Patents by Inventor Brad Drew
Brad Drew has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20210199683Abstract: Flow-control system includes a fluid reservoir configured to store a fluid, a pressure accumulator in flow communication with and positioned downstream from the fluid reservoir, and a loading zone that is configured to receive and fluidly couple to a flow cell having a biological or chemical sample. The loading zone is in flow communication with and positioned downstream from the pressure accumulator. The flow-control system also includes a system pump in flow communication with and positioned downstream from the loading zone. The system pump is configured to induce a flow of the fluid from the fluid reservoir and through the pressure accumulator and the loading zone. The pressure accumulator is configured to receive fluid from the fluid reservoir during a filling operation. The pressure accumulator is configured to impart pressure on the fluid and drive the fluid toward the loading zone during a pressure-assist operation.Type: ApplicationFiled: March 11, 2021Publication date: July 1, 2021Inventors: Michael J. Stone, Brad Drews, Erik Williamson
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Patent number: 10976334Abstract: Flow-control system includes a fluid reservoir configured to store a fluid, a pressure accumulator in flow communication with and positioned downstream from the fluid reservoir, and a loading zone that is configured to receive and fluidly couple to a flow cell having a biological or chemical sample. The loading zone is in flow communication with and positioned downstream from the pressure accumulator. The flow-control system also includes a system pump in flow communication with and positioned downstream from the loading zone. The system pump is configured to induce a flow of the fluid from the fluid reservoir and through the pressure accumulator and the loading zone. The pressure accumulator is configured to receive fluid from the fluid reservoir during a filling operation. The pressure accumulator is configured to impart pressure on the fluid and drive the fluid toward the loading zone during a pressure-assist operation.Type: GrantFiled: August 17, 2016Date of Patent: April 13, 2021Assignee: ILLUMINA, INC.Inventors: Michael J. Stone, Brad Drews, Erik Williamson
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Publication number: 20200233004Abstract: Flow-control system includes a fluid reservoir configured to store a fluid, a pressure accumulator in flow communication with and positioned downstream from the fluid reservoir, and a loading zone that is configured to receive and fluidly couple to a flow cell having a biological or chemical sample. The loading zone is in flow communication with and positioned downstream from the pressure accumulator. The flow-control system also includes a system pump in flow communication with and positioned downstream from the loading zone. The system pump is configured to induce a flow of the fluid from the fluid reservoir and through the pressure accumulator and the loading zone. The pressure accumulator is configured to receive fluid from the fluid reservoir during a filling operation. The pressure accumulator is configured to impart pressure on the fluid and drive the fluid toward the loading zone during a pressure-assist operation.Type: ApplicationFiled: August 17, 2016Publication date: July 23, 2020Inventors: Michael J. Stone, Brad DREWS, Erik WILLIAMSON
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Patent number: 9776403Abstract: An ink manifold for use with a heater chip in an inkjet printhead, including a first planar surface and a second opposite planar surface, a plurality of ink channels located on the first planar surface of the ink manifold for supplying ink to the heater chip, and a plurality of ink ports located on the second opposite planar surface of the ink manifold, each of the plurality of ink ports being in liquid communication with a respective one of the plurality of ink channels, each of the plurality of ink channels having a bottom wall defined by bottom wall portions that rise from each ink port within the ink channel to a maximum height at an angle of at least 12 degrees.Type: GrantFiled: January 26, 2017Date of Patent: October 3, 2017Assignee: Funai Electric Co., Ltd.Inventors: Greg Long, Jamey Anderson, Brad Drews
