Abstract: A deformable yet mechanically resilient microcapsule having electrical properties, a method of making the microcapsules, and a circuit component including the microcapsules. The microcapsule containing a gallium liquid metal alloy core having from about 60 to about 100 wt. % gallium and at least one alloying metal, and a polymeric shell encapsulating the liquid core, said polymeric shell having conductive properties.

Abstract: A deformable yet mechanically resilient microcapsule having electrical properties, a method of making the microcapsules, and a circuit component including the microcapsules. The microcapsule containing a gallium liquid metal alloy core having from about 60 to about 100 wt.% gallium and at least one alloying metal, and a polymeric shell encapsulating the liquid core, said polymeric shell having conductive properties.

Abstract: A deformable yet mechanically resilient microcapsule having electrical properties, a method of making the microcapsules, and a circuit component including the microcapsules. The microcapsule containing a gallium liquid metal alloy core having from about 60 to about 100 wt. % gallium and at least one alloying metal, and a polymeric shell encapsulating the liquid core, said polymeric shell having conductive properties.

Abstract: A deformable yet mechanically resilient microcapsule having electrical properties, a method of making the microcapsules, and a circuit component including the microcapsules. The microcapsule containing a gallium liquid metal alloy core having from about 60 to about 100 wt. % gallium and at least one alloying metal, and a polymeric shell encapsulating the liquid core, said polymeric shell having conductive properties.

Abstract: A deformable yet mechanically resilient microcapsule having electrical properties, a method of making the microcapsules, and a circuit component including the microcapsules. The microcapsule containing a gallium liquid metal alloy core having from about 60 to about 100 wt. % gallium and at least one alloying metal, and a polymeric shell encapsulating the liquid core, said polymeric shell having conductive properties.

Abstract: A reconfigurable electromagnetic device includes a first and second planar layer having facing surfaces. One of the surfaces includes one or more micro-trenches. The area between the two surfaces is filled with an electro-fluid, such as a liquid metal and a second immiscible fluid, such as an inert gas. When pressure is applied, forcing the two surfaces together, Laplace pressure causes the electro-fluid to flow into the trench as the inert fluid is evacuated from the area between the two surfaces, forming an electromagnetic device. The shape of the trenches defines the reconfigurable device, such as circuitry, switch, antenna or the like. When the inert fluid is reintroduced into the area between the two surfaces, the electro-fluid withdraws from the trench, which is the off position, in which the device does not function.

Abstract: A reconfigurable electromagnetic device includes a first and second planar layer having facing surfaces. One of the surfaces includes one or more micro-trenches. The area between the two surfaces is filled with an electro-fluid, such as a liquid metal and a second immiscible fluid, such as an inert gas. When pressure is applied, forcing the two surfaces together, Laplace pressure causes the electro-fluid to flow into the trench as the inert fluid is evacuated from the area between the two surfaces, forming an electromagnetic device. The shape of the trenches defines the reconfigurable device, such as circuitry, switch, antenna or the like. When the inert fluid is reintroduced into the area between the two surfaces, the electro-fluid withdraws from the trench, which is the off position, in which the device does not function.