Abstract: Microelectronic integrated circuit package structures include a package structure comprising an embedded bridge interconnect structure within a substrate, the embedded interconnect bridge structure having a plurality of vias extending through a silicon layer, the silicon layer having two or more scallop structures. A non-conductive layer is on a first side of the silicon layer, and a dielectric layer is on a second side of the silicon layer. A plurality of die contacts are at least partially on a surface of the dielectric layer. A first die is over the embedded interconnect bridge structure, the first die coupled to the plurality of die contacts. A second die is over the embedded interconnect bridge structure, adjacent to the first die, the second die coupled to the plurality of die contacts.