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Publication number: 20170199210Abstract: Detection apparatus includes a microfluorometer having an objective, an excitation radiation source, and a detector. The detection apparatus also includes a fluidic system for delivering reagents from a reagent cartridge to a flow cell. The fluidic system includes a manifold body having a plurality of fluidic channels configured for fluid communication between the reagent cartridge and the flow cell. The fluidic system also includes a plurality of reagent sippers. The fluidic system also includes a valve configured to mediate fluid between reagent reservoirs and the flow cell. The detection apparatus also includes a flow cell latch clamp module having a clamp cover for holding the flow cell. The objective is configured to direct excitation radiation from the radiation source to the flow cell and to direct emission from the flow cell to the detector. The microfluorometer is movable to acquire wide-field images of different areas of the flow cell.Type: ApplicationFiled: January 11, 2017Publication date: July 13, 2017Applicants: Illumina, Inc., Illumina Singapore Pte LtdInventors: Beng Keong Ang, Heng Kuang Cheng, John M. Beirle, Brad Drews, David Kaplan
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Publication number: 20170144440Abstract: An ink manifold for use with a heater chip in an inkjet printhead, including a first planar surface and a second opposite planar surface, a plurality of ink channels located on the first planar surface of the ink manifold for supplying ink to the heater chip, and a plurality of ink ports located on the second opposite planar surface of the ink manifold, each of the plurality of ink ports being in liquid communication with a respective one of the plurality of ink channels, each of the plurality of ink channels having a bottom wall defined by bottom wall portions that rise from each ink port within the ink channel to a maximum height at an angle of at least 12 degrees.Type: ApplicationFiled: January 26, 2017Publication date: May 25, 2017Inventors: Greg Long, Jamey Anderson, Brad Drews
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Patent number: 9573373Abstract: An ink manifold for use with a heater chip in an inkjet printhead, including a first planar surface and a second opposite planar surface, a plurality of ink channels located on the first planar surface of the ink manifold for supplying ink to the heater chip, and a plurality of ink ports located on the second opposite planar surface of the ink manifold, each of the plurality of ink ports being in liquid communication with a respective one of the plurality of ink channels, each of the plurality of ink channels having a bottom wall defined by bottom wall portions that rise from each ink port within the ink channel to a maximum height at an angle of at least 12 degrees.Type: GrantFiled: June 10, 2016Date of Patent: February 21, 2017Assignee: Funai Electric Co, Ltd.Inventors: Greg Long, Jamey Anderson, Brad Drews
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Publication number: 20160279941Abstract: An ink manifold for use with a heater chip in an inkjet printhead, including a first planar surface and a second opposite planar surface, a plurality of ink channels located on the first planar surface of the ink manifold for supplying ink to the heater chip, and a plurality of ink ports located on the second opposite planar surface of the ink manifold, each of the plurality of ink ports being in liquid communication with a respective one of the plurality of ink channels, each of the plurality of ink channels having a bottom wall defined by bottom wall portions that rise from each ink port within the ink channel to a maximum height at an angle of at least 12 degrees.Type: ApplicationFiled: June 10, 2016Publication date: September 29, 2016Inventors: Greg LONG, Jamey ANDERSON, Brad DREWS
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Patent number: 9375929Abstract: An ink manifold for use with a heater chip in an inkjet printhead, including a first planar surface and a second opposite planar surface, a plurality of ink channels located on the first planar surface of the ink manifold for supplying ink to the heater chip, and a plurality of ink ports located on the second opposite planar surface of the ink manifold, each of the plurality of ink ports being in liquid communication with a respective one of the plurality of ink channels, each of the plurality of ink channels having a bottom wall defined by bottom wall portions that rise from each ink port within the ink channel to a maximum height at an angle of at least 12 degrees.Type: GrantFiled: January 27, 2016Date of Patent: June 28, 2016Assignee: Funai Electric Co., Ltd.Inventors: Greg Long, Jamey Anderson, Brad Drews
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Publication number: 20160136956Abstract: An ink manifold for use with a heater chip in an inkjet printhead, including a first planar surface and a second opposite planar surface, a plurality of ink channels located on the first planar surface of the ink manifold for supplying ink to the heater chip, and a plurality of ink ports located on the second opposite planar surface of the ink manifold, each of the plurality of ink ports being in liquid communication with a respective one of the plurality of ink channels, each of the plurality of ink channels having a bottom wall defined by bottom wall portions that rise from each ink port within the ink channel to a maximum height at an angle of at least 12 degrees.Type: ApplicationFiled: January 27, 2016Publication date: May 19, 2016Inventors: Greg LONG, Jamey ANDERSON, Brad DREWS
