Patents by Inventor Brad VANTASSEL

Brad VANTASSEL has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHODS OF SEALING ADDITIVELY PRINTED CHANNELS AND PORTS
    Publication number: 20240335882
    Abstract: A method of manufacturing a target component is disclosed. The method includes inputting, into a binder jetting additive manufacturing system, instructions for manufacturing a desired target component, wherein the target component includes at least one internal channel defined at least by a circuitous path including at least one bend; printing the target component via a binder jet additive manufacturing process to form a green body target component, wherein during the printing at least one port is formed that extends from an external surface of the target component to the at least one internal channel; and depowdering the at least one internal channel by accessing the at least one port formed on the green body target component.
    Type: Application
    Filed: April 10, 2023
    Publication date: October 10, 2024
    Inventors: Richard M. DiCintio, Srikanth C. Kottilingam, Brad VanTassel
  • Weld filler additive and method of welding
    Patent number: 10668575
    Abstract: A method of welding using a weld filler additive and a weld filler additive are provided. The method includes the step of welding the component with a filler additive comprising a sufficient amount of each of Co, Cr, Al, Ti, Mo, Fe, B, C, Nb, and Ni, the component including a hard-to-weld base alloy. The method further includes the step of forming an easy-to-weld target alloy on a surface of the component from the welding.
    Type: Grant
    Filed: March 3, 2017
    Date of Patent: June 2, 2020
    Assignee: GENERAL ELECTRIC COMPANY
    Inventors: Yan Cui, Srikanth Chandrudu Kottilingam, David Vincent Bucci, Brad Vantassel, Cem Eminoglu
  • Weld filler additive and method of welding
    Patent number: 10632572
    Abstract: A method of welding using a weld filler additive and a weld filler additive are provided. The method includes the step of welding the component with a filler additive comprising a sufficient amount of each of W, Co, Cr, Al, Ti, Mo, Fe, B, C, Nb, and Ni, the component including a hard-to-weld base alloy. The method further includes the step of forming an easy-to-weld target alloy on a surface of the component from the welding.
    Type: Grant
    Filed: March 3, 2017
    Date of Patent: April 28, 2020
    Assignee: GENERAL ELECTRIC COMPANY
    Inventors: Yan Cui, Srikanth Chandrudu Kottilingam, David Vincent Bucci, Matthew J. Laylock, Brad Vantassel
  • WELD FILLER ADDITIVE AND METHOD OF WELDING
    Publication number: 20180250777
    Abstract: A method of welding using a weld filler additive and a weld filler additive are provided. The method includes the step of welding the component with a filler additive comprising a sufficient amount of each of Co, Cr, Al, Ti, Mo, Fe, B, C, Nb, and Ni, the component including a hard-to-weld base alloy. The method further includes the step of forming an easy-to-weld target alloy on a surface of the component from the welding.
    Type: Application
    Filed: March 3, 2017
    Publication date: September 6, 2018
    Inventors: Yan CUI, Srikanth Chandrudu KOTTILINGAM, David Vincent BUCCI, Brad VANTASSEL, Cem EMINOGLU
  • WELD FILLER ADDITIVE AND METHOD OF WELDING
    Publication number: 20180250776
    Abstract: A method of welding using a weld filler additive and a weld filler additive are provided. The method includes the step of welding the component with a filler additive comprising a sufficient amount of each of W, Co, Cr, Al, Ti, Mo, Fe, B, C, Nb, and Ni, the component including a hard-to-weld base alloy. The method further includes the step of forming an easy-to-weld target alloy on a surface of the component from the welding.
    Type: Application
    Filed: March 3, 2017
    Publication date: September 6, 2018
    Inventors: Yan CUI, Srikanth Chandrudu KOTTILINGAM, David Vincent BUCCI, Matthew J. LAYLOCK, Brad VANTASSEL