Patents by Inventor Bradley D. Chung

Bradley D. Chung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11110450
    Abstract: A sample-reagent mixture is thermal cycled through a plurality of cycles. Each thermal cycle includes actuating a heater to heat the sample-reagent mixtures; and dispensing a fluid onto the sample-reagent mixture to cool the sample reagent mixture.
    Type: Grant
    Filed: January 29, 2016
    Date of Patent: September 7, 2021
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Bradley D. Chung, Alexander N. Govyadinov
  • Publication number: 20210129525
    Abstract: In some examples, printing device temperature management may include ascertaining a print speed associated with a print job, and comparing the print speed to a print speed threshold. Printing device temperature management may further include actuating a power supply associated with a print bar at a start position of physical medium to be utilized for printing for the print job, or at or beyond a specified location along a path associated with traversal of the physical medium from the start position to a print zone to reduce an operational temperature associated with the print bar.
    Type: Application
    Filed: January 27, 2017
    Publication date: May 6, 2021
    Inventors: Huy Le, Bradley D Chung, Thomas P Abadilla, Jeffrey K Pew
  • Patent number: 10994530
    Abstract: In some examples, printing device temperature management may include ascertaining a print speed associated with a print job, and comparing the print speed to a print speed threshold. Printing device temperature management may further include actuating a power supply associated with a print bar at a start position of physical medium to be utilized for printing for the print job, or at or beyond a specified location along a path associated with traversal of the physical medium from the start position to a print zone to reduce an operational temperature associated with the print bar.
    Type: Grant
    Filed: January 27, 2017
    Date of Patent: May 4, 2021
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Huy Le, Bradley D Chung, Thomas P Abadilla, Jeffrey K Pew
  • Publication number: 20190389206
    Abstract: A process for servicing and maintaining nozzles of a print head may comprise determining an idle time of a nozzle. The determined nozzle idle time may be used as part of printing fluid drop ejection.
    Type: Application
    Filed: March 23, 2017
    Publication date: December 26, 2019
    Inventors: Bradley D Chung, David E De Bellis, Lisa A Underwood
  • Patent number: 10166770
    Abstract: A heating device along a slot of a print head is selectively actuated to form temperature gradients within fluid along the slot to facilitate convective fluid flow within and along the slot.
    Type: Grant
    Filed: July 31, 2015
    Date of Patent: January 1, 2019
    Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Bradley D. Chung, R. William Grobman, Daniel B. Brown
  • Publication number: 20180229230
    Abstract: A sample-reagent mixture is thermal cycled through a plurality of cycles. Each thermal cycle includes actuating a heater to heat the sample-reagent mixtures; and dispensing a fluid onto the sample-reagent mixture to cool the sample reagent mixture.
    Type: Application
    Filed: January 29, 2016
    Publication date: August 16, 2018
    Inventors: Bradley D. Chung, Alexander N. Govyadinov
  • Publication number: 20180065362
    Abstract: A heating device along a slot of a print head is selectively actuated to form temperature gradients within fluid along the slot to facilitate convective fluid flow within and along the slot.
    Type: Application
    Filed: July 31, 2015
    Publication date: March 8, 2018
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Bradley D. CHUNG, R. William GROBMAN, Daniel B. BROWN
  • Patent number: 9815282
    Abstract: A fluid ejection structure can include thermal resistors, a substrate, layers on the substrate, wherein said layers can include a region proximate to the resistor that has reduced field oxide.
    Type: Grant
    Filed: June 30, 2014
    Date of Patent: November 14, 2017
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Bradley D. Chung, Galen P. Cook, Michael H. Hayes, Adam L. Ghozeil, Chantelle Elizabeth Domingue, Valerie J. Marty, Anthony M. Fuller, Sterling Chaffins
  • Patent number: 9782978
    Abstract: A printer includes a printbar having plural dice partially overlap in the direction of rows and a halftoner. The dice receive nozzle firing data which determines when and where the individual print nozzles are to be operated in order to emit the colorant onto the media so as to form the desired printed image on a media. The halftoner is a bidirectional error diffusion halftoner that is structured to generate halftoned data. The halftoned data is mappable into the firing data. The halftoner includes a serpentine direction reverser which is structured to halftone print data image pixels in a first serpentine direction to form halftoned data and then to halftone print data image pixels in an opposite serpentine direction to form the halftoned data.
    Type: Grant
    Filed: May 29, 2014
    Date of Patent: October 10, 2017
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Bradley D Chung, Hsue-Yang Liu, Matthew A Shepherd, Mark H MacKenzie, Jason M Quintana
  • Publication number: 20170151808
    Abstract: Bidirectional error diffusion halftoning of data. Pixels are halftoned in one serpentine direction, and pixels are halftoned in an opposite serpentine direction.
    Type: Application
    Filed: May 29, 2014
    Publication date: June 1, 2017
    Inventors: Bradley D Chung, Hsue-Yang Liu, Matthew A Shepherd, Mark H Mackenzie, Jason M Quintana
  • Publication number: 20170106651
    Abstract: A fluid ejection structure can include thermal resistors, a substrate, layers on the substrate, wherein said layers can include a region proximate to the resistor that has reduced field oxide.
