Abstract: Systems and methods of independent thermal control of devices under test (DUTs) (e.g., memory devices) are disclosed herein. DUTs are coupled to dedicated cooling channels that include one or more controllable fans. The fans can be controlled independently according to temperature information of the DUTs, which is typically measured by an internal temperature sensor disposed in the DUTs. The fans of the cooling channels can be top-mounted (e.g., downdraft), bottom-mounted (e.g., updraft), or mounted on the front side of a DUT. Each cooling channel also has an exhaust channel on the front, top, and/or bottom of the channel for releasing heat. Advantageously, the air in the channel is guided by a shroud or cover placed over the DUT that can include internal vectored louvres, ridges, fins, ducts, chambers, etc., for directing air across surfaces of the DUT to evenly and efficiently cool the DUT during testing.

Abstract: High density packaging of multiple semiconductor devices creates very large packages that are demanding to test reliably. The fabrication process causes imperfections such as distortion due to differential thermal expansion rates of attached parts. The loss of flatness creates a problem for reliable connectivity in a test environment leading to frequent wear in test receptacles. A novel approach to mitigate connection uncertainties offers greater reliability with much reduced down time for maintenance.

Abstract: Embodiments of the present invention provide memory device (e.g., SSD) enclosures and shrouds that can receive and house SSDs of a specific form factor width, and can advantageously be selectively adapted to house and cool SSDs of a narrower form factor width using an adapter. The SSD shrouds described herein can guide SSDs into the correct position and orientation to be housed by the enclosure for quick and convenient installation, and advantageously redirect the air flow for effective cooling during operation to increase performance of the drive, optionally using internal fins to guide the airflow. Micro fans can be disposed on the top and/or bottom of the enclosure to improve air intake or exhaust. The SSD enclosures and adapters of the present invention obviate the need for differently sized SSD enclosures for specific device form factors and widths, which reduces costs and overhead when running multiple SSDs.

Abstract: Embodiments of the present invention provide a DUT air duct shroud that can receive and house DUTs of a specific form factor, and can advantageously be adapted to house and cool DUTs of a different (e.g., narrower) form factor. The DUT shrouds described herein guide the DUT into the correct position and orientation to be received by the test system for quick and convenient installation, and advantageously redirect the air flow to the narrower form factor for effective cooling during testing. The DUT shrouds can be used in conjunction with device interface boards and similar components used to test memory devices and computer hardware using active cooling systems, and embodiments are also operable to house and cool consumer memory devices of different form factors.

Abstract: Systems and methods of independent thermal control of devices under test (DUTs) (e.g., memory devices) are disclosed herein. DUTs are coupled to dedicated cooling channels that include one or more controllable fans. The fans can be controlled independently according to temperature information of the DUTs, which is typically measured by an internal temperature sensor disposed in the DUTs. The fans of the cooling channels can be top-mounted (e.g., downdraft), bottom-mounted (e.g., updraft), or mounted on the front side of a DUT. Each cooling channel also has an exhaust channel on the front, top, and/or bottom of the channel for releasing heat. Advantageously, the air in the channel is guided by a shroud or cover placed over the DUT that can include internal vectored louvres, ridges, fins, ducts, chambers, etc., for directing air across surfaces of the DUT to evenly and efficiently cool the DUT during testing.