Patents by Inventor Brad Tischendorf

Brad Tischendorf has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Implantable medical devices having modular lead bores
    Patent number: 11890484
    Abstract: Implantable medical devices have modular lead bores that are constructed from individual lead bore modules. A given modular lead bore utilizes the number of individual lead bore modules necessary for the particular implantable medical device. Each lead bore module has a lead bore passageway and a feedthrough passageway. An electrical contact is present within the lead bore passageway of each lead bore module and the electrical contact is aligned to the lead bore passageway of a lead bore module. Hermetic feedthrough assemblies are also present within the lead bore passageway of each lead bore module. A feedthrough pin passes through a hermetic feedthrough assembly within a feedthrough passageway of each lead bore module. Each feedthrough pin is electrically coupled to a corresponding electrical contact and the medical device circuitry.
    Type: Grant
    Filed: December 21, 2022
    Date of Patent: February 6, 2024
    Assignee: MEDTRONIC, INC.
    Inventors: Darren A. Janzig, Andrew Thom, Brad Tischendorf, Randy S. Roles, Steven T. Deininger, Nicholas R. Whitehead
  • SPINAL IMPLANTS WITH ELECTRONICS CARTRIDGE AND EXTERNALIZED ANTENNA
    Publication number: 20230320654
    Abstract: A spinal implant includes an electronics portion with a housing defining a sealed cavity for supporting an electronics assembly and a battery therein. The spinal implant further includes at least one antenna in electrical communication with the electronics assembly and at least one sensor in electrical communication with the electronics assembly, wherein the at least one antenna is located external to the housing and is configured to transmit information received from the at least one sensor to an external device.
    Type: Application
    Filed: March 14, 2023
    Publication date: October 12, 2023
    Applicant: Warsaw Orthopedic, Inc.
    Inventors: Brad Tischendorf, Arjun Siby-Kurian, Newton H. Metcalf
  • IMPLANTABLE MEDICAL DEVICES HAVING MODULAR LEAD BORES
    Publication number: 20230127724
    Abstract: Implantable medical devices have modular lead bores that are constructed from individual lead bore modules. A given modular lead bore utilizes the number of individual lead bore modules necessary for the particular implantable medical device. Each lead bore module has a lead bore passageway and a feedthrough passageway. An electrical contact is present within the lead bore passageway of each lead bore module and the electrical contact is aligned to the lead bore passageway of a lead bore module. Hermetic feedthrough assemblies are also present within the lead bore passageway of each lead bore module. A feedthrough pin passes through a hermetic feedthrough assembly within a feedthrough passageway of each lead bore module. Each feedthrough pin is electrically coupled to a corresponding electrical contact and the medical device circuitry.
    Type: Application
    Filed: December 21, 2022
    Publication date: April 27, 2023
    Inventors: Darren A. Janzig, Andrew Thom, Brad Tischendorf, Randy S. Roles, Steven T. Deininger, Nicholas R. Whitehead
  • Implantable medical devices having modular lead bores
    Patent number: 11559695
    Abstract: Implantable medical devices have modular lead bores that are constructed from individual lead bore modules. A given modular lead bore utilizes the number of individual lead bore modules necessary for the particular implantable medical device. Each lead bore module has a lead bore passageway and a feedthrough passageway. An electrical contact is present within the lead bore passageway of each lead bore module and the electrical contact is aligned to the lead bore passageway of a lead bore module. Hermetic feedthrough assemblies are also present within the lead bore passageway of each lead bore module. A feedthrough pin passes through a hermetic feedthrough assembly within a feedthrough passageway of each lead bore module. Each feedthrough pin is electrically coupled to a corresponding electrical contact and the medical device circuitry.
    Type: Grant
    Filed: December 17, 2019
    Date of Patent: January 24, 2023
    Assignee: MEDTRONIC, INC.
    Inventors: Darren A. Janzig, Andrew Thom, Brad Tischendorf, Randy S. Roles, Steven T. Deininger, Nicholas R. Whitehead
  • IMPLANTABLE MEDICAL DEVICES HAVING MODULAR LEAD BORES
    Publication number: 20210178168
    Abstract: Implantable medical devices have modular lead bores that are constructed from individual lead bore modules. A given modular lead bore utilizes the number of individual lead bore modules necessary for the particular implantable medical device. Each lead bore module has a lead bore passageway and a feedthrough passageway. An electrical contact is present within the lead bore passageway of each lead bore module and the electrical contact is aligned to the lead bore passageway of a lead bore module. Hermetic feedthrough assemblies are also present within the lead bore passageway of each lead bore module. A feedthrough pin passes through a hermetic feedthrough assembly within a feedthrough passageway of each lead bore module. Each feedthrough pin is electrically coupled to a corresponding electrical contact and the medical device circuitry.
    Type: Application
    Filed: December 17, 2019
    Publication date: June 17, 2021
    Inventors: Darren A. Janzig, Andrew Thom, Brad Tischendorf, Randy S. Roles, Steven T. Deininger, Nicholas R. Whitehead