Abstract: A chip scale package (CSP) structure and the packaging process thereof are described. By using a matrix of interlinked heat sink units compatible with the block substrate, the packaging process can be simplified and a plurality of packages units or chip scale packages with enhanced thermal performance can be obtained after singulation.

Abstract: A stacked type chip package structure employs a substrate having a pseudo-cavity or a keep-out zone at one side or both sides thereof. Through the pattern arrangement of the wiring layer and the solder mask layer, the thickness of the entire stacked type chip package structure is effectively reduced as lower wire loops and a thinner mold-cap can be achieved by mounting the chip within the depressed keep-out zone. In particular, the double-sided chip package structures are suitable for package on package structures adopted by mobile applications.

Abstract: An improved printing member for use in a system wherein a current source, in combination with a resistive ribbon, produces heating in selected areas of the ribbon for effecting the formation of a printing pattern on the printing member, which member is composed of a first layer, having a predetermined melting temperature, and a heat-conducting layer which adheres to the first layer below its predetermined melting temperature and which adheres to said resistive ribbon at temperatures above said predetermined melting temperature, such that, when the second layer is heated to a temperature level above the predetermined melting temperature in selected areas forming a pattern to be printed, the selected areas will adhere to the resistive ribbon and release from the first layer.

Abstract: An improved apparatus and process are described in which metal images are transferred to a softenable receiving layer using commercially available multi-stylus recording heads. The transfer medium is comprised of a resistive layer and a thin metal layer thereon. Electrical currents are provided by the recording styli of the multi-stylus recording head. Localized electrical currents in the resistive layer provide sufficient heat in the metal layer to soften regions of a metable receiving layer when it is brought into contact with said heated metal layer. Metal imaging for use in printed circuit board manufacture and in formation of printing masters can be transferred by this technique.