Patents by Inventor Bradley A. Olmstead

Bradley A. Olmstead has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Optimization and integration of thermal and structural analyses
    Patent number: 10466187
    Abstract: Example systems and methods to optimize and integrate of thermal and structural analyses are described herein. An example method includes performing a thermal analysis of a component using a first mesh representing the component to produce a thermal distribution across the component. The first mesh has first nodes based on a first element size. The example method includes using a first mapping file to assign temperature values to second nodes of a second mesh representing the component based on the thermal distribution. The second nodes are based on a second element size different than the first element size. The example method also includes performing a structural analysis of the component using the second mesh and the assigned temperature values to produce gauge sizes for the component and using a second mapping file to assign gauge values to the first nodes of the first mesh based on the gauge sizes.
    Type: Grant
    Filed: June 10, 2015
    Date of Patent: November 5, 2019
    Assignee: THE BOEING COMPANY
    Inventors: Omid B. Nakhjavani, Mohammad Ali Heidari, Milan Stefanovic, Bradley A. Olmstead, Eric John Zimney, Naveena Mallikarjunaiah
  • OPTIMIZATION AND INTEGRATION OF THERMAL AND STRUCTURAL ANALYSES
    Publication number: 20160363546
    Abstract: Example systems and methods to optimize and integrate of thermal and structural analyses are described herein. An example method includes performing a thermal analysis of a component using a first mesh representing the component to produce a thermal distribution across the component. The first mesh has first nodes based on a first element size. The example method includes using a first mapping file to assign temperature values to second nodes of a second mesh representing the component based on the thermal distribution. The second nodes are based on a second element size different than the first element size. The example method also includes performing a structural analysis of the component using the second mesh and the assigned temperature values to produce gauge sizes for the component and using a second mapping file to assign gauge values to the first nodes of the first mesh based on the gauge sizes.
    Type: Application
    Filed: June 10, 2015
    Publication date: December 15, 2016
    Inventors: Omid B. Nakhjavani, Mohammad Ali Heidari, Milan Stefanovic, Bradley A. Olmstead, Eric John Zimney, Naveena Mallikarjunaiah