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Patent number: 9278524Abstract: An ink manifold for use with a heater chip in an inkjet printhead, including a first planar surface and a second opposite planar surface, a plurality of ink channels located on the first planar surface of the ink manifold for supplying ink to the heater chip, and a plurality of ink ports located on the second opposite planar surface of the ink manifold, each of the plurality of ink ports being in liquid communication with a respective one of the plurality of ink channels, each of the plurality of ink channels having a bottom wall defined by bottom wall portions that rise from each ink port within the ink channel to a maximum height at an angle of at least 12 degrees.Type: GrantFiled: February 25, 2014Date of Patent: March 8, 2016Assignee: Funai Electric Co., Ltd.Inventors: Greg Long, Jamey Anderson, Brad Drews
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Publication number: 20150239245Abstract: An ink manifold for use with a heater chip in an inkjet printhead, including a first planar surface and a second opposite planar surface, a plurality of ink channels located on the first planar surface of the ink manifold for supplying ink to the heater chip, and a plurality of ink ports located on the second opposite planar surface of the ink manifold, each of the plurality of ink ports being in liquid communication with a respective one of the plurality of ink channels, each of the plurality of ink channels having a bottom wall defined by bottom wall portions that rise from each ink port within the ink channel to a maximum height at an angle of at least 12 degrees.Type: ApplicationFiled: February 25, 2014Publication date: August 27, 2015Applicant: FUNAI ELECTRIC CO., LTD.Inventors: Greg LONG, Jamey ANDERSON, Brad DREWS
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Publication number: 20150209786Abstract: Some embodiments of the methods and compositions provided herein include inversion plates and delivery plates. Such inversion plates and delivery plates are useful for the transfer of fluid reagents to multiwell plates.Type: ApplicationFiled: January 28, 2015Publication date: July 30, 2015Inventors: Matthew Hage, Kenneth M. Kuhn, Brad Drews, Keith Wyshak, Tim Blauwkamp
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Patent number: 8174113Abstract: Methods and associated structures of forming an indium containing solder material directly on an active region of a copper IHS is enabled. A copper indium containing solder intermetallic is formed on the active region of the IHS. The solder intermetallic improves the solder-TIM integration process for microelectronic packaging applications.Type: GrantFiled: September 17, 2008Date of Patent: May 8, 2012Assignee: Intel CorporationInventors: Abhishek Gupta, Mike Boyd, Carl Deppisch, Jinlin Wang, Daewoong Suh, Brad Drew
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Publication number: 20100065246Abstract: Methods and associated structures of forming an indium containing solder material directly on an active region of a copper HIS is enabled. A copper indium containing solder intermetallic is formed on the active region of the IHS. The solder intermetallic improves the solder-TIM integration process for microelectronic packaging applications.Type: ApplicationFiled: September 17, 2008Publication date: March 18, 2010Inventors: Abhishek Gupta, Mike Boyd, Carl Deppisch, Jinlin Wang, Daewoong Suh, Brad Drew
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Patent number: D729403Type: GrantFiled: January 31, 2014Date of Patent: May 12, 2015Assignee: Illumina, Inc.Inventors: Matthew Hage, Kenneth M. Kuhn, Brad Drews, Keith Wyshak, Tim Blauwkamp
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Patent number: D745698Type: GrantFiled: February 3, 2014Date of Patent: December 15, 2015Assignee: Illumina, Inc.Inventors: Matthew Hage, Kenneth M. Kuhn, Mark Nibbe, Brad Drews, Keith Wyshak, Tim Blauwkamp
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Patent number: D750272Type: GrantFiled: December 16, 2013Date of Patent: February 23, 2016Assignee: Illumina, Inc.Inventors: Matthew Hage, Kenneth M. Kuhn, Brad Drews, Keith Wyshak, Tim Blauwkamp
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Patent number: D752770Type: GrantFiled: December 16, 2013Date of Patent: March 29, 2016Assignee: Illumina, Inc.Inventors: Kenneth M. Kuhn, Matthew Hage, Brad Drews, Keith Wyshak, Tim Blauwkamp
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Patent number: D768870Type: GrantFiled: December 16, 2013Date of Patent: October 11, 2016Assignee: Illumina, Inc.Inventors: Kenneth M. Kuhn, Matthew Hage, Brad Drews, Keith Wyshak, Tim Blauwkamp