Patents by Inventor Bradford L. Ryland

Bradford L. Ryland has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Acrylic-epoxy adhesive composition
    Patent number: 11976148
    Abstract: A curable composition comprising: a hydroxy-functional or ether-functional (meth)acrylate copolymer, an epoxy resin; water; a photocatalyst, and optionally a polyvinyl acetal polymer and/or a film-forming polymer. When cured, provides structural bonding adhesives that are curable under high humidity conditions.
    Type: Grant
    Filed: May 30, 2019
    Date of Patent: May 7, 2024
    Assignee: 3M Innovative Properties Company
    Inventors: Kelly A. Volp, Kathleen S. Shafer, Peter O. Rekow, Jonathan E. Janoski, Thomas Q. Chastek, Bradford L. Ryland, Douglas L. Elmore
  • COPOLYMERS OF PERFLUOROCYCLOALIPHATIC METHYL VINYL ETHER
    Publication number: 20220033673
    Abstract: Described herein is a perfluoropolymer and compositions therefrom. The perfluoropolymer is derived from: (a) no more than 88 mol % tetrafluoroethylene monomer; and (b) a complementary amount of a perfluoro (cycloaliphatic methyl vinyl ether) monomer, and has substantially no melting point.
    Type: Application
    Filed: November 13, 2019
    Publication date: February 3, 2022
    Inventors: Miguel A. Guerra, Tatsuo Fukushi, Bradford L. Ryland
  • ACRYLIC-EPOXY ADHESIVE COMPOSITION
    Publication number: 20210206897
    Abstract: A curable composition comprising: a hydroxy-functional or ether-functional (meth)acrylate copolymer, an epoxy resin; water, a photocatalyst, and optionally a polyvinyl acetal polymer and/or a film-forming polymer. When cured, provides structural bonding adhesives that are curable under high humidity conditions.
    Type: Application
    Filed: May 30, 2019
    Publication date: July 8, 2021
    Inventors: Kelly A. Volp, Kathleen S. Shafer, Peter O. Rekow, Jonathan E. Janoski, Thomas Q. Chastek, Bradford L. Ryland, Douglas L. Elmore