Abstract: A kickdown mechanism (12) to provide a kickdown feel to an operator of a pedal assembly (10) is provided. The kickdown mechanism (12) includes a housing (24) that defines a chamber. A plunger (38) is slidable within the chamber (30) along an operational axis (A) while being biased by a spring (44). Detent members (54, 56) contact bearing surfaces (40, 42) of the plunger (38). The detent members (54, 56) are movable between an initial position and a plurality of active positions against the bias of the spring (44) while maintaining contact with the bearing surfaces (40, 42). An actuator (66) engages the detent members (54, 56) and moves the detent members (54, 56) from the initial position to the plurality of active positions when engaged by the pedal arm (16). The bearing surfaces (40, 42) act as a wedge to urge the detent members (54, 56) back to the initial position when the pedal arm (16) is disengaged from the actuator (66).

Abstract: The subject invention provides a pedal assembly (10, 110, 210) for a vehicle and a non-contact position sensor (22). The pedal assembly (10, 110, 210) includes a bracket (12. 112, 212) and a pedal arm (14, 114, 214). A pivot (16) supports the pedal arm (14, 114, 214) for pivotal movement about a pivot axis A. The pivot (16) includes a fixed element (18) and a rotatable element (20). The rotatable element (20) is rotatable relative to the fixed element (18) about the pivot axis A. The position sensor (22) is disposed on the pivot axis A. The position sensor (10, 110, 210) includes a magnetic flux sensor (24) that is supported by one of the elements (18, 20) on the pivot axis A. First (26) and second (28) magnetic poles are supported by the other of the elements (18, 20). The magnetic poles (26, 28) present opposing surfaces (30, 32) of opposite magnetic polarity.

Abstract: An adjustable pedal assembly including a carrier (14) slidably supported on a hollow rod (12) with first (24) and second (26) wedge members (24) and (26) urged up inclined surfaces (34) and (38) by a bolt (28) and spring (30) interconnecting the wedge members (24) and (26). The wedge members (24) and (26) include wedge flanking surfaces (42) in sliding engagement with lips (40) in the rod (12) for forcing the rod (12) into engagement with a bore (41) in the carrier (14) as the wedge members (24) and (26) are moved upwardly by the inclined surfaces (34) and (36).

Abstract: According to one aspect of the invention there is provided a semiconductor chip comprising a semiconductor die, an array of electrical contacts on an integrated circuit in a frontside of the die, and a protective layer on a backside of the die.