Abstract: A self-adhering roofing membrane may include a polymeric membrane. The roofing membrane may include a first adhesive layer disposed on a major surface of the polymeric membrane. The first adhesive layer may include one or both of a hot melt adhesive and a butyl rubber-based adhesive. The roofing membrane may include a UV curable adhesive layer disposed on the first adhesive layer. The UV curable adhesive layer may have a thickness of less than about 4 mils.

Abstract: A self-adhering roofing membrane may include a polymeric membrane. The roofing membrane may include a first adhesive layer disposed on a major surface of the polymeric membrane. The first adhesive layer may include one or both of a hot melt adhesive and a butyl rubber-based adhesive. The roofing membrane may include a UV curable adhesive layer disposed on the first adhesive layer. The UV curable adhesive layer may have a thickness of less than about 4 mils.

Abstract: A self-adhering roofing membrane may include a polymeric membrane. The roofing membrane may include a first adhesive layer disposed on a major surface of the polymeric membrane. The first adhesive layer may include one or both of a hot melt adhesive and a butyl rubber-based adhesive. The roofing membrane may include a UV curable adhesive layer disposed on the first adhesive layer. The UV curable adhesive layer may have a thickness of less than about 4 mils.

Abstract: Photovoltaic devices that include a transparent substrate; a plurality of thin film layers defining a plurality of photovoltaic cells connected in series to each other on the transparent substrate; a first lead connected to one of the photovoltaic cells; and an encapsulation substrate on the plurality of thin film layers are provided. The encapsulation substrate defines a connection aperture through which the first lead extends. A support insert, which defines a plug portion and a flange, can be positioned within the connection aperture such that the flange extends over the back surface of the encapsulation substrate. The support insert can be configured to mechanically support the transparent substrate in an area opposite to the connection aperture while still enabling the first lead to extend through the connection aperture while the support insert is in place within the connection aperture.

Abstract: Photovoltaic devices are provided that include: a transparent substrate; a plurality of thin film layers on the glass substrate; and, a first lead connected to one of the photovoltaic cells. An encapsulation substrate is positioned on the plurality of thin film layers, and defines a connection aperture through which the first lead extends. The connection aperture has a perimeter defined by an aperture wall of the encapsulation substrate. A support insert is positioned within the connection aperture to mechanically support the transparent substrate in the area of the connection aperture. The support insert is configured such that the first lead is able to extend through the connection aperture while the support insert in place within the connection aperture. A kit is also provided that includes an encapsulation substrate defining a connection aperture; and, a support insert configured to be coupled within the connection aperture of the encapsulation substrate.

Abstract: Photovoltaic devices are provided that include: a transparent substrate; a plurality of thin film layers on the glass substrate; and, a first lead connected to one of the photovoltaic cells. An encapsulation substrate can be positioned on the plurality of thin film layers, and defines a connection aperture through which the first lead extends. The connection aperture generally has a perimeter defined by an aperture wall of the encapsulation substrate. An adhesive plug can be positioned within the connection aperture to mechanically support the transparent substrate in the area of the connection aperture. A back plate or back washer can also be bonded to the adhesive plug and/or back surface of the encapsulation substrate to help dissipate energy in and/or provide support to the encapsulation substrate. Methods are also provided for mechanically supporting a transparent substrate in an area opposite to a connection aperture defined in an encapsulation substrate.

Abstract: Methods are generally provided for adhering a support insert within a connection aperture defined in an encapsulating substrate of a photovoltaic device that has a first lead. The connection aperture generally has a perimeter defined by an aperture wall of the encapsulating substrate. The method can, in one particular embodiment, include threading the first lead through the connection aperture; and positioning a support insert within the connection aperture such that the first lead is still able to extend through the connection aperture. The support insert can generally define a channel within its construction that extends from a channel opening in the support insert to an exit port. An adhesive composition can be injected into the channel opening such that a first amount of the adhesive composition flows through the channel and out of the exit port to bond the support insert within the connection aperture.