Patents by Inventor Bradford Nelson

Bradford Nelson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Substrate with embedded active thermoelectric cooler
    Patent number: 11551995
    Abstract: The present disclosure relates to a substrate that includes a substrate body and a thermoelectric cooler embedded in the substrate body. The thermoelectric cooler includes a top-side plate with an element-contact pad and a bottom-side plate. The element-contact pad is on a top surface of the top-side plate, which faces a same direction as a top surface of the substrate body and is exposed to the external space of the substrate body. The bottom-side plate is below the top-side plate and close to a bottom surface of the top-side plate. Herein, the element-contact pad is configured to accommodate attachment of a heat-generating electrical element. The top-side plate is configured to change temperature of the heat-generating electrical element, and the bottom-side plate is configured to transfer heat to or absorb heat from the bottom surface of the substrate body.
    Type: Grant
    Filed: October 15, 2018
    Date of Patent: January 10, 2023
    Assignee: Qorvo US, Inc.
    Inventors: Mark C. Woods, Kelly M. Lear, Deepukumar M. Nair, Tarak A. Railkar, Bradford Nelson
  • SUBSTRATE WITH EMBEDDED ACTIVE THERMOELECTRIC COOLER
    Publication number: 20190131209
    Abstract: The present disclosure relates to a substrate that includes a substrate body and a thermoelectric cooler embedded in the substrate body. The thermoelectric cooler includes a top-side plate with an element-contact pad and a bottom-side plate. The element-contact pad is on a top surface of the top-side plate, which faces a same direction as a top surface of the substrate body and is exposed to the external space of the substrate body. The bottom-side plate is below the top-side plate and close to a bottom surface of the top-side plate. Herein, the element-contact pad is configured to accommodate attachment of a heat-generating electrical element. The top-side plate is configured to change temperature of the heat-generating electrical element, and the bottom-side plate is configured to transfer heat to or absorb heat from the bottom surface of the substrate body.
    Type: Application
    Filed: October 15, 2018
    Publication date: May 2, 2019
    Inventors: Mark C. Woods, Kelly M. Lear, Deepukumar M. Nair, Tarak A. Railkar, Bradford Nelson