Abstract: The present disclosure provides polyolefin compositions and films and method for producing such films. The polyolefin composition contains about 40 wt % to about 95 wt % of a BOCD polyethylene and about 10 wt % to about 60 wt % of a polypropylene, by weight of the polyolefin composition. The polyolefin composition has a 1% secant flexural modulus MD of greater than 250 MPa and a 1% secant flexural modulus TD of greater than 300 MPa, as determined for a layer of the polyolefin composition having a thickness of about 50 ?m and a Dart Impact (Method A) of greater than 15 g/?m and an Elmendorf tear MD of greater than 7 g/?m, as determined for a film containing the polyolefin composition and having a thickness of about 90 ?m.

Abstract: The present disclosure provides polyolefin compositions and films and method for producing such films. The polyolefin composition contains about 40 wt % to about 95 wt % of a BOCD polyethylene and about 10 wt % to about 60 wt % of a polypropylene, by weight of the polyolefin composition. The polyolefin composition has a 1% secant flexural modulus MID of greater than 250 MPa and a 1% secant flexural modulus TD of greater than 300 MPa, as determined for a layer of the polyolefin composition having a thickness of about 50 ?m and a Dart Impact (Method A) of greater than 15 g/?m and an Elmendorf tear MI) of greater than 7 g/?m, as determined for a film containing the polyolefin composition and having a thickness of about 90 ?m.

Abstract: A low-profile electronically scanned phased arrays integrated multi-beam cylindrical array that can scan by connecting to one feed or multiple feeds at one time.

Abstract: A system on a package (SOP) can include a galvanic isolator. The galvanic isolator can include an input stage configured to transmit an input RF signal in response to receiving an input modulated signal. The galvanic isolator can also include a resonant coupler electrically isolated from the input stage by a dielectric. The resonant coupler can be configured to filter the input RF signal and transmit an output RF signal in response to the input RF signal. The galvanic isolator can further include an output stage electrically isolated from the resonant coupler by the dielectric. The output stage can be configured to provide an output modulated signal in response to receiving the output RF signal.

Abstract: A quadrature voltage controlled oscillator (QVCO). The QVCO includes a first node for providing a first quadrature signal, a second node for providing a second quadrature signal, a third node for providing a third quadrature signal, and a fourth node for providing a fourth quadrature signal. The QVCO further includes a first coil connected between the first node and the second node and a second coil connected between the third node and the fourth node. The first coil and second coil are positively magnetically coupled.

Abstract: A quadrature voltage controlled oscillator (QVCO). The QVCO includes a first node for providing a first quadrature signal, a second node for providing a second quadrature signal, a third node for providing a third quadrature signal, and a fourth node for providing a fourth quadrature signal. The QVCO further includes a first coil connected between the first node and the second node and a second coil connected between the third node and the fourth node. The first coil and second coil are positively magnetically coupled.

Abstract: A voltage controlled oscillator (VCO) for providing an oscillating output signal. The VCO includes a first inductor, and the oscillating output signal is responsive to a changing current through the first inductor. The VCO also includes a second inductor, proximate the first inductor, coupled to a first cross-coupling stage and a third inductor, proximate the first inductor, coupled to a second cross-coupling stage.

Abstract: A system on a package (SOP) can include a galvanic isolator. The galvanic isolator can include an input stage configured to transmit an input RF signal in response to receiving an input modulated signal. The galvanic isolator can also include a resonant coupler electrically isolated from the input stage by a dielectric. The resonant coupler can be configured to filter the input RF signal and transmit an output RF signal in response to the input RF signal. The galvanic isolator can further include an output stage electrically isolated from the resonant coupler by the dielectric. The output stage can be configured to provide an output modulated signal in response to receiving the output RF signal.

Abstract: A system on a package (SOP) can include a galvanic isolator. The galvanic isolator can include an input stage configured to transmit an input RF signal in response to receiving an input modulated signal. The galvanic isolator can also include a resonant coupler electrically isolated from the input stage by a dielectric. The resonant coupler can be configured to filter the input RF signal and transmit an output RF signal in response to the input RF signal. The galvanic isolator can further include an output stage electrically isolated from the resonant coupler by the dielectric. The output stage can be configured to provide an output modulated signal in response to receiving the output RF signal.

Abstract: A quadrature voltage controlled oscillator (QVCO). The QVCO includes a first node for providing a first quadrature signal, a second node for providing a second quadrature signal, a third node for providing a third quadrature signal, and a fourth node for providing a fourth quadrature signal. The QVCO further includes a first coil connected between the first node and the second node and a second coil connected between the third node and the fourth node. The first coil and second coil are positively magnetically coupled.

Abstract: A quadrature voltage controlled oscillator (QVCO) for providing an oscillating output signal. The QVCO includes a first oscillating circuit for producing a first output signal and a second output signal, those signals being a first set of antiphase signals. The QVCO also includes a second oscillating circuit for producing a first output signal and a second output signal, those signals being a second set of antiphase signals. The first oscillating circuit also has injection circuitry for injecting the second set of antiphase signals without a DC bias into the first output signal and the second output signal, and the second oscillating circuit also has injection circuitry for injecting the first set of antiphase signals without a DC bias into the third output signal and the fourth output signal.

