of fabricating robust integrated heat spreader designs and structures formed thereby
    Publication number: 20100065246
    Abstract: Methods and associated structures of forming an indium containing solder material directly on an active region of a copper HIS is enabled. A copper indium containing solder intermetallic is formed on the active region of the IHS. The solder intermetallic improves the solder-TIM integration process for microelectronic packaging applications.
    Type: Application
    Filed: September 17, 2008
    Publication date: March 18, 2010
    Inventors: Abhishek Gupta, Mike Boyd, Carl Deppisch, Jinlin Wang, Daewoong Suh, Brad Drew