Patents by Inventor Bradley Clements

Bradley Clements has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060120799
    Abstract: A door, window, crown and baseboard molding system with hidden fasteners and pre-formed corner receptacles and couplers. The outer face of a molding piece includes at least one elongated kerf or groove along its length. The width of the groove is sufficient to accommodate the head of a nail or screw fastener. With the molding piece properly aligned against a wall, fasteners are successively located in spaced relation within the groove and driven into the wall. With the heads of the fasteners recessed within the groove, the groove is filled with a piece of material or injected caulking. Pre-formed corner receptacles may be employed where the molding encounters inside and outside corners. The couplers are used to join two lineal pieces of molding or as decorative accents along the molding. Receptacles and couplers include end recesses sized and configured to accommodate and cover the end of a piece of molding.
    Type: Application
    Filed: January 20, 2006
    Publication date: June 8, 2006
    Inventors: Rodney Clements, Bradley Clements
  • Publication number: 20060087014
    Abstract: Systems, methodologies, methods of manufacture, and other embodiments associated with semiconductor/processor module assemblies are described. One exemplary system embodiment includes a bolster plate assembly for a semiconductor module assembly that includes a bolster plate and a leaf spring pre-loaded onto the bolster plate. The example system may also include the leaf spring being releasably attached to the bolster plate and positioned to provide a force in a direction generally away from the bolster plate. The leaf spring can be configured to release from the bolster plate upon attaching the semiconductor module assembly to the bolster plate that causes the leaf spring to exert the force in the direction generally away from the bolster plate and against a semiconductor module assembly.
    Type: Application
    Filed: October 25, 2004
    Publication date: April 27, 2006
    Inventors: Brandon Rubenstein, Andrew Delano, Bradley Clements
  • Patent number: 7021895
    Abstract: Disclosed is a fan module. In one embodiment, the fan module includes a fan having an inlet end and an exit end, and a fan housing in which the fan is positioned, the fan housing including at least one angled interior wall adjacent the exit end of the fan that diffuses air downstream of the fan.
    Type: Grant
    Filed: November 13, 2002
    Date of Patent: April 4, 2006
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Brandon Rubenstein, Bradley Clements
  • Publication number: 20040091355
    Abstract: Disclosed is a fan module. In one embodiment, the fan module includes a fan having an inlet end and an exit end, and a fan housing in which the fan is positioned, the fan housing including at least one angled interior wall adjacent the exit end of the fan that diffuses air downstream of the fan.
    Type: Application
    Filed: November 13, 2002
    Publication date: May 13, 2004
    Inventors: Brandon Rubenstein, Bradley Clements