Patents by Inventor Brad Wurm

Brad Wurm has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9920273
    Abstract: Cutting fluids for brittle materials, e.g., silicon ingot, comprise, in weight percent: A. 70-99% polyalkylene glycol (PAG), e.g., polyethylene glycol; B. 0.01-10% PAG-grafted polycarboxylate; and C. 0-30% water. These cutting fluids are used with abrasive materials, e.g., silicon carbide (SiC), to form cutting slurries. The slurry is sprayed on the cutting tool, e.g., a wire saw, to cut a brittle work piece, e.g., a silicon ingot.
    Type: Grant
    Filed: November 16, 2015
    Date of Patent: March 20, 2018
    Assignee: Dow Global Technologies LLC
    Inventors: Yi-Ping Zhu, Wanglin Yu, Fang Li, Daniel A. Aguilar, Brad Wurm
  • Publication number: 20160102265
    Abstract: Cutting fluids for brittle materials, e.g., silicon ingot, comprise, in weight percent: A. 70-99% polyalkylene glycol (PAG), e.g., polyethylene glycol; B. 0.01-10% PAG-grafted polycarboxylate; and C. 0-30% water. These cutting fluids are used with abrasive materials, e.g., silicon carbide (SiC), to form cutting slurries. The slurry is sprayed on the cutting tool, e.g., a wire saw, to cut a brittle work piece, e.g., a silicon ingot.
    Type: Application
    Filed: November 16, 2015
    Publication date: April 14, 2016
    Inventors: Yi-Ping Zhu, Wanglin Yu, Fang Li, Daniel A. Aguilar, Brad Wurm