Patents by Inventor Brad Mays

Brad Mays has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10634450
    Abstract: A firearm stabilizing clip, for use with a firearm having a rear portion and body armor having a front vertical edge. The clip includes a main part having an upper jaw, a lower jaw, and a hinge between the upper jaw and lower jaw. The upper jaw and lower jaw each have a proximal end. A pair of lever rails are selectively attachable to the proximal ends of the upper jaw and lower jaw to open the main part. A stabilizing fin extends from the upper jaw and includes a broad contact surface. Once the main part is secured over the front vertical edge of the body armor, the rear portion of the firearm can rest against the broad contact surface to steady the firearm.
    Type: Grant
    Filed: March 29, 2018
    Date of Patent: April 28, 2020
    Inventors: Luke May, Brad Hibler
  • Patent number: 6898065
    Abstract: A method and apparatus for a mixed-mode operation of an electrostatic chuck in a semiconductor substrate processing system. The chuck is operated in a voltage mode before and after a processing and is operated in a current mode during the processing to suppress arcing during the processing of a substrate.
    Type: Grant
    Filed: July 26, 2002
    Date of Patent: May 24, 2005
    Inventors: Brad Mays, Tetsuya Ishikawa, Sergio Fukuda Shoji
  • Publication number: 20040016405
    Abstract: A method and apparatus for a mixed-mode operation of an electrostatic chuck in a semiconductor substrate processing system. The chuck is operated in a voltage mode before and after a processing and is operated in a current mode during the processing to suppress arcing during the processing of a substrate.
    Type: Application
    Filed: July 26, 2002
    Publication date: January 29, 2004
    Applicant: Applied Materials, Inc.
    Inventors: Brad Mays, Tetsuya Ishikawa, Sergio Fukuda Shoji
  • Patent number: 6575622
    Abstract: The invention solves the problem of continuously monitoring wafer temperature during processing using an optical or fluoro-optical temperature sensor including an optical fiber having an end next to and facing the backside of the wafer. This optical fiber is accommodated without disturbing plasma processing by providing in one of the wafer lift pins an axial void through which the optical fiber passes. The end of the fiber facing the wafer backside is coincident with the end of the hollow lift pin. The other end is coupled via an “external” optical fiber to temperature probe electronics external of the reactor chamber. The invention uses direct wafer temperature measurements with a test wafer to establish a data base of wafer temperature behavior as a function of coolant pressure and a data base of wafer temperature behavior as a function of wafer support or “puck” temperature.
    Type: Grant
    Filed: December 7, 2001
    Date of Patent: June 10, 2003
    Assignee: Applied Materials Inc.
    Inventors: Hamid Norrbakhsh, Mike Welch, Paul Luscher, Siamak Salimian, Brad Mays
  • Publication number: 20030010292
    Abstract: Generally, an electrostatic chuck having a dielectric coating is provided. In one embodiment, an electrostatic chuck includes a support surface, a mounting surface disposed opposite the support surface and at least one side separating the support surface and the mounting surface which defines a support body. One or more conductive members are disposed within the support body to generate an electrostatic attraction between the body and a substrate disposed thereon. A dielectric coating is disposed on the mounting surface of the support body to minimize undesired current leakage therethrough. Optionally, the dielectric coating may be additionally disposed on one or more of the sides and/or the support surface.
    Type: Application
    Filed: July 16, 2001
    Publication date: January 16, 2003
    Applicant: Applied Materials, Inc.
    Inventors: Arnold V. Kholodenko, Michael G. Chafin, Brad Mays, Tetsuya Ishikawa, Ananda H. Kumar, Dennis S. Grimard
  • Publication number: 20020048311
    Abstract: The invention solves the problem of continuously monitoring wafer temperature during processing using an optical or fluoro-optical temperature sensor including an optical fiber having an end next to and facing the backside of the wafer. This optical fiber is accommodated without disturbing plasma processing by providing in one of the wafer lift pins an axial void through which the optical fiber passes. The end of the fiber facing the wafer backside is coincident with the end of the hollow lift pin. The other end is coupled via an “external” optical fiber to temperature probe electronics external of the reactor chamber. The invention uses direct wafer temperature measurements with a test wafer to establish a data base of wafer temperature behavior as a function of coolant pressure and a data base of wafer temperature behavior as a function of wafer support or “puck” temperature.
    Type: Application
    Filed: December 7, 2001
    Publication date: April 25, 2002
    Applicant: Applied Materials, Inc.
    Inventors: Hamid Norrbakhsh, Mike Welch, Paul E. Luscher, Siamak Salimian, Brad Mays
  • Patent number: 6353210
    Abstract: The invention solves the problem of continuously monitoring wafer temperature during processing using an optical or fluoro-optical temperature sensor including an optical fiber having an end next to and facing the backside of the wafer. This optical fiber is accommodated without disturbing plasma processing by providing in one of the wafer lift pins an axial void through which the optical fiber passes. The end of the fiber facing the wafer backside is coincident with the end of the hollow lift pin. The other end is coupled via an “external” optical fiber to temperature probe electronics external of the reactor chamber. The invention uses direct wafer temperature measurements with a test wafer to establish a data base of wafer temperature behavior as a function of coolant pressure and a data base of wafer temperature behavior as a function of wafer support or “puck” temperature.
    Type: Grant
    Filed: April 11, 2000
    Date of Patent: March 5, 2002
    Assignee: Applied Materials Inc.
    Inventors: Hamid Norrbakhsh, Mike Welch, Paul Luscher, Siamak Salimian, Brad Mays
  • Patent number: 6206406
    Abstract: The present invention is an apparatus that will adequately and efficiently dispense a substance, such as fertilizer, repellent, which is removably secured to a conventional tractor to allow for adequate traveling thereof. The present invention includes a frame member and a trailer. The frame member includes a first portion or first boom and a second portion or second boom that are pivotally mounted to the trailer via a pivoting mechanism. Each portion or boom operates is designed and configured to operate independently and travels transversely from the conventional tractor to enable utilization and includes a truss configuration. These booms can be raised or lowered by way of a height adjusting mechanism. In addition, the portions or booms can also be relocated centrally and rearwardly with respect to the tractor for rendering a more compact unit which will provide an easy method for transporting the apparatus from field to field, from field to barn, barn to field, or the like.
    Type: Grant
    Filed: July 27, 1998
    Date of Patent: March 27, 2001
    Inventors: Brad May, Don May, Jr., Fount May, Jr., Fred B. May, John Lawson Taylor, II