Abstract: An apparatus is provided. Transmission line cells are formed in a first region. A first metallization layer is formed over the transmission line cells within a portion of the first region. At least a portion of the first metallization layer is electrically coupled to the plurality of transmission line cells. A second metallization layer is formed over the first metallization layer with an interconnect portion, and overlay portion, and a first balun. The interconnect portion at least partially extends into the first region, and the overlay portion is within the first region. The first balun winding is electrically coupled to the overlay portion and partially extends into a second region. The first region partially surrounds the second region. A third metallization layer is formed over the second metallization layer having a second balun winding within the second region, where the second winding is generally coaxial with the first balun winding.

Abstract: An apparatus is provided. First and second hybrid couplers are provided with each having a first port, a second port, a third port, a fourth port and with each being substantially curvilinear. The fourth ports of the first and second hybrid couplers are first and second isolation port that are mutually coupled. The first port of the first hybrid coupler is configured to carry a first portion of a differential signal, and the first port of the second hybrid coupler is configured to carry a second portion of the differential signal.

Abstract: A method is provided. An initial bit sequence is received by a receiver. A local oscillator is locked initially to a local reference and subsequently to the received signal using the initial bit sequence, and automatic gain control (AGC) is performed once the local oscillator is locked to the local reference. A Costas loop is then activated so as to achieve carrier frequency offset (CFO) lock, and sign inversion is detected. The receiver then synchronized with an end-of-training pattern.

Abstract: An apparatus is provided. A differential pair of transistors is configured to receive a first differential signal having a first frequency, and a transformer, having a primary side and a secondary side is provided. The primary side of the transformer is coupled to the differential pair of transistors, and the secondary side of the transformer is configured to output a second differential signal having a second frequency, where the second frequency is greater than the first frequency. A first transistor is coupled to the first supply rail, the primary side of the transformer, and the differential pair of transistors, where the first transistor is of a first conduction type. A second transistor is coupled to the second supply rail, the primary side of the transformer, and the differential pair of transistors, where the second transistor is of a second conduction type.

Abstract: An apparatus is provided. A differential pair of transistors is configured to receive a first differential signal having a first frequency, and a transformer, having a primary side and a secondary side is provided. The primary side of the transformer is coupled to the differential pair of transistors, and the secondary side of the transformer is configured to output a second differential signal having a second frequency, where the second frequency is greater than the first frequency. A first transistor is coupled to the first supply rail, the primary side of the transformer, and the differential pair of transistors, where the first transistor is of a first conduction type. A second transistor is coupled to the second supply rail, the primary side of the transformer, and the differential pair of transistors, where the second transistor is of a second conduction type.

Abstract: An apparatus is provided. Transmission line cells are formed in a first region. A first metallization layer is formed over the transmission line cells within a portion of the first region. At least a portion of the first metallization layer is electrically coupled to the plurality of transmission line cells. A second metallization layer is formed over the first metallization layer with an interconnect portion, and overlay portion, and a first balun. The interconnect portion at least partially extends into the first region, and the overlay portion is within the first region. The first balun winding is electrically coupled to the overlay portion and partially extends into a second region. The first region partially surrounds the second region. A third metallization layer is formed over the second metallization layer having a second balun winding within the second region, where the second winding is generally coaxial with the first balun winding.

Abstract: The specification discloses a method for forming a packaging film. According to the method, a packaging film base layer is provided having a first side and a second side and formed from polymeric materials. At least one additional layer of polymeric material is extrusion coated onto the first side of the base layer. A heat sealable layer is applied onto the second side of the base layer. The method also includes providing a packaging film outer layer having a first side and a second side and formed from polymeric materials. At least one of the outer layer first and second sides is capable of being printed thereon and selected packaging information is printed onto at least one side of the outer layer. Preferably, the outer layer is reverse printed on its second side. Finally, the method includes thermally laminating the base layer and outer layer to one another using a combination of heat and pressure. A packaging film and a method for packaging food products with the film are also disclosed.

Abstract: The specification discloses a method for forming a packaging film. According to the method, a packaging film base layer is provided having a first side and a second side and formed from polymeric materials. At least one additional layer of polymeric material is extrusion coated onto the first side of the base layer. A heat sealable layer is applied onto the second side of the base layer. The method also includes providing a packaging film outer layer having a first side and a second side and formed from polymeric materials. At least one of the outer layer first and second sides is capable of being printed thereon and selected packaging information is printed onto at least one side of the outer layer. Preferably, the outer layer is reverse printed on its second side. Finally, the method includes thermally laminating the base layer and outer layer to one another using a combination of heat and pressure. A packaging film and a method for packaging food products with the film are also disclosed.

Abstract: A phase interpolation system includes an input stage that provides first and second modulated input signals having selected first and second relative phase angles. A weighting system is configured to steer a first portion of the first modulated input signal to an output and a second portion of the first modulated input signal to an internal balancing node. The weighting system also is configured to steer a first portion of the second modulated input signal to the output and a second portion of the second modulated input signal to the balancing node. The first portion of the first and second modulated input signals are summed at the output to provide an interpolated output signal having a phase angle that is between the first and second phase angles.