    Type: Application
    Filed: June 30, 2014
    Publication date: April 20, 2017
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Bradley D. Chung, Galen P. Cook, Michael H. Hayes, Adam L. Ghozeil, Chantelle Elizabeth Domingue, Valerie J. Marty, Anthony M. Fuller, Sterling Chaffins
  • Patent number: 9511587
    Abstract: A method and apparatus provide a resistor electrically connected to an electrically conductive trace.
    Type: Grant
    Filed: October 14, 2011
    Date of Patent: December 6, 2016
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Galen P. Cook, Bradley D. Chung
  • Patent number: 9289987
    Abstract: An exemplary embodiment of the present invention provides for a fluid ejection device. The fluid ejection device includes a substrate, a conductive layer, a resistive layer, and at least one upper layer. The conductive layer is disposed on the substrate and an outer perimeter and an inner region thinner than the outer perimeter. The outer perimeter includes conductive elements spaced apart from one another. The resistive layer includes an outer resistive portion overlying the conductive elements and a central resistive portion lying on top of a raised bridge of the substrate, wherein the width of the raised bridge is substantially greater than the width of the central resistive portion. The at least one upper layer defines a boundary of a fluid chamber, and the boundary is aligned vertically above a border of the central resistive portion.
    Type: Grant
    Filed: October 31, 2012
    Date of Patent: March 22, 2016
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Galen P. Cook, Bradley D. Chung, Anthony M. Fuller
  • Publication number: 20150266293
    Abstract: An exemplary embodiment of the present invention provides for a fluid ejection device. The fluid ejection device includes a substrate, a conductive layer, a resistive layer, and at least one upper layer. The conductive layer is disposed on the substrate and an outer perimeter and an inner region thinner than the outer perimeter. The outer perimeter includes conductive elements spaced apart from one another. The resistive layer includes an outer resistive portion overlying the conductive elements and a central resistive portion lying on top of a raised bridge of the substrate, wherein the width of the raised bridge is substantially greater than the width of the central resistive portion. The at least one upper layer defines a boundary of a fluid chamber, and the boundary is aligned vertically above a border of the central resistive portion.
    Type: Application
    Filed: October 31, 2012
    Publication date: September 24, 2015
    Inventors: Galen P. Cook, Bradley D. Chung, Anthony M. Fuller
  • Publication number: 20140224786
    Abstract: A method and apparatus provide a resistor electrically connected to an electrically conductive trace.
    Type: Application
    Filed: October 14, 2011
    Publication date: August 14, 2014
    Inventors: Galen P. Cook, Bradley D. Chung
  • Patent number: 8733893
    Abstract: A printhead comprises a first member and a second member, formed separately from the first member. The second member is nested within a first space defined by the first member. A plurality of fluidic transmission channels is formed between the first and second members to convey ink to an outer surface of the first and second members.
    Type: Grant
    Filed: July 29, 2011
    Date of Patent: May 27, 2014
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Alan R. Arthur, Bradley D. Chung
  • Patent number: 8733902
    Abstract: A print head (24, 224, 424, 624) includes a layer (36, 236) which at least partially forms firing chambers (42, 242) and ribs (46, 246, 646) in contact with opposing side walls of a fluid feed slot (40, 240) while extending from a first side wall to a second opposite side wall within the fluid feed slot (40, 240).
    Type: Grant
    Filed: May 6, 2008
    Date of Patent: May 27, 2014
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Bradley D. Chung, Manish Giri, Emmet Whittaker, Sean P McClelland, Andrew Phillips, Benjamin Clark
  • Patent number: 8708461
    Abstract: A thermal resistor fluid ejection assembly includes an insulating substrate and first and second electrodes formed on the substrate. A plurality of individual resistor elements of varying widths are arranged in parallel on the substrate and electrically coupled at a first end to the first electrode and at a second end to the second electrode.
    Type: Grant
    Filed: July 23, 2010
    Date of Patent: April 29, 2014
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Bradley D. Chung, Galen P. Cook, Daniel Fradl
  • Patent number: 8574823
    Abstract: Various methods and apparatus relating to a multi-level layer are disclosed.
    Type: Grant
    Filed: October 5, 2005
    Date of Patent: November 5, 2013
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Bradley D. Chung, Alan T. Davis, Colin C. Davis, Mohammed S. Shaarawi, Jeremy H. Donaldson, Joe E. Stout
  • Publication number: 20130083131
    Abstract: A thermal resistor fluid ejection assembly includes an insulating substrate and first and second electrodes formed on the substrate. A plurality of individual resistor elements of varying widths are arranged in parallel on the substrate and electrically coupled at a first end to the first electrode and at a second end to the second electrode.
    Type: Application
    Filed: July 23, 2010
    Publication date: April 4, 2013
    Inventors: Bradley D. Chung, Galen P. Cook, Daniel Fradl